-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
New Henkel Loctite Underfill Material Available Now from Ellsworth Adhesives Europe
February 19, 2019 | Ellsworth AdhesivesEstimated reading time: 2 minutes
The newly launched Henkel Loctite ECCOBOND UF 1173 is now available to order from Ellsworth Adhesives Europe, adding to the supplier’s impressive range of specialty chemicals.
This one component, epoxy underfill has been created for the next-generation of high reliability electronics applications. It is designed to provide a uniform and void-free encapsulating underfill, which maximises a device’s temperature cycling capability and dissipates stress away from solder joints and connections.
Loctite ECCOBOND UF 1173 is fast curing and provides essential interconnect protection from shock, drop and vibration. It can be jet or needle dispensed and is fast flowing in and around tight spaces. Furthermore, the innovative encapsulant has a low coefficient of thermal expansion and exhibits high glass transition (Tg) temperature capability of 155°C. Once applied, it boosts mechanical strength and provides robust environmental protection.
Henkel’s new underfill system offers high performance in electronic applications for the aerospace and automotive sectors. The increasing use of fine-pitch array devices such as chip scale packages (CSP) and ball grid arrays (BGA) in these areas mean that interconnect protection is essential for long-term durability and performance. ECCOBOND UF 1173 can withstand the high operating temperatures which exist within smaller, higher-functioning devices whilst maintaining a high level of performance and processing.
Manufactured with health and safety as a key focus, ECCOBOND UF 1173 does not contain any reportable REACH SVCHCs (as of June 2018), and is not CMR classified.
About Ellsworth Adhesives Europe
Ellsworth Adhesives Europe is a distributor of adhesives, specialty chemicals and adhesive dispensing equipment.
From epoxy adhesives and potting systems, to conformal coatings and surface preparation products, Ellsworth Adhesives has a material to suit every application. Alongside adhesive materials, we also supply a wide range of manual and automated adhesive dispensing equipment including tips, cartridges and static mixers as well as dispensers and dispensing robots.
At Ellsworth Adhesives Europe we recognise that our customers have different needs. We cater to customers who already know the exact products they want and will supply them with a quick and efficient turnaround, yet we also cater for customers requiring a more technical, in depth service.
Whether you are working on a new or existing application and are wondering which solution will benefit your specific end product the most, our expert sales team can help! With our excellent technical knowledge, we can analyse your end product and process requirements and recommend the material and dispensing system that will work best.
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.