RTW IPC APEX EXPO 2019: Ventec's Goodwin on Global Technology Directions


Reading time ( words)

Mark Goodwin, Ventec International Group CEO EMEA and USA, speaks with I-Connect007 Technical Editor Pete Starkey on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.

To watch the interview, click here.

Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates

Share

Print


Suggested Items

Institute of Circuit Technology Harrogate Christmas Seminar 2018

01/02/2019 | Pete Starkey, I-Connect007
The Institute of Circuit Technology returned to the fading Victorian splendour of the palatial and stately Majestic Hotel in the North Yorkshire town of Harrogate for its 2018 Christmas seminar, an intense programme of five excellent technical presentations, impeccably organised and moderated by Technical Director Bill Wilkie and generously supported by GSPK Circuits.

Innovative PCB Processes are Lean and Green

11/29/2018 | Happy Holden, I-Connect007
Not much has changed in printed circuit multilayer manufacturing in the last 50 years except that the equipment is more mechanized and streamlined, the processes much more stable, and high-volume PCB manufacturing has moved to China.

Defense Speak Interpreted: Defense Electronic Supply Chain Issues

10/09/2018 | Dennis Fritz, Fritz Consulting
On October 5, 2018, the Department of Defense (DoD) highlighted issues with the release of the 146-page report “Assessing and Strengthening the Manufacturing and Defense Industrial Base and Supply Chain Resiliency of the United States” from President Donald J. Trump.



Copyright © 2019 I-Connect007. All rights reserved.