-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Nano Dimension 3D Prints Side-Mounting Tech onto PCBs
April 1, 2019 | Globe NewswireEstimated reading time: 1 minute
Nano Dimension Ltd. has launched the world’s first side mounting technology for additively manufactured printed circuit boards (PCBs). With Nano Dimension’s DragonFly Precision Additive Manufacturing System, the novel technology can print and solder components to the top, bottom and sides of the PCB, resulting in as much as a 50% increase in board space when compared with traditionally manufactured PCBs.
The extra space afforded through side mounting allows design engineers to pack more functionality on the circuit board, which is particularly relevant for IoT and Industry 4.0 where customized designs and shapes are a growing demand.
“For applications like the IoT where innovation is paramount, creating new electronic products in shapes and sizes that were never before possible is liberating for design engineers,” said Amit Dror, CEO of Nano Dimension. “Because of this added real estate, more functionality can be generated from sides of the board that can also be used to connect with additional boards.”
Another important enablement of side mounting is the ability to create a specialized PCB that plugs into a socket mounted on a mother board. By printing this board and inserting it into the cavity of a second board, users can rapidly customize applications based on a generic mother board.
Side mounting is ideal for applications such as modular antennas, creating non-standard packaging and innovative IoT applications. Future potential applications and benefits of Nano Dimension’s side mounting technology include printing a horizontal ground layer on the Z-axis, enabling the DragonFly Pro to produce higher performance antennas or multiple antennas with varying voltages within the board. This not only saves space but also creates limitless design possibilities.
About Nano Dimension Ltd.
Nano Dimension is a leading electronics provider that is disrupting, reshaping, and defining the future of how cognitive connected products are made. With its unique 3D printing technologies, Nano Dimension is targeting the growing demand for electronic devices that require increasingly sophisticated features. Demand for circuitry including PCBs, which are the heart of every electronic device, covers a diverse range of industries, including consumer electronics, medical devices, defense, aerospace, automotive, IoT and telecom. These sectors can all benefit greatly from Nano Dimension’s products and services for rapid prototyping and short-run manufacturing.
Suggested Items
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.