CyberOptics Demonstrates Advanced Airborne Particle Sensing Technology at SEMICON West
May 24, 2018 | CyberOptics CorporationEstimated reading time: 2 minutes
CyberOptics Corporation announces plans to exhibit at SEMICON West, scheduled to take place July 10-12, 2018 at the Moscone Center in San Francisco, California. The company will demonstrate its next-generation Airborne Particle Sensor (APS3) 300mm with new ParticleSpectrum software in Booth #6163.
CyberOptics’ WaferSense APS3 speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly detecting, identifying and monitoring airborne particles in real-time. With a thinner and lighter form factor to travel through semiconductor tools with ease, the APS3 offers leading accuracy and sensitivity valued by equipment and process engineers around the world.
The APS3 solution includes ParticleSpectrum software – a completely new, touch-enabled interface with user-friendly functionality, making it simple to read, record and review small to large airborne particle data. Easily identify when and where the particles originate and see the effects of cleanings, adjustments and repairs in real-time.
“We’ve taken what is documented as the best known method (BKM) for airborne particle sensing in semiconductor fabs to significantly improve yields and tool uptime, and made it even easier to use,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “Engineers can monitor critical data from one, or multiple devices with an enhanced software application.”
CyberOptics’ Airborne Particle Sensors (APS) have proven to deliver up to 90% time savings, 95% expense reduction and up to 20X the throughput with half the manpower relative to legacy surface scan wafer methods.
Additionally, CyberOptics will display the new PanelSense™ Airborne Particle Sensor (APS-FPD) delivering the same valued benefits as the APS3, but designed specifically for the Flat Panel Display manufacturing market.
About the WaferSense, ReticleSense® and PanelSense Line
The WaferSense and ReticleSense measurement portfolio including the Auto Leveling System (ALS & ALSR), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensors (APS 2, 3, APSR & APSRQ) and the new Auto Multi Sensor (AMS & AMSR), are available in various wafer shaped and reticle shaped form factors depending on the device. The PanelSense measurement portfolio including the Airborne Particle Sensor (APS-FPD) is available in a flat panel display compatible form factor.
About CyberOptics
CyberOptics Corporation is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics sensors are being used in general purpose metrology and 3D scanning, surface mount technology (SMT) and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of its key vertical segments. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.
For more information about the entire line of CyberOptics solutions, click here.
Suggested Items
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
Lockheed Martin Successfully Transitions Long Range Discrimination Radar To The Missile Defense Agency
04/23/2024 | Lockheed MartinThe Long Range Discrimination Radar (LRDR) at Clear Space Force Station in Clear, Alaska, completed DD250 final acceptance and was officially handed over to the Missile Defense Agency in preparation for an Operational Capability Baseline (OCB) decision and final transition to the Warfighter. In addition, prior to this transition, the system has started Space Domain Awareness data collects for the United States Space Force.