About the Book:

There are many benefits to using the BGA package; however its greatest asset - the ability to provide an extremely dense array of thousands of pins - also turns out to be a tremendous problem for PCB designers. The BGA density and pin count continues to increase; yet, our ability to effectively design with these devices has not kept pace. Fortunately, significant advancements in PCB fabrication technology have enabled further miniaturization in the manufacturing process. These improvements, along with new software and design methods specifically for BGAs provide a means to successfully design using these devices. This book explores the impact of dense BGAs with high pin-count on PCB design and provides solutions for inherent design challenges.

Click for Sneak Peek!The 2nd edition of this book includes more techniques for fanouts, more graphics and depth to better describe the methods. It also includes a chapter that describes the new automatic fanout generation software that applies the regional fanout patterns described in the book. This software is now available in Expedition PCB version 2007.3.

CLICK HERE for sneak peek!

Table of Contents

  • Chapter One - Introduction
  • Chapter Two - BGA Packages
  • Chapter Three - HDI Layer Stackups
  • Chapter Four - Fanout Patterns
  • Chapter Five - Layer Biased Breakouts
  • Chapter Six - 0.8mm Pin-Pitch BGA Tests
  • Chapter Seven - Software for Generating BGA Fanouts
  • Conclusion
About the Author

Charles Pfeil is an Engineering Director at Mentor Graphics, System Design Division. Charles has been in the PCB industry for over 40 years as a designer, owner of a service bureau, and has also worked in marketing and / or engineering management at Racal, ASI, Cadence, PADS, and VeriBest.

His accomplishments at Mentor Graphics include:

  • Inventor of Mentor Graphics' Xtreme Design Technology (XtremePCB and XtremeAR)
  • Inventor of Mentor Graphics' TeamPCB
  • Original product architect for Expedition PCB
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