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Happy’s Tech Talk #27: Integrated Mesh Power System (IMPS) for PCBs

04/08/2024 | Happy Holden -- Column: Happy’s Tech Talk
A significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12, and more to only two layers. Besides reducing direct processing steps, the yield will increase as defect-producing operations are eliminated. The integrated mesh power system (IMPS) was invented in the latter years of MCM-D use for thin-film fabrication. Those geometries fit today into our use of ultra HDI.

A System Designer’s Dream World at DuPont

02/07/2024 | Marcy LaRont, PCB007 Magazine
DesignCon 2024 was held January 30–February 1 in Silicon Valley, and Design007 Editor Andy Shaughnessy and I were there to experience this important show for PCB and system designers. We are always on the lookout for gems that showcase innovation and cutting-edge technology. Such an opportunity arose through a private tour at DuPont’s Silicon Valley Technology Center in Sunnyvale.

Heraeus Electronics Thick Film Acquires PriElex Electronic Inks from Kayaku Advanced Materials

02/01/2024 | Heraeus Electronics
Heraeus Electronics, a leading provider of advanced materials solutions, is pleased to announce the successful acquisition of the PriElex electronics inks business line from Kayaku Advanced Materials Inc.

Real Time with... SMTAI 2023: Underfilm: The New 20-Year-Old Assembly Solution

10/17/2023 | Real Time with...SMTAI
Underfilm is an alternative for underfill. Alltemated holds a patent for this technology which they've been perfecting for 20 years. Rachael Temple, sales and marketing, explains how it works, when to use it, and why you should.

Matrix Building Equipment Demonstration Room at the Toronto Location

10/04/2023 | Matrix Electronics
Matrix Electronics will soon complete the construction of their PCB Equipment Demonstration Room at the Matrix headquarter in Toronto, Ontario, Canada.
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