Shipments of Mobile Phone Camera Modules Forecast to Reach 5.02 Billion in 2022
May 24, 2022 | TrendForceEstimated reading time: 1 minute
According to TrendForce research, smartphone camera module shipments will increase to 5.02 billion units in 2022, an annual growth rate of 5%. Since the price-performance ratio of whole devices is the primary basis for consumer purchases, the cost of high-standard solutions such as the five-camera design and main cameras sporting hundreds of millions of pixels will inevitably be passed on to the manufacturer with little improvement in sales performance. Therefore, the three-camera module remains the mainstream design this year and is forecast to account for more than 40% of total shipments. Only some smartphone models will adopt a four-camera design to differentiate their specifications, while the number of products with dual-cameras or less will fall, with entry-level models being the primary candidates.
By combining a high-pixel main camera with two low-pixel function cameras, a mobile phone can retain a three-camera design while taking into account hardware costs. TrendForce believes that this is also the primary reason for the development of low-end and mid-range products towards a three-camera or even four-camera design in addition to the increased adoption of low-pixel function cameras including 2-megapixel depth cameras and macro cameras. Growth momentum in mobile phone camera module shipments in 2022 will come primarily from additional numbers of low-pixel cameras prompted by the three-camera design. Although a high-resolution main camera with better specifications allows mobile phone brands to provide better photographic performance, pixel specifications have not continued to climb higher and mainstream cameras linger at approximately 50 million pixels, causing a slight stagnation in demand.
TrendForce indicates that mobile phone brands are currently curtailing competition in the hardware specifications of mobile phone camera modules but remain focused on photographic and video performance as promotional features of their mobile phones and will emphasize dynamic photography, night photography and other scenarios to highlight product advantages. This can be achieved not only by strengthening the optical performance of the camera module itself but also through algorithms and software, thereby increasing the enthusiasm of mobile phone brands to invest in self-developed chips. In addition to Apple and Samsung, which have long used their own SoCs, other mobile phone brands have also tried to launch self-developed chips to enhance image processing performance such as Xiaomi's Surging C1 and OPPO's MariSilicon X and VIVO's V1+.
Suggested Items
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.