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January 2023 Issue of SMT007 Magazine Available Now
January 3, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
As semiconductor companies seek ways to prolong Moore's Law, new advanced component packaging techniques are moving the boundaries between printed circuit fabrication and semiconductor fabrication.
In the past two years, we’ve covered the heterogenous integration roadmap (PCB007 Magazine, October 2020), and more recently, reported on the IPC Advanced Packaging Symposium held last October in Washington, D.C. This is a topic wherein printed circuit manufacturing and semiconductor manufacturing begin to converge. What will be the impact on the EMS industry?
In this issue, we open the discussion about how advanced packaging will change the structure of our industry.
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Design Community Town Hall Review
04/11/2024 | Kelly Dack, CID+, EPTACThe Design Community Town Hall took place on the afternoon of April 10, 2024. I was fortunate to attend this event, which marked an opportunity for members of some newly found design groups to get together and exchange ideas. Peter Tranitz, senior director of solutions for IPC, opened the session with a slide presentation introducing these new groups and members within the solutions department.