-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
AT&S and UTAC Partner on Turnkey Supply for 3D SiP Solutions
May 2, 2016 | AT&SEstimated reading time: 2 minutes
UTAC Holdings Ltd (UTAC), one of the leading semiconductor assembly and test services provider in Asia, announced today a joint collaboration with AT&S, one of the global leading manufacturers of high-end printed circuit boards (PCBs) with headquarters in Leoben, Austria, to provide complete turnkey supply chain solutions for three-dimensional system-in-package (“3D SiP”) requirements. The collaboration combines UTAC’s established packaging and test services and AT&S’s industry leading embedded chip in substrate technology. This will offer customers a full turnkey supply chain assembly and test flow for applications that require the heterogeneous integration benefits that the 3D SiP with embedded chip architecture provides.
3D SiP integration benefits include:
- Reduction in package footprint area vs 2D planar SiP technologies
- Improved electrical performance through:
- shorter vertical (plated) interconnects to embedded chips
- 3D architecture enabling closer placement of components
- design flexibility to embed and or surface mount passive components
- Improved thermal performance through:
- lower thermal resistance
- ease of two-sided cooling through embedded chip technology
- EMI / RFI shielding
- shield isolation between digital and RF devices
“UTAC is continuously exploring and developing new technologies with partners in package design and testing to widen our product portfolio. The emerging requirements in power management, timing and RF device applications in particular; demand a new 3D package architecture that is able to handle higher integration and performance at lower costs. We have evaluated various options but none offer the design flexibility, range of benefits and high volume production readiness as AT&S embedded chip technology to deliver 3D SiP solutions,” said Mr. Asif Chowdhury, UTAC Senior Vice President of Product Line & Marketing.
“AT&S has been in production for more than 5 years with our Embedded Component Packaging (ECP®). Until now however, due to the heterogeneous standards, each customer specific supply chain had to be developed and aligned between the various partners. Our collaboration with UTAC provides much needed alignment of roadmaps and design rules for 3D SiP applications. Through the development of this full turnkey supply chain model we are able to address a much broader range of requirements with our embedded chip technology,” said Mr. Michael Lang, AT&S CEO of Advanced Packaging.
Yole Development (Yole) reported that in 2014, AT&S held a 75% share in the embedded die package market which Yole forecasts will grow over 64% annually thru 2020.
About UTAC Holdings Ltd
UTAC Holdings Ltd (UTAC) is a leading independent provider of assembly and test services for a broad range of semiconductor chips and we offer a full range of semiconductor assembly and test services in the following key product categories: analog, mixed-signal and logic, and memory. Our customers are primarily fabless companies, integrated device manufacturers and wafer foundries. UTAC is headquartered in Singapore, with production facilities located in Singapore, Thailand, Taiwan, China, Indonesia and Malaysia, in addition to its global sales network focused on five regions: United States, Japan, China and Taiwan, rest of Asia and Europe, with sales offices located in each of these regions.
Suggested Items
D Coupon Testing and Data Insights With GreenSource Fabrication
04/17/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.
Three Industry Leaders Receive IPC President’s Award
04/17/2024 | IPCIn recognition of their leadership and significant contributions of time and talent to IPC and the electronics industry, three IPC volunteers were presented with the IPC President’s Award at IPC APEX EXPO in Anaheim, Calif., on April 9, 2024.
Yamaha to Showcase Latest-generation Assembly Equipment and Software Tools at SMTconnect
04/16/2024 | Yamaha Robotics SMT SectionYamaha Robotics SMT Section will team with its distributor ANS Elektronik to showcase innovations for high-speed surface mount assembly at SMTconnect 2024.
TT Electronics Awarded Contract with Kongsberg Defence and Aerospace
04/11/2024 | TT ElectronicsTT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced today that its Fairford UK business has been awarded a new contract with long-standing customer Kongsberg Defence and Aerospace (Kongsberg) for the production of complex cable harness solutions.
Infineon, Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions
04/10/2024 | InfineonInfineon Technologies AG, a leader in power systems and IoT, is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology, Inc., a leading provider of semiconductor packaging and test services.