AerNos Named CES 2020 Innovation Award Honoree in Two Categories
January 6, 2020 | PRWEBEstimated reading time: 1 minute
AerNos, Inc. has announced that it has been named a CES 2020 Innovation Awards Honoree in two categories for its air quality monitoring module developed for integration into smart IoT connected products. An annual program that celebrates outstanding design, the CES Innovation Awards recognizes honorees across 28 product categories. A panel of judges, including designers, engineers and members of the tech media, reviews submissions based on design, functionality, consumer appeal, engineering and how the products compare with competition. CES 2020 takes place January 7-10 in Las Vegas.
AerNos nano gas sensor modules detect multiple gases simultaneously to parts per billion (PPB) levels for indoor and outdoor air quality monitoring, hazardous gas detection and other e-nose applications. AerNos leverages breakthroughs in nanotechnology, engineering, AI and manufacturing to deliver an embeddable plug-and-play product for integration into 3rd party IoT devices, wearable and mobile products. Tiny, low power and affordable, AerNos sensor modules address crucial gaps in the gas sensor market and will accelerate the integration of air quality monitoring and gas detection sensors into smart devices worldwide.
“We are absolutely thrilled to have our game changing product selected as a CES 2020 Innovation Award Honoree, and we are especially proud to receive awards in these particular categories,” said AerNos Founder and CEO Sundip R. Doshi. “With a tiny multi-gas sensing product capable of ppb level detection, we are opening up endless possibilities for our B2B customers and positioning AerNos to fulfill the promise of dense networks of sensors for hyper-local actionable data to improve health, safety and the environment.
The CES Innovation Awards are sponsored by the Consumer Technology Association (CTA)™, owner and producer of CES, the world’s largest and most influential technology event. CTA has been recognizing achievements in product design and engineering since 1976.
AerNos CEO, Sundip R. Doshi will be a panelist on the Smart Home Session: Can Smart Homes Improve Our Health Wednesday, January 8 from 10:15 a.m. – 11:15 a.m., Venetian, Level 4, Marcello 4406.
AerNos will exhibit at CES 2020 at the Sands Expo Booth 42137, January 7-10 in Las Vegas.
The AerNos sensor module will be on display in the Innovation Awards Showcase at CES 2020 as well as in the AerNos booth 42137 in the Sands Expo. To learn about AerNos at CES or to schedule a meeting during CES 2020 visit AerNos at CES.
Suggested Items
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.