Cubic, Northrop Grumman Demonstrate JADC2 Connectivity
September 20, 2022 | Business WireEstimated reading time: 1 minute
Cubic Mission and Performance Solutions (CMPS) a division of Cubic Corporation, collaborated with Northrop Grumman, to successfully demonstrate a High Capacity Backbone (HCB)-enabled Gateway System solution that provides foundational connectivity and processing capabilities to enable Joint All Domain Command and Control (JADC2) and ensure delivery of the right data, to the right place, at the right time.
In a recent demonstration, Cubic and Northrop Grumman showcased an interconnected, vendor-agnostic network through Open Mission Systems (OMS) interfaces, proving the ability to deliver significantly enhanced, all domain command and control capabilities to fifth and fourth generation platforms.
“Cubic sees this successful demonstration as the first of many to come, including a complex air/ground flight test event we have planned for next year,” said David Harris, vice president and general manager of Secure Communications & GATR, CMPS. “The development of our HaloTM Software Defined Antenna, utilizes novel digital beam forming techniques to enable an ad hoc directional mesh for problem sets like JADC2. The modular, building-block approach will allow the system to be integrated on a variety of platforms enabling secure data transport into and out of highly contested environments.”?
The constructive event represents a crucial milestone in the development lifecycle of Halo. After proof-of-concepts demonstrated efficacy in the early 2010s, Cubic developed a flyable 2nd generation prototype of the novel multi-link solution, which culminated in a successful 2019 flight test. Cubic is now in its third generation of Halo development with plans for near-term transition to the warfighter. The third generation Halo solution is suitable for aircraft integration and/or ground or surface operations. Under USG sponsorship and oversight, the system will undergo rigorous flight testing in 2023.
Suggested Items
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Intel Announces New Program for AI PC Software Developers and Hardware Vendors
03/27/2024 | Intel CorporationIntel Corporation announced the creation of two new artificial intelligence (AI) initiatives as part of the AI PC Acceleration Program: the AI PC Developer Program and the addition of independent hardware vendors to the program.
SEMI ESD Alliance 2024 CEO Executive Outlook to Explore the Evolving RISC-V Movement and Semiconductor Design Ecosystem
03/27/2024 | SEMIKey executives from leading semiconductor EDA and IP companies will gather to discuss the latest industry trends, challenges and opportunities Thursday, May 9, in Santa Clara, California at the annual CEO Executive Outlook, hosted by the Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, and Keysight Technologies. Registration opens soon.
CentraTEQ to Showcase Wide Range of Vibration & Environmental Test Systems at Battery Tech Expo 24
03/26/2024 | CentraTEQEnvironmental and vibration test specialists CentraTEQ are excited to be exhibiting at the upcoming Battery Tech Expo, scheduled to take place at Silverstone on April 25, 2024.
SEMI 3D & Systems Summit To Spotlight Trends In Hybrid Bonding, Chiplet Design And Environmental Sustainability
03/26/2024 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024,