Renesas Unveils Integrated LIN Interface Sensor Signal Conditioner for Electric, Hybrid Electric Vehicle HVAC Systems
July 9, 2020 | Business WireEstimated reading time: 1 minute
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, introduced the ZSSC4132 – an automotive pressure sensor solution featuring an integrated certified LIN v2.2a interface. The single-package sensor signal conditioner (SSC) delivers best-in-class performance, increased design flexibility, and cost efficiency in a compact form factor for HVAC applications used in plug-in hybrid electric vehicle (PHEV), Battery Electric Vehicle (BEV), and Fuel-cell Electric Vehicle (FCEV) climate control systems.
The ZSSC4132 can be configured for nearly all resistive bridge sensors. This flexibility, combined with leading performance levels, an integrated LIN PHY, small package footprint, and AEC-Q100 Grade 0 qualifications, makes the SSC ideally suited for small automotive sensor modules with limited space, tight budget and end-of-line (EOL) calibration requirements.
“HVAC plays a significant role in EV battery range, and OEMs are looking for ways to improve system efficiency while maintaining high performance and staying within tight cost constraints,” said Christian Wolf, Vice President, Automotive Sensor Business Division at Renesas. “With the ZSSC4132, customers can access a complete SSC solution that is already LIN certified, allowing them to easily and cost effectively scale their HVAC system development for mid-range up to high-end EVs and HEVs.”
Key Features of the ZSSC4132
The ZSSC4132 combines best-in-class analog front end (AFE) technology for enhanced sensor signal conditioning as well as digital calibration to significantly reduce the noise sensitivity and deliver high accuracy for pressure and temperature readings. The SSC’s integration reduces overall bill of material (BOM) requirements by minimizing the need for external components. In addition, the ZSSC4132’s unique digital calibration feature that allows customers to minimize calibration efforts, further reducing overall system costs.
Additional features include:
- LIN v2.2a certification with backwards compatibility to LIN v1.3, v2.0, and v2.1
- Differential bridge sensor input that enables accuracy at ±0.5% full scale output for temperatures ranging from -40°C to 150°C
- 12- to 14-bit ADC resolution
- Slave node position detection feature at the LIN bus, allowing the SSC to assign a unique ID to the device
- Overvoltage and reverse-polarity protection circuitry
- Electromagnetic compatibility
- Multiple diagnostic features
Suggested Items
Real Time with... IPC APEX EXPO 2024: MYCRONIC's Evolution and New Solutions
04/17/2024 | Real Time with...IPC APEX EXPOHenry Crandall interviews Kevin Clue, the vice president of global sales for MYCRONIC's High Flex division. They discuss the company's evolution, emphasizing its strong customer relationships and its role as a versatile, turnkey solution provider. Kevin unveils new solutions launched at IPC APEX EXPO, including an AI-integrated inspection system and the A40 pick-and-place platform. The conversation also touches on the increased use of AI and deep learning.
Australian Flow Batteries and The SCHMID Group Announce Groundbreaking Memorandum of Understanding
04/17/2024 | SCHMID GroupAustralian Flow Batteries Pty Ltd (AFB), a leader in innovative energy solutions and economical, safe, and reliable power storage, and SCHMID Energy Systems GmbH a company of the German SCHMID Group, a global technology leader with a rich history in delivering innovative solutions across multiple industries including Electronics, Renewables, and Energy Storage sectors, are thrilled to announce the signing of a Memorandum of Understanding (MoU)
Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense
04/16/2024 | ANSYSAnsys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).
Designing Electronics for High Thermal Loads
04/16/2024 | Akber Roy, Rush PCB Inc.Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.
SIA Applauds CHIPS Act Incentives for Samsung Manufacturing Projects in Texas
04/16/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Samsung.