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   02/20/2018       • PCB007.com   • PCB007 Magazine   • I-007eBooks  • Subscriptions: my I-Connect007

TAIYO: Your Ultimate Solution for the Latest Technologies

For the past 27 years, Taiyo America Inc. has propelled itself into the latest technologies and trends, and continues to use its extensive worldwide R&D resources to further offerings and capabilities that include the latest in inkjet technology for legend ink. The Carson City, Nevada, facility offers specialty dielectric inks and via filling inks for use with microvia and build-up technologies, thermal-cure and UV-cure solder masks, as well as inkjet, packaging and legend inks. New offerings include dielectric and conductive ink products for the printed electronics, lighting and display markets.

For more information, visit Taiyo-America.com, follow us on LinkedIn and see us at IPC APEX Booth 331.

Ventec to Showcase Wide Range of Materials in Booth 818

Thermal management and signal integrity will be the focus for Ventec, a world leader in the production of insulated metal substrates, thermally conductive polyimide and high reliability laminates and prepregs, at APEX this year. Show highlights will feature the latest products from Ventec’s tec-thermal© and tec-speed© ranges, including its highest performance thermally conductive laminate material so far: VT-5A2 offers a polymer matrix that is fully compatible with Ventec laminates, epoxy or polyimide-based materials including tec-speed©, making it the ideal choice for the manufacture of hybrid multilayer low-loss constructions.

For more information on our products, visit Ventec online at Venteclaminates.com and come say hello at IPC APEX in Booth 818.

Burkle Offers a FULL SOLUTION for PCB Fabrication Machinery - Booth 801

A collaborative program involving Burkle North America, Schmoll Maschinen and Taiyo America Inc. has developed a solder mask product exclusively designed for Direct Imaging (DI). The Schmoll product line also includes a number of different types of drilling/routing systems, including mechanical drilling and laser drilling. The Schmoll line compliments the expandable Burkle lamination WorkCell system of hot presses, cold presses, storage racks and other peripheral products. Burkle North America's product offering is rounded out by the Impex metrology measuring product now gaining wide acceptance in the global PCB industry.

Visit Burkle North America in Booth 801 or visit us online at Burkleamerica.com.

Rogers Corporation Releases RO4460G2™ Low Loss Bondply

Rogers Corporation recently released RO4460G2™ low loss bondply with a 6.15 dielectric constant (Dk). RO4000® thermoset high-performance bonding layers have long been used by circuit designers for multilayer board constructions using Rogers high frequency and high speed digital materials where operating frequency, dielectric constant, or high-speed signal requirements dictate the need for high performance materials. The introduction of RO4460G2 bondply now provides designers a 0.004” (0.101 mm) bonding layer that complements the RO4360G2™ low loss, glass-reinforced 6.15 Dk copper clad thermoset laminates. RO4460G2 bondply is an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4400™ bondplies are capable of withstanding multiple lamination cycles. Visit Rogers at IPC APEX in Booth 500.

Director of Sales - Barb Hockaday
+1 916-608-0660

Technical Editor - Pete Starkey
+44 (0) 1455 293333

PCB007 Editor
Patty Goldman

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