-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Intense Competition to Emerge in High-frequency CCL for 5G AAU Applications
September 2, 2019 | DigitimesEstimated reading time: Less than a minute
Demand for high-frequency and high-speed CCL will rise sharply to support production of multi-layer backboards for AAU (active antenna unit) application at 5G base stations, prompting CCL makers to step up upgrading specs of their products to meet the demand. AAU comprises both antennas and RF modules, and the former usually adopts PTFE as a reinforcing material for CCL, with US-based supplier Rogers now almost dominating the supply of such material and seen a dominant supplier of AAU modules for 5G base stations.
As China's Huawei cuts purchases of such modules from Rogers to reduce reliance on US supplies, allowing a leeway for other suppliers to tap into the 5G AAU segment, Taiwan-based makers Iteq and Taiwan Union Technology (TUC), mostly engaged in using PPE and PPO resins as the reinforcing mediators for their CCL products, may lose out to Japan peers with higher technology levels, such as Chukoh Chemical Industries.
Suggested Items
Orbex Secures Patent for 'Petal Fold' Reusable Rocket Technology
03/29/2024 | OrbexOrbex has successfully patented its REFLIGHT reusable rocket technology following patent approval in several European markets, based on the patent grant by the European Patent Office, as well as in the United States.
Intel Announces 2024 EPIC Supplier Program Award Recipients
03/29/2024 | Intel CorporationIntel announced the recipients of the 2024 Intel EPIC Supplier Program awards, which recognize suppliers that exemplify Intel’s standard of excellence. Intel is committed to expanding global supply capacity, delivering leadership products and enabling Intel Foundry.
NEOTech Promotes Emilio Ramirez to Chief Technology Officer
03/29/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is thrilled to announce the promotion of Emilio Ramirez to the position of Chief Technology Officer (CTO).
Keynote Preview: Reshaping our Engagement With the World
03/28/2024 | Shawn DuBravac, IPCThe widespread integration of AI across various sectors is broadening its impact, from revolutionizing healthcare with Smart solutions to transforming homes into intuitive spaces, highlighting its crucial role in boosting efficiency and addressing complex challenges. In healthcare, we're witnessing a trend toward personalized care with AI-driven devices like intelligent pillows to mitigate snoring, sophisticated sleep monitors, and innovative patient monitoring systems.
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.