X-ray Inspection


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More Secrets of High-speed PCBs


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DFM Essentials


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Bonus: Companion Guide

Low-temperature Soldering, Vol. 2


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Factory Analytics


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Encapsulating Sustainability for Electronics


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Executing Complex PCBs


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Bonus: Audio Book

IPC Checklist for Producing Printed Board Assemblies

Manufacturing Driven Design


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SMT Inspection: Today, Tomorrow, and Beyond


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Bonus: Companion Guide

Bonus: Companion Guide 2

Process Control


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Flex and Rigid-Flex Fundamentals


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Bonus: Companion Guide

Designing for Reality


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Related Podcast

The Evolving PCB NPI Process


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Thermal Management with Insulated Metal Substrates, Volume 2


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Bonus: Companion Guide

Stackups: The Design within the Design

Related - High Performance Materials
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High Performance Materials

Related - Stackups: The Design within the Design
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Solder Defects


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24 Essential Skills for Engineers

System Analysis


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Bonus: Companion Guide

Smart Data: Using Data to Improve Manufacturing


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Thermal Management: A Fabricator's Perspective


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Process Validation


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Advanced Manufacturing in the Digital Age


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Assessing Your PCB Documentation Process


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Automation and Advanced Procedures in PCB Fabrication


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Producing the Perfect Data Package


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Low-Temperature Soldering


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Thermal Management with Insulated Metal Substrates


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Fundamentals of RF/Microwave PCBs


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Power Integrity by Example


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Conformal Coatings for Harsh Environments


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Signal Integrity by Example


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Secrets of High-Speed PCBs, Part 2


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Solderless Assembly for Electronics: The SAFE Approach


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Secrets of High-Speed PCBs, Part 1


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AS9100 Certification


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PIHR Technology

Survival Is Not Mandatory

The HDI Handbook

Flexible Circuit Technology, 4th Edition

Review from Phil Zarrow

Phil Zarrow

"Dr. Cardoso has given the industry a concise, comprehensive, and very readable quintessential primer on X-ray and its use in electronics assembly to a grateful industry."

Review from Eric Bogatin

Eric Bogatin

"If you are new to designing circuit boards for 10 Gbps and above systems, or touch any part of the PCB supply chain, get a jump up the learning curve from the experience offered in this book from a respected industry expert."

Review from Dana Korf, Principal Consultant, Korf Consultancy LLC

Dana Korf, Principal Consultant, Korf Consultancy LLC

"This book covers essential design considerations to ensure PCB manufacturability. These features impact the overall PCB quality, reliability, and cost-effectiveness. Good practical size and tolerance guidelines are also provided for the designer to meet specifications while yielding the lowest cost. I recommend this for new designers, especially before formal training. Additionally, it’s suitable for school students as part of their science curriculum."

Review from Richard Coyle, Consulting Member of Technical Staff, Nokia Bell Labs

Richard Coyle, Consulting Member of Technical Staff, Nokia Bell Labs

"Readers will find this book provides technical insights into the ever-evolving challenges of the assembly and reliability of low-temperature solder alloys. This second volume includes updates on fourth-generation low-temperature solders and a preview of the capabilities of ultra-low temperature (ULT) solders."

Review from Alejandro Carrillo, Founder/General Manager, InterLatin

Alejandro Carrillo, Founder/General Manager, InterLatin

"Factory Analytics is great reading! Data analytics provides evidence of sustained performance and continuous improvement. This book also covers new tools like machine learning and how AI will bring new levels of factory analytics and efficiency."

Review from Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.

Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.

"Readers will learn the advantages and disadvantages of different encapsulation materials and the importance of the application process. In order to find the right balance between benefit and effort, the author suggests using analytical approaches to configure the process and its settings. Additionally, she is always conscious of the need for sustainability when it comes to electronic assemblies."

Review from John R. Watson, Legrand North America

John R. Watson, Legrand North America

"At a time when electronics are not just taking small steps but rather large leaps forward, this is an appropriate book for anyone working with PCB design. With countless and ever-changing steps involved in every design, it presents a clear understanding of the process. This book will be the go-to reference for all of our designers at Legrand North America."

Review from Ammar Abusham, DFM Integration Engineer (AR EE Team), Meta Reality Labs

Ammar Abusham, DFM Integration Engineer (AR EE Team), Meta Reality Labs

"This book effectively addresses the need for early integration of manufacturing elements into the design process. In an industry racing against time, MDD is the key to staying ahead. "

Review from Christopher St. Mars, Process Engineer, Intervala

Christopher St. Mars, Process Engineer, Intervala

"This book offers an accurate look at the aspects and challenges the electronics manufacturing industry faces with regards to SMT Inspection and its surrounding technology. In-depth insight on new and exciting true 3D inspection technology is provided, with a look into the future of leveraging big data management and autonomous manufacturing for a smarter factory."

Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification. "

Review from Dan Beaulieu

Dan Beaulieu

"A "must-have" guidebook for everyone involved in Flex technology."

Review from Bob Tise, R&D Engineer, EMP Shield

Bob Tise, R&D Engineer, EMP Shield

"PCB design is as much art as science. While reading this book will not, itself, make you a professional PCB designer, it will help you make better decisions and trade-offs, saving time and money."

Review from Nick Niculita, Engineering Manager, SRXGlobal

Nick Niculita, Engineering Manager, SRXGlobal

"This book is a must-read for everybody who wants to improve the overall design-through-manufacturing NPI phase and ultimately do more with less, the Holy Grail of any manufacturer."

Review from Kyle Burk, PhD, President and Director of Engineering for KBJ Engineering, LLC

Kyle Burk, PhD, President and Director of Engineering for KBJ Engineering, LLC

"This textbook is a great addition and supplement to the first edition. It delves deeper into the science of insulated metal substrates and their useful, often overlooked, properties for proper thermal management."

Review from Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.

Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.

"From novice board designers to experienced signal integrity engineers, this book has something for everyone involved with PCB stackups. A must-read for anyone having to work with PCB fab shops"

Review from Mark Thompson, Engineering Manager, Out of the Box

Mark Thompson, Engineering Manager, Out of the Box

"I love this book. Particularly the sections on the effects of the glass weave, the history of laminate, and the difference between Dk and Effective Dk. I highly recommend this book for any designer or engineer looking to better understand laminate!"

Review from Joe O'Neil, Principal, OAA Ventures

Joe O'Neil, Principal, OAA Ventures

"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."

Review from Lee Ritchey, Founder and President, Speeding Edge

Lee Ritchey, Founder and President, Speeding Edge

"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."

Review from Marius Stepanescu, Technical Director, ICCO EMT

Marius Stepanescu, Technical Director, ICCO EMT

"The Printed Circuit Assembler's Guide to... Smart Data explains the role of data acquisition and analytics in Industry 4.0. This book provides a very good description of the main challenges of collecting and handling smart data and analyzing it in the proper way."

Review from Dr. Johannes Adam, Consultant, ADAM Research

Dr. Johannes Adam, Consultant, ADAM Research

"If you want to know what measures you can take to keep your PCB cool, you need to read this book. The technologies and manufacturing processes for thermal management are summarized and presented in a unique way. "

Review from Mike Cummings, Technical Director, TSI

Mike Cummings, Technical Director, TSI

"Well-written and easy to follow, this dedicated book focuses on the importance of cleaning and decontamination of electronic circuits before application. This topic is timely and important, considering the increasing importance of high-reliability electronics, security, and safety in an increasingly connected world. "

Review from Happy Holden, Consulting Technical Editor, I-Connect007

Happy Holden, Consulting Technical Editor, I-Connect007

"This is essential reading for those who are wondering, "What can smart factories do for me?" The Mentor/Siemens description of how Industry 4.0 can benefit an electronics manufacturer, and how to go about using such a concept, is both detailed and easy to understand. It is one of the best books on the subject!"

Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison

Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison

"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."

Review from Alex Stepinski, vice president, GreenSource Fabrication

Alex Stepinski, vice president, GreenSource Fabrication

"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences. "

Review from Dan Beaulieu, president, D.B. Management

Dan Beaulieu, president, D.B. Management

"If you are serious about creating the best, most perfect data packages available today, do yourself a favor. Download and read this book. It’s simple—the better the package, the better the board. "

Review from Happy Holden, Consulting Technical Editor, I-Connect007

Happy Holden, Consulting Technical Editor, I-Connect007

"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."

Review from Alun Morgan, Chairman, EIPC

Alun Morgan, Chairman, EIPC

" A comprehensive tour through the world of thermal management. Required reading for designers and end users wishing to understand the science and practice of using insulated metal substrate materials."

Review from Mark Thompson, customer technical liaison at Prototron Circuits

Mark Thompson, customer technical liaison at Prototron Circuits

"From someone who has been on the board fabrication side for over 30 years attempting to explain all these things to customers, I can say this book is a 'must-have' for anyone who wants to make sure they get their product to perform the way they want it to."

Review from Gene Garat, President, Moss Bay EDA

Gene Garat, President, Moss Bay EDA

"Engineers new to the field as well as career veterans can all benefit from this quick read, well-illustrated with plenty of examples."

Review from Dr. Helmut Schweigart, Technology Development Head, Zestron Europe.

Dr. Helmut Schweigart, Technology Development Head, Zestron Europe.

"This micro eBook offers a comfortable approach to the selection, implementation, and testing of protective coating processes. It would be especially helpful for starters to use as a checklist for operational implementation."

Review from Eric Bogatin

Eric Bogatin

"If you care about signal integrity, you are sure to pick up a few nuggets of insight from this new eBook."

Review from Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.

Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.

"I wish I had these books when I was starting out in my career."

Review from David M. Griffith, BSc Geophysicist

David M. Griffith, BSc  Geophysicist

"Must admit the philosophical arguments–e.g. simplification and welfare of all–caught my attention more than the technical stuff. I was able to keep up with the technical stuff (there's simplification for you) for the most part and the figures spoke volumes (a picture is indeed worth a thousand words) for the advantages of SAFE."

Review from Eric Bogatin

Eric Bogatin

"The Printed Circuit Designer's Guide to... Secrets of High-Speed PCBs, Part 1 pulls back the covers to illustrate the practical principles behind many of the confusing topics that arise in the overlap between manufacturing, materials, and signal integrity performance."

Review from Dan Beaulieu

Dan Beaulieu

"This book is long overdue. Finally, a book on AS9100 certification written in clear and concise language.""