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Headlines of the Week

(Please contact haverhill@dknreseach.com for further information on the news.)

1. DNP (Major printing company in Japan) 11/6
The company has developed a new digital signage system fo use with operated wind power, photovoltaic cell, and second batteries for outside use.

2. Teijin (Major material supplier in Japan) 11/11
The supplier has developed a new low-cost carbon alloy catalyst for fuel cells without platinum.

3. Rohm (Major device manufacturer in Japan) 11/11
The manufacturer has co-developed a new wearable bio-sensor technology with Kobe University. The new device consumes only 6 micro A.

4. Nidec (Major device manufacturer in Japan) 11/13
The manufacturer has developed a new motor driving technology without a magnet introducing SiC base inverter.

5. Hitachi (Major electric & electronic company in Japan) 11/14
The company has developed a new lithium ion battery technology introducing new electrode materials with special 3D structures. It doubles the life of the battery.

6. UTAC (Semiconductor packaging firm in Singapore) 11/14
The firm will begin the volume production of grid array flat no-lead (GQFN) packages at its Thailand Plant in the first quarter 2015.|

7. Toppan Printing (Major printing company in Japan) 11/18
The company has co-developed a new virtual reality technology with Sony that offers a higher resolution than 8k TV.

8. Tanaka Holdings (Specialty metallic materials supplier in Japan) 11/18
The supplier has developed a new platinum-based glass powder for the sintering process of 3D printing process.

9. Mitsubishi Electric (Major electric & electronic company in Japan) 11/20
The company has commercialized a new power hybrid IC “SiC DIPPIPM” with SiC base diode as a conditioner of photovoltaic cells.

10. Sharp (Major electronics company in Japan) 11/20
The company has rolled out a new crystalline base photovoltaic module series, “BLACKSOLAR,” for home use.

11. 3M (Major electronics material supplier in the U.S.) 11/21
The supplier's fluorinated inert liquid was adopted as a coolant for a super computer developed in Japan.

12. Kyocera (Major electronics company in Japan) 11/27
The company has released a new FFC connector series, “6866,” with 0.2 mm pitch for the connection between rigid circuit boards and flexible circuits

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