AT&S Marks 20th Anniversary of IPO

Reading time ( words)

AT&S has just achieved two significant milestones: On the one hand, the company is the globally leading supplier of high-end printed circuit boards, according to the figures of the industry expert Prismark for 2018. On the other hand, AT&S is celebrating its successful initial public offering (IPO) 20 years ago and its equally positive development over two decades.

Ever more complex, high-density interconnect (HDI) and powerful systems with the corresponding electronic circuits require printed circuit boards designed to meet these needs. These requirements are addressed with high-end products such as HDI technology. Such technologies offer advantages, including higher circuit density, better characteristics for electrical behaviour and signal transmission, short signal paths and good electromagnetic compatibility (EMC) and interference immunity, making the high-quality products more powerful, more reliable, lighter and more compact. Typical applications include smartphones, tablets, wearables, automotive and storage products, industrial electronics, but also future 5G applications.

However, these high-end technologies place increased demands on design and manufacturing. This is where AT&S contributes its extensive know-how, combined with its high research and development performance and an early strategic focus on high-quality and highly advanced products. The market researchers of Prismark see AT&S as the number one company in the HDI market segment in 2018 with a share of more than US$830 million. HDI products account for roughly 15% of the entire global printed circuit board market.

20 Years Since IPO

The leading position of AT&S for HDI printed circuit boards underpins the strategic orientation focusing on high-end products. AT&S offers a wide range of advanced solutions for customers in the mobile devices, automotive electronics, medical technology, industrial electronics and semiconductor industries. Against this background, AT&S not only carried out a successful IPO, but recorded an equally successful company development with a continuous dividend policy for its shareholders. Since the IPO, revenue increased from € 151 million (end of 1998/99) to more than €1 billion, and the headcount rose from roughly 1,900 (end of 1998/99) to 9,800.

The initial public offering of AT&S took place in the Neuer Markt segment in Frankfurt in July 1999, thus celebrating its 20-year anniversary. In spring 2008 the decision was made to transfer to the Vienna Stock Exchange. At the same time, the termination of the listing and the revocation of the admission of AT&S shares to the Regulated Market at the Frankfurt Stock Exchange were initiated. On the Vienna Stock Exchange the share has been a member of the ATX index since March 2018.

AT&S will continue to develop and offer powerful solutions for the growing demands in dynamic markets such as e-mobility, automated/autonomous driving, 5G mobile communication, modern medical technology and the semiconductor industry in the future. At the same time, the company is undergoing a transformation to become a provider of comprehensive interconnect solutions with products and technologies that go far beyond pure printed circuit boards. This is considered a great opportunity to evolve fundamentally on different levels in order to reach a significantly larger market with high global growth rates. Customers can be served on an even broader basis with higher value creation potential while new areas of application can be opened up. To this end, AT&S uses its existing expertise and technologies, expanding them with appropriate investments.

About AT&S

AT&S is the European market leader and one of the globally leading manufacturers of high-value printed circuit boards and IC substrates. AT&S industrialises leading-edge technologies for its core business segments Mobile Devices, Automotive, Industrial, Medical and Advanced Packaging. AT&S has a global presence, with production facilities in Austria (Leoben and Fehring) and plants in India (Nanjangud), China (Shanghai, Chongqing) and Korea (Ansan, near Seoul). The company employed an average of about 10,000 people in the financial year 2017/18. For more information:



Suggested Items

Creating Stability in Materials Chaos

06/06/2019 | Nolan Johnson, I-Connect007
Nolan Johnson and Tony Senese—manager, business development group, Panasonic EMBD—discuss the evolution of the materials marketplace over the years from a time when the market aligned for the rise of Panasonic’s MEGTRON 6 to the ever-changing materials industry of today. With the ramp-up to 5G and everyone pushing product development, Tony describes a chaotic materials market flooded with new companies and materials.

RTW IPC APEX EXPO: Orbotech West on Supporting Customer Needs

04/19/2019 | Real Time with...IPC
Orbotech West President Sharon Cohen speaks with Kelly Dack about Orbotech West’s restructuring to better support customer needs, their customer monitoring center, and hints at the capabilities of new products coming soon.

Ventec Focuses on High-mix Manufacturing

04/09/2019 | Barry Matties, I-Connect007
The I-Connect007 team recently toured Ventec International Group’s Suzhou factory where a modern, flexible manufacturing concept designed for fast delivery is enhancing their established volume manufacturing of specialty, high-reliability epoxy laminates and prepregs. Read on to know more about Ventec's ongoing investment in the facility to offer flexible world-class high-mix manufacturing capabilities for polyimide, thermal management, low-loss, and signal integrity material solutions.

Copyright © 2019 I-Connect007. All rights reserved.