The widespread use of new electronic components employing Ball-Grid Array (BGA), Chip Scale Packaging (CSP), and other evolving technology form-factors means new fabrication techniques must be used to create printed circuit boards (PCBs) that will accommodate parts with extremely tight lead pitches and small geometries. In addition, extremely fast signal rise-times and signal bandwidths challenge systems designers to find better ways to overcome the negative effects of inductance, noise, radio frequency interference (RFI) and electro-magnetic interference (EMI) have on their product’s performance. The use of PCBs incorporating microvia circuit interconnects is currently one of the most viable solutions on the market.
Happy Holden is the retired director of electronics and innovations for GENTEX Corporation. Formerly, he was the chief technical officer for the world’s largest PCB fabricator—Hon Hai Precision Industries (Foxconn). Prior to Foxconn, Holden was the senior PCB technologist for Mentor Graphics and advanced technology manager at Nan Ya/Westwood Associates and Merix. He previously worked at Hewlett-Packard for over 28 years as director of PCB R&D and manufacturing engineering manager. He has been involved in advanced PCB technologies for over 47 years.
Contributing authors: Happy Holden, John Andresakis, Eric Bogatin, Michael Carano, Karen Carpenter, Karl H. Dietz, Mark Laing, Christophe Vaucher, Per Viklund, Matt Wuensch
The Interconnect Market
Design of Advanced Substrates
The HDI Mfg Processes
Small Hole Creation
Fine-Line Imaging and Etching
Via-fill, Plating and Finishes
Inspection and Testing
Quality, Acceptability & Reliability
Assembly and Test Processes for HDI PCBs
Advanced HDI and Next Generation Interconnects
Advanced Packaging and System-in-Packages