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iNEMI’s Call-for-Participation Webinar: PCB Characterization for CAF and ECM Failure Mitigation Project
August 31, 2022 | iNEMIEstimated reading time: 1 minute
CAF (conductive anodic filament) failures are an electrochemical migration (ECM) process that causes short circuits in PCBs. iNEMI’s Characterization for CAF and ECM Failure Mitigation project will assess several areas of concern related to CAF failure: (1) scaling and integration of laser and mechanical drill features, (2) incoming quality measures of glass/resin systems, and (3) manufacturing process factors that may limit future targets and demands. The project plans to:
- Lower design reliability risk through characterization and study of focused incoming material and process factors driving CAF.
- Enable pitch scaling and higher density board technologies and identify high risk PCB technology features.
- Develop a better understanding of CAF through hardware failure analysis and build awareness of failure mechanisms.
- Enable predictive methodologies for laser and mechanical drill features.
- Reduce product qualification costs and associated timescales.
Registration
Join our information webinar September 7 or 8 to learn more about this project and how it can benefit your company. Two sessions are scheduled (with the same content) and are open to industry. Advance registration is required. For additional information, visit iNEMI's website.
Session 1
Wednesday, September 7, 2022
8:00-9:00 a.m. PDT (US)
11:00 a.m.-12:00 p.m. EDT (US)
5:00-6:00 p.m. CEST (Europe)
Session 2
Thursday, September 8
7:00-8:00 a.m. CST (China)
4:00-5:00 p.m. PDT (US) on September 7
7:00-8:00 p.m. EDT (US) on September 7
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The Connection Between Wire Harness and Box Build
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Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology
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Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
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Connect the Dots: Designing for Reality: Prioritizing Manufacturability
04/11/2024 | Matt Stevenson -- Column: Connect the DotsRealistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. To do so, one must account for the production variables associated with individual manufacturing partners. Understanding and creating robust PCB designs, especially in terms of board manufacturing, requires a lot of attention to detail. When more detail is included in the design, the manufacturing process goes more smoothly, and process yields are higher.