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Kerafol, X2F Partner to Revolutionize Thermal Solutions for Electronic Devices

02/09/2024 | Kerafol
Kerafol and X2F are teaming up to develop state-of-the-art thermal management solutions for electronic devices by leveraging the advantages of Kerafol's thermally conductive materials and X2F's patented controlled-viscosity molding technologies.

Book Excerpt: 'The Printed Circuit Designer's Guide to... Manufacturing Driven Design,' Chapter 2

08/23/2023 | I-Connect007 Editorial Team
Chapter 2 of 'The Printed Circuit Designer's Guide to... Manufacturing Driven Design' explores why a change is needed due to increasing complexity in electronics design. The miniaturization and resultant increase in number of design features make it virtually impossible to manually verify a design's manufacturing fit.

TT Electronics Roxspur Product Line Takes New Strategic Approach to Marketing DPG Series

08/15/2023 | TT Electronics
TT Electronics, a global provider of engineered technologies for performance-critical applications, breaks new ground with its Roxspur Measurement and Control product line’s first order of the Digital Pressure Gauge (DPG) series placed by global electronics distributor DigiKey.

Designing Aerospace PCBs: A Galaxy of Challenges

07/11/2023 | I-Connect007 Editorial Team
Jeffrey Boye designs aerospace PCBs at the Johns Hopkins University Applied Physics Laboratory. After a decade or so at the APL, some of his boards are currently floating in space. Jeffrey recently took a class with IPC instructor Kris Moyer titled “PCB Design for Military and Aerospace Applications.” As Jeffrey explains in this interview, this exhaustive class covered everything from high-reliability DFM techniques to Paschen’s curves, which help engineers understand and predict how a high-voltage signal travels in different atmospheres. He also discusses some of the “wacky” projects that he’s worked on at the APL, and the need to communicate with fabricators early on with aerospace applications.

Global Demand for Notebooks Projected to Grow 11% QoQ in 2Q23

04/06/2023 | TrendForce
TrendForce research reveals that global notebook shipments reached 33.9 million units in 1Q23—a 13% QoQ and 39% YoY decline. This drop is primarily attributed to the continued impact of economic headwinds on consumer market confidence, which has hindered notebook channels as they destock.
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