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D Coupon Testing and Data Insights With GreenSource Fabrication

04/17/2024 | Marcy LaRont, PCB007 Magazine
Marcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.

Real Time with... IPC APEX EXPO 2024: Exploring Silicone Solutions with R&D Director of CHT

04/17/2024 | Real Time with...IPC APEX EXPO
In this interview, Gerry Ellis, the R&D director for CHT, discusses the product range offered by his company. He explains the challenges in creating base formulations, the drive to make products more user-friendly, and the various application techniques involved. Ellis also highlights the key market segments and the significance of providing efficient solutions to customers.

The World of Electronics and Standards: A Conversation with Frank Honyotski, STI

04/03/2024 | Marcy LaRont, PCB007 Magazine
Marcy LaRont of I-Connect007 speaks with Frank Honyotski of STI Electronics, who discusses the services offered by STI, including training, engineering, and failure analysis. He highlights his involvement with IPC standards development and emphasizes the importance of industry professionals engaging in standards development.

Demand Rebounds, Global LED Industry Revenue Expected to Grow 3% in 2024 with Market Focus on Automotive Displays

04/01/2024 | TrendForce
TrendForce’s latest LED industry report indicates that the global market is set to recover in 2024, with estimated revenues reaching US$13 billion—marking a YoY growth of 3%.

Orbex Secures Patent for 'Petal Fold' Reusable Rocket Technology

03/29/2024 | Orbex
Orbex has successfully patented its REFLIGHT reusable rocket technology following patent approval in several European markets, based on the patent grant by the European Patent Office, as well as in the United States.
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