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EIPC Summer Conference 2016, Day 2: Strategies to Maintain Profitability in the European PCB Industry

Delegates awoke to a gloomy Scottish morning on the second day of the EIPC Summer Conference 2016. One or two who maybe overindulged in the whisky on the previous evening had some difficulty in finding time for breakfast before the conference proceedings, but the atmosphere in the meeting room was brighter than the weather outside, as Professor Martin Goosey introduced the day’s programme.

IPC President John Mitchell Discusses IPC's Footprint in China

At the Capital Club in Beijing, IPC’s president John Mitchell met with I-Connect007’s Edy Yu to discuss the current activites of IPC China. Some of the topics covered included the growing China membership, training, trade shows and IPC China’s standards development effort.

All About Flex: Plating Process Options for Flexible Circuits

Plating copper through-holes or vias is a requirement for double-sided and multilayer circuits. In a previous column we discussed the plating process; specifically copper seed coating using electroless copper and Shadow plating, which is then followed with an electroplating process.

EIPC Summer Conference 2016, Day 1: Strategies to Maintain Profitability in the European PCB Industry

Resplendent in the kilt, EIPC chairman Alun Morgan welcomed a large and enthusiastic gathering of printed circuit professionals from all over Europe and as far afield as the USA, Canada and Russia, to the EIPC Summer Conference 2016 in Edinburgh, Scotland's cosmopolitan capital city.

Institute of Circuit Technology Annual Symposium

On June 1, Technical Director Bill Wilkie introduced the 42nd Annual Symposium of the Institute of Circuit Technology, at the Motorcycle Museum in Birmingham, UK, commenting upon the success of the recent Foundation Course and acknowledging the sterling efforts of his course tutors, although recognising that some of his longest-standing experts were now retiring.

Laser Pointers: Automate to Innovate in Flex Processing

The growing market demand for mobile devices, wearables and Internet of Things (IoT) devices continues to create new challenges for suppliers and manufacturers in the electronics value chain. Along with this market demand comes a challenging set of market requirements for the underlying circuits and components that drive such devices.

Graphene-based Transparent Electrodes for Highly Efficient Flexible OLEDs

The arrival of a thin and lightweight computer that even rolls up like a piece of paper will not be in the far distant future. Flexible organic light-emitting diodes (OLEDs), built upon a plastic substrate, have received greater attention lately for their use in next-generation displays that can be bent or rolled while still operating.

Global Technology Development: HDP User Group European Meeting 2016

Delighted and honoured to be invited again to attend the open session of the High Density Packaging User Group (HDPUG) European Meeting, I made my way to the picturesque Grand Duchy of Luxembourg, a tiny principality bordered by Belgium, France and Germany, and ranked among the world's top-three nations in both wealth and wine consumption, to learn about the latest in collaborative research and development by member companies engaged in the manufacture of products utilising high-density electronic packages.

Weiner’s World

Gen Consulting Company (GCC) has issued the Radiant Insights report “Global HDI Printed Circuit Board Market Forecast and Analysis 2016-2021.” The report provides a detailed analysis of worldwide markets for HDI printed circuit boards from 2011–2016, and provides market forecasts for 2016–2021 by region/country and subsectors.

All About Flex: Flexible Circuit Fabrication and Cleanroom Manufacturing

Facility cleanliness is a vital part of process control for flexible circuit fabricators. As higher density requirements continue a relentless drive toward finer traces and spaces, particles and foreign material can cause problems in a number of operations.


All About Flex: Imaging Methods for Etch Resist, Part 2: Photoimaging

This is the second of three columns describing typical methods for creating an etch resist for fabrication of printed circuits. Photoresist can come in the form of a liquid that gets coated on the substrate or as a dry film that is laminated. Liquid and dry film resist can be positive-acting or negative-acting.

The Right Approach: Quick & Easy 6S to Reduce Handling Issues

Handling is often the source of many pain points for PCB fabricators, resulting in rework, scrap and customer returns. Quick & Easy 6S is a fantastic tool to minimize handling risk by reducing product travel and improving shop cleanliness.

All About Flex: Flexible Circuits and Kaizen Events

All Flex uses a variety of different tools and techniques in its continuous improvement efforts. A Kaizen event or Blitz is one technique that has resulted in significant improvements in our yields, productivity and customer satisfaction.

Flexible Thinking: Process Engineering—PCB Manufacturing’s ‘Delta Force’

Process engineers serve a vital function on the front line of printed circuit manufacturing. They are often, if you will, the “Delta Force” that subdues and controls that which is one of the mortal enemies of manufacturing…process variation.

IMPACT Washington, D.C. 2016: Industry Leaders Advocate for a Pro-Manufacturing Policy Agenda

IPC places a high priority on educating government officials about key policy issues of importance to the electronics industry. That’s why top executives from leading electronics companies gathered in Washington, D.C. recently for “IMPACT Washington, D.C. 2016.”

Stepping up to Laser Processing for Flex, Part 3: Readiness and Site Preparation

With so many processes to keep track of in a flex manufacturing line, it can be easy to get lost in the details and begin to rely on your suppliers to address any issues that might crop up. However, given that laser processing equipment and flex materials are both impacted by your facilities, your attention to and investment in clean, stable, and robust facilities and support equipment will quickly pay off in less downtime, higher yield, and—perhaps most importantly—fewer headaches!

Happy’s Essential Skills: Technical Writing

Technical writing is one of those topics that they don’t really talk about in college—at least not where I went. Writing and English has never been a strong like of mine compared to science and math. So I did my required time in English and wrote my lab reports the best I knew how.

Beyond FR-4: High-Performance Materials for Advanced Designs, Part 1

In the past 40-plus years of PCB manufacturing, the primary material of choice has overwhelmingly been e-glass supported FR-4 resin laminates. This is due to the excellent dimensional stability and reasonably acceptable thermal performance (based on glass transition temperature [Tg] and decomposition temperature [Td]). In general, these materials exhibit impressive performance and excellent cost for a wide range of applications.

Weiner’s World

3D printing, China’s SMT equipment and robotics markets, IPC’s mandate, counterfeiters, and Taiwan PCB makers’ shift to automotive electronics—Gene Weiner talks about these things and more in this new article.

All About Flex: Imaging Methods for Etch Resist, Part 1

Imaging is a major process step in creating a copper circuit or flexible PCB. In single-sided circuit fabrication, the imaging process creates the resist pattern that protects the copper from the etchant. It is critical that this pattern precisely define the circuit traces, as issues with imaging will transfer to the subsequent processes.


Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 5

The outline profile of the flexible circuit is seldom uniform. One of the primary advantages of the flexible design is that the outline can be sculpted to fit into very oblique shapes. This month, Vern Solberg focuses on outline planning, physical reinforcement, and accommodating bends and folds in flexible and rigid-flex circuits.

Ventec International Group Expands North American Focus

Ventec International Group is looking to expand their U.S. operations, and they’ve begun this process by bringing Chris Alessio on board as VP of sales and operations of Ventec USA. I met with Chris and Ventec USA President Jack Pattie at IPC APEX EXPO 2016 to discuss their approach and possible opportunities for the North American laminate market.

All About Flex: Lean Manufacturing and NPIP for Flexible Circuits

Many companies are familiar with lean manufacturing concepts and have successfully used these techniques to improve manufacturing processes. Lean techniques, while most often used in printed circuit fabrication and assembly operations, can also be applied to nonmanufacturing processes. One such process is new part number introduction (NPIP).

Flex Talk: PCB Sourcing? One Size Does Not Fit All

When analyzing a set of PCBs to improve yields and maximize profits, the first place to start is with a critical review of each PCB design. Are there any attributes that are pushing your manufacturer’s standard design rules? If so, is this necessary to the design or is there another approach that could improve the manufacturer’s yields, reduce cost, and ultimately increase profit?

LPKF Launches New Laser Drilling System for Flex Printed Circuits

At Laser World of Photonics Exhibition in Shanghai recently, I had a chance to speak with Florian Roick, strategic product manager with LPKF. The company is celebrating a big anniversary this year with the launch of a laser drilling machine to support the specific requirements of the flexible circuit industry.

A Salute to Process Engineers

It seems very appropriate, coming on the heels of IPC APEX EXPO 2016, that the focus of our April issue is process engineering. I believe process engineers (and process engineer types) are the worker bees of IPC (and obviously of the companies they work for).

Stepping Up to Laser Processing for Flex, Part 2: Calculating and Optimizing Production

In Part 1 of this series, we discussed the advantages of adding flex laser processing to gain a competitive advantage. In Part 2 we will build on that discussion, looking at the ways you can optimize your flexible circuit laser processing to get the efficiencies that drive lower cost of ownership.

All About Flex: Why Copper is Ideal for Flexible Circuitry

Copper is the second-most conductive metal (in pure form). The copper used on flexible circuits can be formed by a number of methods such as electro-deposition (ED), rolling/annealing, or a combination of the two. The conductivity of copper by volume on a flexible circuit is not exactly the same as pure copper, but it is quite close.

IPC APEX EXPO: IPC Government Relations—Your Advocate in Washington

IPC's VP of Government Relations, John Hasselman, explains IPC's "meet the policy makers" initiative (site visits by congressmen) to help build and broaden relationships with these decision makers.

The Importance of Choosing Equipment Suppliers Carefully and Investing in the Future

Burkle Process Technologies, a long-time PCB equipment supplier to high-end manufacturers in the world, is seeing their business continuing to grow despite the perceived slowdown in the industry in China. They ensure this by working closely with customers, making premium products to understand future technology needs, and offering the highest quality in laminating machines and technical support.


Happy’s Essential Skills: Failure Modes and Effects Analysis (FMEA)

Failure modes and effects analysis (FMEA) is a systematic process to evaluate failure modes and causes associated with the design and manufacturing processes of a new product. It is somewhat similar to the potential problem analysis (PPA) phase of the Kepner-Tregoe program.

Weiner’s World: March 2016

Sellers of equipment at the Shanghai CPCA event complained of continued poor business. This was especially evident amongst those selling to firms building boards for phones and other portables devices as indicated below. However, not all reports were bad. Major fabricators such as Wu's in China, not dependent upon HDI or flexible products, stated that they were "satisfied" with their current business levels.

Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 4

All of the design rules for the glass reinforced-portion of the board (land pattern geometry for mounting surface mount devices, solder mask and the like) are now well-established. One unique facet of fabricating the rigid-flex product is how the flexible portion of the circuit is incorporated with the rigid portion of the circuit. As a general rule for multilayer PCB design, furnish a balanced structure by building up the circuit layers in pairs (4, 6, 8 and so on).

The Supplier View: An Interview with Hamed El Abd

I sat down with WKK’s Hamed el Abd at CPCA, where we discussed the show, the growing trend toward automation, as well as a few other topics, namely world politics and economics and how they relate to the PCB industry.

Lean Manufacturing and NPIP for Flexible Circuits

Many companies are familiar with lean manufacturing concepts and have successfully used these techniques to improve manufacturing processes. Lean techniques, while most often used in printed circuit fabrication and assembly operations, can also be applied to nonmanufacturing processes. One such process is new part number introduction (NPIP).

IPC APEX EXPO: Gardien Discusses Providing Test Solutions with an Integrated Partnership

Gardien's VP of Quality, Todd Kolmodin, tells Guest Editor Dan Beaulieu about their customer partnership program, helping to provide solutions to their customers' test and quality issues.

IPC APEX EXPO: Design Through Box-Build Strategy Works for PNC Inc.

Guest Editor Dan Beaulieu talks with PNC's production manager, Bhavesh Sangani, about PNC's "design through box-build" strategy along with their significant capital equipment purchases over the past few years for both PCB fabrication and assembly.

Patricia (Patty) Goldman Inducted into IPC Hall of Fame

We at I-Connect007 are thrilled that our own Patty Goldman has been awarded the highest level of volunteer recognition that IPC can give to an individual, the Raymond E. Pritchard Hall of Fame Award. The award is given in recognition of superior achievement, extraordinary contributions and distinguished service to IPC and the advancement of the electronics industry.

Happy’s Essential Skills: Design of Experiments

Design of experiments (DOE) is one of the most powerful and influential engineering tools for product yield improvements, new products or processes development, or for problem solving. As mentioned in my last column, process problems led me to a career in printed circuits, and quickly solving those problems led me to a bonus stock award and a great life. Even though I knew nothing about printed circuit manufacturing processes, I was able to quickly find the root causes of all the problems and fix them. My secret? Total quality control (TQC), statistics, and DOE.

Rex Rozario, Part 4: A 10,000-ft. view of his Business Ventures, the Industry, and Life

In our final installment, Rex describes the common thread woven through all of his successful business ventures and varied interests: confidence and the fortitude to follow his dreams until they are realized. Rex also takes a look back at the evolution of the global PCB industry, and explains his approach to profitability, which includes building (and rewarding) a successful team.


Rex Rozario, Part 3: The Future Beckons

In Part 3 of our multi-part interview with industry veteran Rex Rozario, we begin with the future. Having achieved success in China, could Rex and the Graphic team have their sights trained on the U.S.? Also in this installment, Rex weighs in on China’s future, and we discuss the value of automation. Is it for everyone?

Rex Rozario: The PCB Industry’s True Renaissance Man

In this exclusive multi-part interview that was conducted recently, I-Connect007's Barry Matties will introduce you to all of the people that Rex Rozario is, and where he, his team, and Graphic PLC are headed to next.

All About Flex: Three Emerging Trends That You Can Bet On

Flexible circuits are light weight, require minimal space, can be bent into “origami” shapes for adoption to a wide range of applications. These utilitarian features give electronic designers endless options for the new and exciting products that will soon become part of our everyday life.

Manufacturing Institutes Can Boost the Nation

In his most recent State of the Union address, President Obama highlighted a remarkable trend of recent years: the turnaround in many corners of America’s manufacturing sector. Nearly 900,000 new jobs have been created by U.S. manufacturers in the last six years.

The Sum of All Parts: The Cost of Quality

Throughout the decades, irrespective of industry or sector, markets have thrived on competition. They have, however, also relied upon some semblance of unity within their respective competitors. Industries rely upon their individual member companies’ ability to work together for the greater good.

The Institute of Circuit Technology Tewkesbury Seminar, 1st March 2016

The Annual General Meeting of the Institute of Circuit Technology (ICT) was held at Puckrup Hall, near Tewkesbury in Gloucestershire, England, on 1st March 2016, and was followed by a well-attended evening seminar with presentations on a novel laser-induced deposition process, an analysis of the market for PCBs, and a review of three development projects in which the Institute had participated. The programme was introduced and moderated by ICT Technical Director Bill Wilkie.

Printing PCBs…In Your Office!

The days of producing a PCB prototype with a 3D printer may not be as distant as you think. I spoke with Simon Fried of Nano Dimension about how 3D printing is becoming a reality, and how this disruptive technology will change the way designers produce rapid prototypes.

Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 3

This installment of "Designers Notebook" will focus on methods for specifying base materials, and also address copper foil variations and fabrication documentation. It is important to research the various products in order to choose the one that best meets the design requirements.

Stretchable Electronics that Quadruple in Length

EPFL researchers have developed conductive tracks that can be bent and stretched up to four times their original length. They could be used in artificial skin, connected clothing and on-body sensors.

The Quiet Mainstreaming of HDI Manufacturing

Advances in technology continue to push the envelope of what’s possible. And nowhere has the impact of those advances been felt more profoundly than in the evolution of the current class of mobile devices. Although design engineers have driven this evolution, primarily through addressing market demand for new form factor innovation, the push to meet the associated manufacturing challenges has been responsible for a revolution in PCB manufacturing.


Flex: Just What the Doctor Ordered for Medical Devices

Medical devices represent one of the fastest growing electronic markets in the United States. The drive for reduced space and weight, added functionality, and reduced cost has driven the adoption of a wide array of custom flexible circuits. The design freedom offered by this three-dimensional interconnect supports the packaging design requirements for a myriad of diverse applications within the medical electronic market.

Designers Notebook: Flex and Rigid-Flex Circuit Design Principles, Part 2

In this installment of "Designers Notebook," Vern Solberg discusses supplier assessment, planning of the flexible circuit outline, and various circuit routing principles. Communication between designer and fabricator is paramount, as well as an understanding of IPC-2223, which sets the specific requirements for the design of flex circuits.

The Pinless Registration System, Explained by DIS’ Bernd Gennat

I sat down at productronica recently with Bernd Gennat, VP sales Asia and Europe for Duetto Integrated Systems (DIS Inc), for an overview of the industry, including his company’s technology. Our discussion touched on trends in multilayer registration, market requirements in Europe compared with those in China, and the benefits of pinless over hard-tooled registration systems for current and future rigid, flex and flex-rigid constructions.

Mr. Laminate Tells All: CEM-3 Reinvents Itself (Again)—or, Atari Game Boards on eBay?

CEM-3 was unusual as the reinforcement was a combination of woven fiber-glass fabric and fiber-glass paper. The resin system was a dicy-cured epoxy resin yielding a Tg the same as FR-4 at the time, of 110–120°C range. Because it was all epoxy and all fiberglass, the properties were electrically identical to those of FR-4.

What a Long, Strange Trip it’s Been—and It’s a Long Way from Being Over

Harvey Miller has been in the PCB industry for more than 40 years, and he’s probably seen it all. I recently sat down with Harvey at a wine bar in Palo Alto to learn more about his history in the industry and where he sees it going forward. Harvey arrived wearing jogging shorts and running shoes. No surprise after what his doctor recently shared with him.

New Year, New Outlook for the Electronics Manufacturing Industry

As an advocate for the electronics manufacturing industry, my job is to educate and encourage policymakers to create a favorable legislative and regulatory environment for advanced manufacturing to grow and succeed. From that perspective, I think we should be proud of the significant progress we made in several areas in 2015.

All About Flex: Flexible Circuit Antennas

In our world of fabricating custom electronics, a circuit can generally be defined as “a path between two or more points along which an electrical current is carried.” The printed circuit board industry designs and fabricates an incredibly diverse set of rigid and flexible circuits. But it is also true this industry produces many parts that do not carry current between discreet points.

How North American Fabricators Benefit from Attending HKPCA

Two New Englanders in Shenzhen. It sounds like the title of a play, doesn’t it? Headlining the bill is Peter Bigelow of IMI, who explains to me why even small American manufacturers benefit from attending large Chinese shows like the HKPCA. He’s joined by fellow New Englander Alex Stepinski of Whelen Engineering, who discusses drill concepts and the transition to zero discharge.

In Their Words: Hong Kong Printed Circuit Association (HKPCA)

Recently, we sent a questionnaire to a number of printed circuit associations around the world, asking them to tell us a little about their organizations. With the annual HKPCA & IPC show having just ended, this information provided by HKPCA is especially interesting.

Happy’s Essential Skills: The Need for Total Quality Control (Six Sigma and Statistical Tools), Part 2

The statistical representation of Six Sigma describes quantitatively how a process is performing. To achieve Six Sigma, a process must not produce more than 3.4 defects per million opportunities. A Six Sigma defect is defined as anything outside of customer specifications. A Six Sigma opportunity is then the total quantity of chances for a defect.


In Their Words: The IPCA–India Printed Circuit Association

To better understand the many associations serving the global electronics industry, I-Connect007 conducted many interviews for this month’s issue, as well as distributed several questionnaires, one of which was to IPCA (India Printed Circuit Association). The IPCA is not part of IPC, though the two associations do collaborate. Secretary K. S. Babu responded on behalf of IPCA President Viral Bhulani.

Designers Notebook: Flex and Rigid-Flex Circuit Design Principles, Part 1

In his new Designers Notebook column, Verb Solberg discusses primary flex circuit structures, proper design for operating environment, and base material selection. The design guidelines for flexible circuits, although similar to those for rigid circuits, have distinctive differences that are influenced by specific applications and the intended operating use environments. Communication with your fabricator is paramount when designing flex and rigid-flex circuits.

All About Flex: High-Temperature Performance Flexible Circuits

Markets requiring thermal exposure at elevated temperatures include down-hole oil drilling, semiconductor processing, medical diagnostics and a multitude of military/aerospace requirements. But a limitation of flexible circuitry has been performance at extremely high temperatures.

Happy’s Essential Skills: The Need for Total Quality Control (Six Sigma and Statistical Tools): Part 1

In this first of many columns covering my "Twenty-Five Essential Skills Every Engineer Needs to Learn," I will expand on each of those skills. To read the introduction to this series, which published in the January issue of The PCB Magazine. As a quick recap, here are the 25 skills that I will be writing about over the next 18 months or so, to publish every three weeks or so in the PCB007 Daily Newsletter.

Weiner's World

In this article, industry veteran Gene Weiner looks back at some of the industry highlights in 2015, and ponders on the challenges and opportunities to expect this year. He also highlights recent industry events, including the 2015 International Printed Circuit & APEX South China Fair and SEMICON Japan.

CES: Day One

CES Unveiled is the official media event for CES. It is the first official happening of what promises to be a very busy and fascinating week. At this event, members of the press get to preview a number of innovative startups as well as some new products from a few established global brands.

IPC’s Fern Abrams: Keeping up with Regulatory Matters

Recently, I met with IPC’s Director of Regulatory Affairs and Government Relations, Fern Abrams. In the course of our conversation, we delved into everything from what her role entails and recent regulatory matters, to some of the group’s successes and why companies need to get involved (it matters to your representatives in Congress or Parliament).

2015’s Most Read PCB Articles

Every year, we like to take a look back at the most popular PCB news and articles. These are the top 10 most-read PCB articles from the past year. Check them out.

Dave Bergman: IPC’s Technology & International Reach

I met with the IPC’s VP of Standards and Technology, Dave Bergman, while in Chicago recently. I’ve known Dave for almost 30 years, so we had quite a chat, covering a lot of ground, from the efforts of IPC China and IPC India, to the standards activities that are certainly the core activity of IPC.

A Conversation with IPC President and CEO John Mitchell

I-Connect007's Patty Goldman was able to sit down with John Mitchell, president and CEO of IPC, to discuss the organization and where we are going as an industry. We discussed IPC’s four aspirational goals—standards, education, advocacy and solutions—as well as short-term goals. We also talked a bit about going virtual and becoming paperless.


All About Flex: Saying Yes

During the Reagan presidency, First Lady Nancy Reagan championed the advertising slogan “Just say no” as part of a “War on Drugs” campaign. The message of the campaign was intended to protect children from the harmful effects of illegal drug use by offering various ways of saying “no.”

What is the Internet of Things and Why Should it Matter to Us?

It is often surprising how closely our science fiction novels and movies model the future. The Internet of Things (IoT) and big data may prove to be an excellent example of this phenomenon. Coined in 1999 by Kevin Ashton (the RFID standards pioneer), the IoT is one of the least descriptive monikers of all time for something very important in the history of technology.

Catching up with Gardien’s Rick Meraw

There are companies out there who are truly changing the world—companies who are making a dent in the universe, to quote the late Steve Jobs. Gardien is one of those companies. So much so that I like to catch up with them on a regular basis because they’re always adding something to their repertoire and it’s typically something that helps improve the way we handle quality assurance in our industry.

All About Flex: Process Controls for Flexible Circuit Fabrication

Manufacturers of flexible circuits use several chemical processes for fabrication. These processes are generally located in a common area of the plant because of facility requirements and environmental considerations. These chemical operations are referred to as wet processes.

The Associations Issue

Well, it’s the end of the year. How did that happen? It really is true that every year goes by a little faster. You young whippersnappers out there won’t know what I’m talking about, but just you wait and see. We changed it up for our December issues this year. Instead of doing a year-end review, we decided to devote this month to our associations and trade organizations—at least some, because when you start poking around, you will find there are scads of them.

MacDermid’s Research Team Talks New Cyanide-free Immersion Gold at SMTAI

While at SMTAI in Chicago recently, I met with two of MacDermid’s research team, Jun Nable, research project manager, who has been with MacDermid since 2007, and Cherry Santos, associate research fellow responsible for formulation work for metal plating solutions. We talked about the posters they were presenting and why they chose SMTAI.

Catching up with Winonics’ Mark Eazell

I have always thought of Winonics as one of the hidden gems of the North American PCB industry. Their well-equipped and well-laid-out facility in Brea, California is one of the more impressive looking PCB facilities in North America today. Winonics is one of three PCB companies owned by JR Controls, the other two being Cosmotronic and Bench2Bench. I had the opportunity to talk with Mark Eazell, the general manager at Winonics, who also oversees the operation of all three JR Controls’ PCB companies.

Behind the Scenes with IPC Technical Conference Coordinator Toya Richardson

I have known and worked with IPC Technical Conference Coordinator Toya Richardson for quite a few years, but we have never had an in-depth chat about her job at IPC. In this interview, she talks about her work at IPC, their preparations for the upcoming IPC APEX EXPO 2016, and some of the latest developments at IPC.

productronica 2015: Ventec's Latest Developments in the UK

Ventec continue to invest in the pursuit of ultra-cleanliness in pre-preg fabrication and packaging in their UK distribution operation, and announce a range of complementary consumable materials - foils, drill boards and release films - as proven in their Ventec-Option laminating and drilling service, leveraging their purchasing power and sharing the cost benefits with their laminate customers.

All About Flex: Embracing the Mess

Marketing in the world of printed circuits is an important discipline, but I have learned it is better to be prepared with a nimble reaction than to expect the marketing department to consistently be successful in predicting the future. The path to the goal is often achieved much more quickly by making an early decision followed by a course correction rather than waiting for all the information.


Navigating the Global Materials Supply Chain: A Roundtable Discussion

At SMTAI recently, I-Connect007's Andy Shaughnessy sat down for a roundtable discussion with some key players from the materials side of the supply chain. Participants included two executives from Ventec: Mark Goodwin, COO USA and Europe for Ventec International Group; and Jack Pattie, president of Ventec USA. Also participating in the roundtable were Schoeller Electronics CEO Michael Keuthen and Bob Willis, from the National Physics Laboratory (NPL).

HKPCA Executive Director Daniel Chan on the Upcoming Show and More

Daniel Chan discusses the latest developments to expect at this year's HKPCA and IPC show, and the new features that the show will offer delegates and attendees. He also speaks about the trends to expect in the PCB manufacturing industry, and the major drivers of innovation.

All About Flex: Flexible PCB: What’s in a Name?

Flexible PCB is a common term that is synonymous with flexible circuits. While the term “PCB” is generally used to describe rigid printed circuitry, “flexible PCB” is a little contradictory because “boards” aren’t really flexible. Some companies, like All Flex, design and manufactures flexible PCBs, but not rigid PCBs.

Flex Talk: Thoughts on the IPC Flexible Circuits–HDI Forum

As an attendee at the IPC Flexible Circuits–HDI Conference held October 28–30, I found myself in a room full of people, all eager for technical information, with the opportunity to reconnect with industry friends and to make new connections. The audience was diverse with young people, new to our industry, sitting alongside industry veterans willingly sharing their knowledge and passion for HDI design and flexible circuit technology.

productronica 2015: Orbotech's Nuvogo 1000 Brings High Speed to Solder Mask LDI

28 watts of laser power enables the Nuvogo 1000 dual wavelength direct imaging system to achieve production throughput for solder mask up to 40 double-sided panels per hour, while retaining the versatility to image inner layer and outer layer features as fine as 24 microns.

Catching Up with Circuit Connect

When I met with Circuit Connect President Bob Lazzara and Director of Operations Paul LaLiberte, I was first struck by the passion they both have for their customers, as well as for their customers’ businesses, using the innovation they have today, as well as what they can develop together with their customers. They don’t just invite, but urge their customers to come and visit them in their very well-equipped facility in Nashua, N.H.

All About Flex: Flexible PCB: What’s in a Name?

Flexible PCB is a common term that is synonymous with flexible circuits. While the term “PCB” is generally used to describe rigid printed circuitry, “flexible PCB” is a little contradictory because “boards” aren’t really flexible. Some companies, like All Flex, design and manufactures flexible PCBs, but not rigid PCBs. There are many similarities between the two, but also significant differences.

Designs on Flex: Underwriters Laboratory and Flexible Printed Circuits

Underwriters Laboratory is a worldwide safety consulting and certification company headquartered in Northbrook, Illinois. UL certifies, validates, tests, inspects, audits, and advises on safety of electrical and electronic products.

Mr. Laminate Tells All: Where in the Holy Halogens did 900, 900, 1500 Come From?

The 900, 900, 1500 is not a combination to an enormous safe that contains the remains of Jimmy Hoffa, nor is it the weight of three elephants at the San Diego Zoo in kilograms. The 900, 900, 1500 is the maximum parts per million (ppm) of bromine and chlorine and the total bromine and chlorine in a material that can be defined as “halogen-free” in the electronics industry today. But where did these requirements come from? Clearly, 900 ppm of bromine or chlorine is obviously not halogen-free. Some would argue that it is not even low-halogen at all.

Catching up with Cosmotronic’s Gary Abel

Cosmotronic’s history spans a number of decades, from the hot-as-hell boom days of the '60s and early '70s when Southern California was leading the world in electronics, from weaponry to avionics to apace exploration. Today, as innovation has become more focused on personal electronics, Cosmotronic has been there, leading the way and serving a customer base that is uniquely similar to the one they had back in the day.


Cycle Time Reduction in a Flexible Circuit Facility

Managing product flow and cycle time across a wide range of product constructions and volumes in a high-mix flexible circuit fabrication facility can be extremely challenging. What seems to work best is a tailored hybrid system, with concepts adopted from classic just in time manufacturing (JIT), theory of constraints (TOC) and quick response manufacturing (QRM).

All About Flex: Plated Through-holes in Flexible Circuits

There is probably no more important feature than the plated through-hole (also called via or via hole) with regard to the reliability and integrity of a flexible circuit. The through-hole provides electrical connection between insulated layers and enables electrical functionality on double-sided and multilayer flexible circuits.

Flex Circuit Shielding Design Options

Shielding may not be your company’s number one design concern when thinking about your interconnect designs. But if you have to shield circuits for EMI, then you will need to depend on your supplier to assist you with their favorite shielding technique and experience.

Interim CEO Jeff McCreary Discusses Recent Changes at Isola

Isola’s Interim President and CEO Jeff McCreary explains to Barry Matties the impetus for the personnel reduction taking place at Isola, the closing of their northern California facility, and why there’s no need to panic. He also shares his view of what the industry may expect from Isola going forward and what the company is looking for in a new CEO, the name of which McCreary expects to announce in the next few months.

Testing Flexible Circuits, Part 3: The Completed Flex Circuit

Most flex houses perform a variety of tests on completed flexible circuits. The type, frequency, and complexity of these tests vary with customer and application. Test requirements are generally defined by the customer, but input is often solicited from the supplier during the quote process.

Stepping Up To Laser Processing for Flex, Part 1: Opportunities and Implications

Market demand for smaller, faster, wearable, lighter and more powerful devices continues to keep PCB manufacturers scrambling to keep up as they evolve and adapt their manufacturing capabilities to meet changing customer needs. But keeping up with the dizzying pace of change in the world of PCB manufacturing need not be a daunting task.

Testing Flexible Circuits, Part 2: Raw Materials and Components

Even though the raw materials may individually meet certain specifications, it is important to determine if the final product configuration meets those specs. So testing done at the finished circuit level is also needed. Tests specific to the finished circuit will be the topic of our next column on testing.

The Reindustrialisation of Europe

With an inquisitive mind and a head for challenges, besides the ability to think outside the box and the courage to dare to be different and strive to be first, Spirit Circuits MD Steve Driver can be relied upon to grab the attention of an audience of PCB professionals. As keynote speaker at the Institute of Circuit Technology Hayling Island Seminar, he lived up to his reputation with a motivational presentation, the two themes of which exemplified his latest entrepreneurial venture.

Final Surface Finishes for Automotive: No One-Size-Fits-All Solution

Regardless of whether your application is automotive, medical or military, there are many factors to consider when selecting a final surface finish. Cost, lead or lead-free requirements, end environment, shelf life, fine-pitch components, RF applications, probe-ability, thermal resistance and shock and drop resistance, to name a few. There is not a one-size-fits-all finish. Understanding the advantages and disadvantages of each surface finish allows the designer to select the finish that best fits each particular application.

Testing Flexible Circuits, Part I: Requirements and Procedures

In this first of a three-part series regarding tests for flexible circuits, I will examine overall requirements and procedures; the second installment will focus on raw materials, and the third and final part will focus on testing for bare flexible circuit and circuit assemblies.


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