AT&S Initiates Next Growth Step


Reading time ( words)

AT&S continues to expand its business with IC substrates as a strategic pillar. Due to rising market demand for high-performance computing, the company intends to build a new plant at the location in Chongqing and to expand the existing capacities at the Leoben plant. To this end, an investment volume totalling nearly one billion Euro with a focus on Chongqing is planned for the next five years. These investment projects are also based on close cooperation with a leading producer of semiconductors.

July 11, 2019 AT&S Initiates Next Growth Step:

  • Investment volume of just under one billion Euro planned for the next five years
  • Construction of a new plant in Chongqing and expansion of the location in Leoben
  • Production of IC substrates for high-performance computing modules
  • Significant milestone in endeavours to grow with modules
  • Start of production in the new plant in Chongqing end of 2021

Increasingly connected digital systems, systems using artificial intelligence, robotics or autonomous driving require ever faster processing of ever increasing data volumes. As a result, the required computing power and data storage needs are growing significantly. The required performance of future high-performance computing modules massively drives the technological demands on all components of the modules including IC substrates.

With these investments, AT&S pursues the goal of sustainable, profitable growth while at the same time expanding its market position for IC substrates. AT&S will participate in the growing market for IC substrates based on these investments. The business with IC substrates is becoming a strategically important business mainstay for AT&S in addition to high-end printed circuit boards.

The new, state-of-the-art factory is intended to be built at the existing location in Chongqing. Construction work begins immediately and the start of production is planned for the end of 2021.

About AT&S Austria Technologie & Systemtechnik AG—First Choice For Advanced Applications

AT&S is the global market leader for high-end printed circuit boards and one of the leading manufacturers of IC substrates. AT&S industrialises leading-edge technologies for its core business segments Mobile Devices, Automotive, Industrial and Medical. As an international growth enterprise, AT&S has a global presence with production sites in Austria (Leoben, Fehring) and plants in India (Nanjangud), China (Shanghai, Chongqing) and Korea (Ansan near Seoul). The company currently employed an average of roughly 9,800 people. For further information: www.ats.net

Share

Print


Suggested Items

Creating Stability in Materials Chaos

06/06/2019 | Nolan Johnson, I-Connect007
Nolan Johnson and Tony Senese—manager, business development group, Panasonic EMBD—discuss the evolution of the materials marketplace over the years from a time when the market aligned for the rise of Panasonic’s MEGTRON 6 to the ever-changing materials industry of today. With the ramp-up to 5G and everyone pushing product development, Tony describes a chaotic materials market flooded with new companies and materials.

Making Materials Succeed: Past, Present, and Future Trends

05/20/2019 | Nolan Johnson, I-Connect007
Tony Senese, manager for the business development group at Panasonic EMBD, gives Nolan Johnson an overview of materials and components as well as changing business models and methods to make materials succeed and how to stay profitable.

Ventec Focuses on High-mix Manufacturing

04/09/2019 | Barry Matties, I-Connect007
The I-Connect007 team recently toured Ventec International Group’s Suzhou factory where a modern, flexible manufacturing concept designed for fast delivery is enhancing their established volume manufacturing of specialty, high-reliability epoxy laminates and prepregs. Read on to know more about Ventec's ongoing investment in the facility to offer flexible world-class high-mix manufacturing capabilities for polyimide, thermal management, low-loss, and signal integrity material solutions.



Copyright © 2019 I-Connect007. All rights reserved.