AIRBUS Drives Optima Photonics Payload Technology to Next Level
December 16, 2019 | AirbusEstimated reading time: 1 minute
Airbus has validated and demonstrated photonic satellite payload technology to Technology Readiness Level 6, the last level before prototype in orbit, through the OPTIMA Horizon 2020 project. This proof of concept demonstrator brings the use of photonic payloads in telecommunications satellites one step closer. Photonic payloads have the potential to revolutionise the design, capacity and capability of future generations of telecommunications satellites.
Photonic payloads will use light to transfer the signals throughout the spacecraft, replacing current radio frequency (RF) technologies, allowing for the development of more efficient and powerful satellites which are able to meet the increasing complexity and sophistication required by customers.
OPTIMA takes into account the future evolution of telecom satellite payloads and inter-satellite links which are expected to enter the terabit per second and multi-Gb/s "era" in the 2020 horizon.
OPTIMA technology enables the design of such payloads with significant reduction of mass, volume and power consumption against full microwave approaches, whereas Photonic Integrated Circuits enable low overall production and integration costs.
The technology developed in OPTIMA will see the sustained entry of photonics into telecom satellite payloads. This will enable easier capacity upgrades of multi-beam telecommunication satellites and also leverage the R&D investment to address next generation coherent inter-satellite links with fully integrated and qualified components.
Javad Anzalchi, Airbus project manager and technical lead said: “By bringing together industry partners, we have managed to develop, demonstrate, and raise the technology readiness level of photonics for applications in space. Using the low power equipments developed in OPTIMA, enables us to achieve high capacity payloads and multi-Gb/s inter-satellite links with considerable savings in power, mass and footprint.”
The OPTIMA project, led by Airbus in Stevenage and part of Horizon 2020 funded by the European Commission, comprises specialist partners from across Europe, including: DAS Photonics (Spain), CORDON Electronics (Italy), SODERN (France), Huber+Suhner Polatis (UK) and IMEC (Belgium).
Suggested Items
Boeing Opens Research & Technology Center in Japan
04/23/2024 | BoeingBoeing today opened a Boeing Research & Technology (BR&T) Center in Japan that will focus on innovation to enable the commercial aviation industry meet its goal of net zero carbon emissions by 2050.
Schweizer Electronic Appoints Thomas Gottwald as New Member of the Executive Board
04/23/2024 | Schweizer Electronic AGThe Supervisory Board of Schweizer Electronic AG has appointed Mr. Thomas Gottwald to the Executive Board as CTO (Chief Technology Officer) for a period of 3 years with effect from 1 May 2024.
US Department of Defense Selects Intel Foundry for Phase Three of RAMP-C
04/23/2024 | IntelThe U.S. Department of Defense (DoD) has awarded Intel Foundry Phase Three of its Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program.
Real Time with... IPC APEX EXPO 2024: Industrial Quality Solutions from Zeiss
04/23/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson and Herminso Gomez of Zeiss Group discuss the company's industrial quality solutions, with a focus on X-ray technology. Zeiss provides a range of microscopy options and Herminso highlights the advantages of X-ray technology for aerospace, medical, and consumer electronics sectors.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.