-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Atotech to Present at the HKPCA 2019 International Electronics Circuit Exhibition
November 22, 2019 | AtotechEstimated reading time: 1 minute
Atotech, a leading surface-finishing solutions provider, delivering chemistry, equipment, and service to support diverse end-markets such as mobile devices, computers, consumer electronics, the global automotive industries, and many others, will present at the 2019 International Electronics Circuit Exhibition in Shenzhen, China, on December 4th – 6th.
On Thursday, December 5, Atotech expert Kuldip Johal will give a presentation entitled: “Moving to mmWave—how does this impact the PCB/IC substrate,” from 2:00 – 2:40 p.m. at the International Technical Conference area in hall 4.
Visitors of the HKPCA 2019 are welcome to join Atotech’s expert talk on 5G trends, challenges and solutions and to stop by the company’s booth 2D21. Mr. Johal and several other global and local Atotech experts will be available to discuss the latest product innovations and trends.
Atotech’s key highlights at the booth include:
- vPlate®—Vertical continuous copper plating technology of choice for advanced HDI and IC substrate.
- Polygon® PLB Line®—Atotech’s new desmear and electroless copper system.
- ViaKing®—Atotech's new enhanced graphite direct metallization for flex and advanced base materials.
- Noviganth® AF—High build self-accelerating electroless copper process.
- InPro® THF2—Atotech’s (a)mSAP BMV filling process for best uniformity with high ductility.
- InPro® MVF2—Advanced BMV filling in VCP equipment for HDI production.
- BondFilm® HF1000—Bonding enhancement process for high frequency manufacturing.
- CupraEtch® SR8000—Dryfilm and soldermask pretreatment with advanced adhesion performance.
- PallaBond®—Direct pure EPAG for ultra fine L/S application.
- Stanna-COF—Immersion tin for chip on film.
- Spherolyte® Cu UF3—Cu RDL process for fine line plating and microvia filling.
For more information about Atotech or its product offering, please visit www.atotech.com or contact us at: info@atotech.com.
About Atotech:
Atotech is a global leader in surface-finishing solutions. Through a comprehensive systems-and-solutions approach, the company delivers chemistry, equipment, and service to support diverse industries such as consumer electronics, especially mobile devices and computers; global automotive; communication infrastructure; and many other industrial end-markets. Atotech’s relentless R&D efforts and global TechCenter presence allows it to deliver pioneering and sustainable products combined with unparalleled on-site customer support—making Atotech a critical partner to over 8,000 customers worldwide. Atotech is a team of 3,800 experts in over 40 countries generating annual revenues of $1.2 billion (2018). Atotech has manufacturing operations across Europe, the Americas, and Asia and its headquarters is in Berlin, Germany.
Suggested Items
IPC Bestows Posthumous Hall of Fame Award to Industry Icon Michael Ford
04/18/2024 | IPCIPC honored the late Michael Ford, Aegis Software, for his extraordinary contributions to the global electronics manufacturing industry with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO 2024. IPC’s most prestigious honor, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry. Ford, an industry leader and valued IPC volunteer, died suddenly in January 2024.
SEMI Applauds U.S. Chips Act Award for Samsung Electronics Facilities to Strengthen Domestic Semiconductor Supply Chain
04/17/2024 | SEMISEMI, the industry association serving the global electronics design and manufacturing supply chain, applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support the expansion of Samsung Electronics’ presence in Texas and the company’s development and production of leading-edge chips.
Northrop Grumman honors Calumet Electronics with Supplier Excellence Award
04/17/2024 | Calumet ElectronicsNorthrop Grumman Corporation has recognized Calumet Electronics during the company’s 2024 Supplier Excellence Awards for “exceptional performance and unwavering commitment to delivering with excellence.” Calumet is one of 70 suppliers recognized from across the globe. In its award category of “Supplier Strategic Excellence,” Calumet was honored alongside global corporations such as Amazon Web Services, Dell Technologies, and Eaton Corporation.
Ark Electronics Expands Global Manufacturing Factory Network in North America and Europe
04/17/2024 | PRNewswireElectronic Manufacturing Company Ark Electronics recently announced the expansion of its Global Factory Network with the addition of Electronics Manufacturing Service (EMS) capabilities in Mexico and Europe.
Designing Electronics for High Thermal Loads
04/16/2024 | Akber Roy, Rush PCB Inc.Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.