2017 iNEMI Roadmap Looks to the Future of Electronics Manufacturing
June 30, 2017 | iNEMIEstimated reading time: 3 minutes
The 2017 Roadmap from the International Electronics Manufacturing Initiative (iNEMI) is now on sale on the iNEMI website. With 28 chapters (the most ever published by iNEMI) and 2,300+ pages, this latest edition of the roadmap provides a comprehensive view of the electronics manufacturing supply chain’s technology needs and challenges over the next 10 years.
Seven chapters anticipate the technology needs of key market segments by focusing on the market demands and functionality requirements of the following sectors: automotive, aerospace and defense, consumer and office systems, high-end systems, Internet of Things (IOT), medical, and portable and wireless.
The remaining 21 chapters identify technology trends, focusing on the key technology capabilities and developments anticipated and required within the electronics manufacturing supply chain to meet product needs over a 10-year horizon.
The 2017 Roadmap features a new chapter on IOT, which highlights the challenges in new market applications. In addition, the Aerospace & Defense, Packaging & Component Substrates, and Test, Inspection & Measurement chapters are once again included (these were last published in 2013).
“This is our most ambitious roadmap to date, providing in-depth information about the broadest range of topics that we’ve ever covered,” said Bill Bader, CEO of iNEMI. “It is an important tool for helping manufacturing supply chain companies anticipate the evolution of technologies and growth of markets, so that they can pursue solutions that will have the greatest return. And, in light of the demise of other industry roadmaps, the iNEMI Roadmap is that much more important for keeping abreast of industry trends and needs for the future.”
Technology Trends
The 2017 iNEMI Roadmap highlights several key technology trends impacting electronic manufacturing and its supply chain, including:
- Growing data volume — along with secure and swift transfer, and the ability to analyze it intelligently — will be a key industry focus.
- Security and interoperability of data, devices and users are two immediate “grand challenges” for the industry and its markets.
- Commercialization of services, particularly software-enabled and cloud-based services, will continue to expand.
- Emergence of new computing architectures in the high-end segment to address the complex tasks.
- Deployment of IOT capabilities beyond consumer markets into automotive, medical and industrial applications will drive major changes in global manufacturing and end use.
- Transition from the beginning-of-the-century vision for products completely enabled by printed electronics to products enabled by “flexible hybrid electronics” where traditional low-profile electronic components are integrated with printed components and flexible substrates.
- Autonomous driving technologies are affecting several technologies – such as sensors.
- Growth of perceptual and location aware computing and connectivity will continue the drive for heterogeneous system integration.
- The need to ensure supply chain integrity and efficiency will drive changes in existing business and manufacturing models.
- Increasing product traceability requirements from silicon to end user.
The roadmap is a global collaborative effort that involves many individuals who are leading experts in their respective fields and represent many perspectives on the electronics manufacturing supply chain. More than 500 individuals from at least 22 countries, and representing more than 350 corporations, consortia, government agencies and universities came together to create the 2017 Roadmap.
Purchase the Roadmap
The complete roadmap is available on the iNEMI website for $3,500 (U.S.), and individual chapters can be downloaded for $500 each. Special pricing is available for universities, government agencies, research laboratories, associations/consortia and other non-profits.
About iNEMI
The International Electronics Manufacturing Initiative’s mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future. This industry-led consortium is made up of more than 90 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. iNEMI is based in Herndon, Virginia (near Washington, D.C.), with regional offices in Asia (Shanghai and Tokyo) and Europe (Limerick and the London area).
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).
Boeing's Janene Stinson Earns IPC Excellence in Education Award at IPC APEX EXPO 2024
04/22/2024 | IPCThe IPC Excellence in Education award was presented to Janene Stinson, Boeing, at IPC APEX EXPO 2024 in Anaheim, California, in recognition of her significant contributions to workforce development and leadership.