Molex Recognized for Innovative Telematic Control Unit Antenna Fusion
December 12, 2019 | MolexEstimated reading time: 1 minute
Molex, an automotive Tier 1 supplier of end-to-end data solutions, high-speed networking, datacom, rugged industrial and automotive solutions that enable innovative architecture design and development for the intelligent vehicles of the future, has been selected by the editors of Autonomous Vehicle Technology (AVT) magazine for the second year in a row as a recipient of the 2020 ACES Award. Molex is recognized in the category of Connectivity for its next-gen solution that fuses a telematic control unit (TCU) to an antenna in a sleek, hidden design.
As connected vehicles continue communicating to the digital environment, the role of antennas and integrated high-performance TCUs is increasingly crucial. With its extensive expertise, Molex fused the two in an innovative solution to create the TCU Antenna Fusion. It not only improves RF efficiency and reduces system costs, but its industrial design allows OEMs to implement a hidden, high-performance antenna. The innovation helps ensure seamless connectivity, which is critical for smart cars to transport significant amounts of data and especially in the future moving to 5G mmWave solutions.
“Molex is honored to be awarded by Autonomous Vehicle Technology magazine as the ACES award shows the market relevance of Molex TCU Antenna Fusion for the connected and automated vehicle of the future. Molex innovations and expertise are driving solutions that are creating significant value for our automotive customers,” said Dietmar Schnepp, product director vehicle communication devices, Molex.
Winners of the AVT ACES Awards were evaluated and chosen based on editor, industry expert and reader inputs. Only the most innovative technologies, products, and services of the year in the areas of vehicle autonomy, connectivity, electrification, and mobility services (ACES) are considered.
Suggested Items
Boeing Opens Research & Technology Center in Japan
04/23/2024 | BoeingBoeing today opened a Boeing Research & Technology (BR&T) Center in Japan that will focus on innovation to enable the commercial aviation industry meet its goal of net zero carbon emissions by 2050.
Schweizer Electronic Appoints Thomas Gottwald as New Member of the Executive Board
04/23/2024 | Schweizer Electronic AGThe Supervisory Board of Schweizer Electronic AG has appointed Mr. Thomas Gottwald to the Executive Board as CTO (Chief Technology Officer) for a period of 3 years with effect from 1 May 2024.
US Department of Defense Selects Intel Foundry for Phase Three of RAMP-C
04/23/2024 | IntelThe U.S. Department of Defense (DoD) has awarded Intel Foundry Phase Three of its Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program.
Real Time with... IPC APEX EXPO 2024: Industrial Quality Solutions from Zeiss
04/23/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson and Herminso Gomez of Zeiss Group discuss the company's industrial quality solutions, with a focus on X-ray technology. Zeiss provides a range of microscopy options and Herminso highlights the advantages of X-ray technology for aerospace, medical, and consumer electronics sectors.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.