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D Coupon Testing and Data Insights With GreenSource Fabrication

04/17/2024 | Marcy LaRont, PCB007 Magazine
Marcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.

Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology

04/17/2024 | Real Time with...IPC APEX EXPO
Editor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.

Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally

04/17/2024 | PRLOG
Donald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.

SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1

04/17/2024 | Dr. Jennie Hwang -- Column: SMT Perspectives and Prospects
In this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and assembly.

Argonne, RIKEN Sign a Memorandum of Understanding in Support of AI for Science

04/16/2024 | BUSINESS WIRE
Leaders in high performance computing in the U.S. and Japan have signed a memorandum of understanding (MOU) establishing a cooperative relationship in support of artificial intelligence (AI) computing projects.
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