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   02/20/2018       • PCB007.com   • PCB007 Magazine   • I-007eBooks  • Subscriptions: my I-Connect007



TAIYO: Your Ultimate Solution for the Latest Technologies

For the past 27 years, Taiyo America Inc. has propelled itself into the latest technologies and trends, and continues to use its extensive worldwide R&D resources to further offerings and capabilities that include the latest in inkjet technology for legend ink. The Carson City, Nevada, facility offers specialty dielectric inks and via filling inks for use with microvia and build-up technologies, thermal-cure and UV-cure solder masks, as well as inkjet, packaging and legend inks. New offerings include dielectric and conductive ink products for the printed electronics, lighting and display markets.

For more information, visit Taiyo-America.com, follow us on LinkedIn and see us at IPC APEX Booth 331.

Ventec to Showcase Wide Range of Materials in Booth 818

Thermal management and signal integrity will be the focus for Ventec, a world leader in the production of insulated metal substrates, thermally conductive polyimide and high reliability laminates and prepregs, at APEX this year. Show highlights will feature the latest products from Ventec’s tec-thermal© and tec-speed© ranges, including its highest performance thermally conductive laminate material so far: VT-5A2 offers a polymer matrix that is fully compatible with Ventec laminates, epoxy or polyimide-based materials including tec-speed©, making it the ideal choice for the manufacture of hybrid multilayer low-loss constructions.

For more information on our products, visit Ventec online at Venteclaminates.com and come say hello at IPC APEX in Booth 818.

Burkle Offers a FULL SOLUTION for PCB Fabrication Machinery - Booth 801

A collaborative program involving Burkle North America, Schmoll Maschinen and Taiyo America Inc. has developed a solder mask product exclusively designed for Direct Imaging (DI). The Schmoll product line also includes a number of different types of drilling/routing systems, including mechanical drilling and laser drilling. The Schmoll line compliments the expandable Burkle lamination WorkCell system of hot presses, cold presses, storage racks and other peripheral products. Burkle North America's product offering is rounded out by the Impex metrology measuring product now gaining wide acceptance in the global PCB industry.

Visit Burkle North America in Booth 801 or visit us online at Burkleamerica.com.

Need AOI that detects all the defects? At CIMS, this is what we do.

CIMS provides automated optical inspection solutions dedicated to enhancing production processes and yield in Printed Circuit Board (PCB), High Density Interconnect PCB (HDI PCB), Flex and Rigid-flex PCB and IC Substrates.

Along with AOI and AFI systems, we also offer integrated 2D and 3D metrology solutions for a wide range of PCB inspection applications.

For more information, visit cims.com or subscribe to our mailing list: marketing@cims.com. Join us at 2018 IPC APEX in Booth 701.

Quality New and Rebuilt Equipment from Advanced West

Established in 1988, Advanced West Inc. supplies both new and quality rebuilt equipment to the PC fab and chem-milling industries.

Comac Equipment, a division of Advanced West, supplies brand new brushless turbine dryers, rinse dryers, final clean machines and, now, hot roll laminators and tacky roll clean systems. Come see the following machines on display: Hot Roll Laminator Model HRL-24-S, Post Clean System Model PCS-224, Brushless Turbine Dryer Model AW-224 and Tacky Roll Cleaner Model TCM-30.

To learn more about these products, visit us at IPC APEX in Booth 334.

Rogers Corporation Releases RO4460G2™ Low Loss Bondply

Rogers Corporation recently released RO4460G2™ low loss bondply with a 6.15 dielectric constant (Dk). RO4000® thermoset high-performance bonding layers have long been used by circuit designers for multilayer board constructions using Rogers high frequency and high speed digital materials where operating frequency, dielectric constant, or high-speed signal requirements dictate the need for high performance materials. The introduction of RO4460G2 bondply now provides designers a 0.004” (0.101 mm) bonding layer that complements the RO4360G2™ low loss, glass-reinforced 6.15 Dk copper clad thermoset laminates. RO4460G2 bondply is an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4400™ bondplies are capable of withstanding multiple lamination cycles. Visit Rogers at IPC APEX in Booth 500.

BOWMAN XRF: Coating Measurement Element/Solution Analysis

Bowman M Series XRF coating measurement instrument is the ultimate in performance for small x-ray spot sizes on semiconductors, connectors, PCBs. Guaranteed to meet IPC 4552-A. Advanced poly-capillary optics focus the beam to 15μm FWHM; a dual-camera system allows operators to view the entire part, then zoom in with the 150X camera.

Programmable X-Y stage for multi-point measurement or use the M's pattern recognition. 2-D mapping enables operator to view coating topography. Configuration includes 15μm optics and high resolution SDD detector for higher count rates. Ideal for very thin coatings (less than 100μm), applications with short measurement times (1-5 sec.) and testing multiple locations. To learn more, visit Bowman at IPC APEX in Booth 1609.

ENEPIG Has Reached Its Ultimate Performance Potential!

Proprietary ENEPIG process uses Uyemura TWX-40 mixed reaction autocatalytic gold, a reduction-assisted gold bath that meets the demand for thicker gold in ENIG and ENEPIG. TWX-40 plates up to 8 µin gold with no nickel corrosion or deposit porosity. Ni/Pd/Au film provides excellent wire bondability and solderability.

Plus: only Uyemura ENEPIG uses Talon electroless alloyed palladium phos or pure palladium – the most cost-effective palladiums for ENEPIG! Talon deposits directly onto copper, aluminum, or electroless nickel, and is the most stable and versatile EP platform.

Visit Uyemura at IPC APEX Booth 507 to learn more.


Director of Sales - Barb Hockaday
+1 916-608-0660
barb@iconnect007.com

Technical Editor - Pete Starkey
+44 (0) 1455 293333
pete@iconnect007.com

PCB007 Editor
Patty Goldman
patty@iconnect007.com


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