-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Ventec Launches High-Speed Material Option Cladded with Thin-Film Resistor Foil
September 24, 2020 | Ventec International GroupEstimated reading time: 2 minutes
For enhanced high-speed signal-handling performance required by the world's most demanding high-frequency Printed Circuit Board applications, Ventec International Group has launched a laminate option to its tec-speed 20.0 glass-reinforced hydrocarbon and ceramic laminate cladded with thin-film resistor material from Ticer.
Ventec's tec-speed 20.0 material, which combines unrivaled high-frequency performance (Dk 3.00-3.48 / Df 0.0027-0.0037), superior loss characteristics and highest reliability, is now available cladded with Ticer TCR© NiCr thin-film resistor foil as a service option. Essentially being inductor-free, the addition of the resistive material technology offers an enhanced material solution for some of today’s high-speed, low-loss, high-frequency applications where absolute performance and reliability are essential. These include aerospace & defense, radar, control circuits, sensor technologies, wireless communications, MEMS microphones/sensors/motors and medical diagnostic type applications.
Driven by the demand for reduction of dimensions and manufacturing costs of these types of devices, multi-layer technologies are one of the solutions that offer an increase in component packaging density. By adding the resistive foil layer in between the substrate and the copper layer, resistors can be embedded inside of PCBs after the lamination process.
Consequently, additional efficiencies the shorter distance between the embedded passives and active components achieves additional efficiencies that result in better signal transmission, less cross talk and improved electrical signal performance at high frequencies through lower loss and noise. In addition, material cost reduction, yield improvement, defect reduction and ultimately an optimized production cycle time and time to market can be achieved.
The embedded resistor foil layer material option named tec-speed 20.0 VT-870 H348 TCR is available in Hoz and 1oz thick foil with resistivity values of 25, 50 and 100 ?/sq.
“The high-speed signal-handling performance of our latest VT-870 H348 TCR material cladded with Ticers’ unique technology provides additional efficiencies for Ventec’s tec-speed 20.0 material,” noted Mark Goodwin, COO Europe & America. “It allows us to offer our customers an even greater choice of the best in high-quality, high-performance and reliable base material technology – all of course supported by our fast and efficient global delivery promise through our fully controlled global supply chain and dependable technical support.”
About Ventec International Group
Ventec International Group Co., Ltd. (6672 TT) is a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions. Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com and/or by downloading the Ventec APP.
Suggested Items
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?
AT&S Shines with Purest Copper on World Recycling Day
03/18/2024 | AT&SThe Styrian microelectronics specialist AT&S is taking World Recycling Day as an opportunity to review the progress that has been made in recent months at its sites around the world in terms of the efficient use of resources: