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Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense

04/16/2024 | ANSYS
Ansys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).

IMAPS & IPC to Host Onshoring Workshop

04/16/2024 | IPC
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.

Lockheed Martin Boosts Domestic Microelectronics Capabilities for Pentagon Aerial Defense Program

04/08/2024 | Lockheed Martin
Lockheed Martin will work with Intel Corporation, and Altera, an Intel Company, to support the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) program for the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E).

Northrop Grumman’s Integrated Battle Command System Demonstrates Another Successful LTAMDS and Patriot Live-Fire Integration

04/08/2024 | Northrop Grumman
Northrop Grumman Corporation’s Integrated Battle Command System (IBCS) seamlessly fused data from a Lower Tier Air and Missile Defense Sensor (LTAMDS) to acquire, track, engage and intercept a long-range cruise missile surrogate with a PAC-3 Missile Segment Enhancement during a recent test event held at White Sands Missile Range in New Mexico.

Boeing Awarded Contract to Continue Extreme Environmental Testing for Critical Defense Platforms

04/04/2024 | Boeing
The U.S. Air Force has awarded Boeing a contract worth up to $559 million over five years to operate, maintain and perform testing at the Little Mountain Test Facility at Hill Air Force Base, Utah.
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