Airspan Networks Extends Collaboration with ON Semiconductor on Wi-Fi 6 Solutions for Fixed Wireless Access Applications
May 6, 2020 | Business WireEstimated reading time: 1 minute
Airspan Networks announced its collaboration with ON Semiconductor, driving energy efficient innovations, to capitalize on industry-leading Wi-Fi 6 performance solutions, utilizing the QCS-AX chipset for Fixed Wireless Access (FWA) applications.
With hundreds of thousands of sites deployed globally, Airspan is at the forefront of providing Communications Service Providers innovative wireless solutions for high-reliability public and private, urban, suburban and rural applications. Airspan delivers high-capacity, high-performance solutions that allow cost-effective, rapid deployment at scale.
Next-generation Airspan solutions will leverage ON Semiconductor’s QCS-AX Wi-Fi 6 family of chipsets. These products will maximize the benefits of the new Wi-Fi 6 standard including the additional spectrum in the 6 GHz band. The OFDMA-based 8x8 beamforming technology utilizing 160 MHz channels with modulation rates of 1024 QAM will significantly improve interference immunity, enabling higher-spectral efficiency and delivering multi-gigabit capacity.
“We are excited to expand our collaboration with ON Semiconductor to deliver Fixed Wireless Access/Backhaul and indoor/outdoor Wi-Fi Hotspots that offer significantly enhanced performance at lower cost,” said Eric Stonestrom, Airspan’s CEO.
“The FWA innovation has expanded Wi-Fi use case into outdoor space. By leveraging Wi-Fi 6 offload to LTE/5G networks, end consumers can expect fast and seamless connectivity. We are thrilled to continue working with Airspan to bring new connectivity to underserved markets,” said Irvind Ghai, VP Marketing, Quantenna Connectivity Solutions at ON Semiconductor.
FWA demands continue to advance where capacity and reliability are critical for day-to-day use in schools, hospitals, law enforcement, economic growth, etc. Airspan Networks is positioned to continue to address market needs and shape the networks of tomorrow.
Suggested Items
indie Semiconductor Launches Advanced Smart Connectivity Solutions for In-Cabin Applications
04/23/2024 | indie Semiconductorindie Semiconductor, Inc., an Autotech solutions innovator, has introduced a family of new high-performance video converters and retimers to enable in-cabin connectivity applications, including audio and video transport and device interfacing.
ZESTRON Welcomes Whitlock Associates as New Addition to their Existing Rep Team in Florida
04/19/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is thrilled to announce the addition of Whitlock Associates to its esteemed network of sales representatives.
ViTrox Pioneering the Future of Smart Manufacturing at NEPCON China 2024
04/18/2024 | ViTroxViTrox, which aims to be the World’s Most Trusted Technology Company, is pleased to announce its participation in the NEPCON China 2024 at Booth #1H27 at Shanghai World Expo Exhibition & Convention Center from 24-26 April 2024.
ViTrox Technologies Elevates Service & Support Across US & Canada with Jeremy Woodworth's Appointment
04/18/2024 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is pleased to announce the expansion of its US-based support team with the appointment of Jeremy Woodworth as Technical Support Senior Engineer based in the United States, effective March 15, 2024.
Micron’s Full Suite of Automotive-Grade Solutions Qualified for Qualcomm Automotive Platforms to Power AI in Vehicles
04/17/2024 | MicronMicron Technology, Inc. announced that it has qualified a full suite of its automotive-grade memory and storage solutions for Qualcomm Technologies Inc.’s Snapdragon® Digital Chassis™, a comprehensive set of cloud-connected platforms designed to power data-rich, intelligent automotive services.