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Flexible Circuit Technology, 4th Edition provides the basic knowledge required to design, manufacture and use flexible circuits while avoiding many of the potential problems that may be encountered by those who attempt to learn from their own experiences. Previous editions of the book have proved a valuable resource for those new to the technology and have served as a quick reference for those with a working knowledge of flexible circuits and their applications. 

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In the global economy that is today’s business environment, there are no guarantees. In this environment, the big continue to get bigger through acquisition or elimination of the competition. Never before has US manufacturing had to look over our shoulder as we do now.

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The widespread use of new electronic components employing Ball-Grid Array (BGA), Chip Scale Packaging (CSP), and other evolving technology form-factors means new fabrication techniques must be used to create printed circuit boards (PCBs) that will accommodate parts with extremely tight lead pitches and small geometries. 

 

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Reflow soldering of through hole components can simplify the entire assembly process for companies running tin/lead or lead-free and continue to maintain the quality and reliability of the products being built. The reflow-only process can also eliminate the cost and waste associated with wave and selective soldering. By eliminating two processes, floor space and energy costs can be reduced--a definite advantage to the end user.


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PCB designers and design engineers currently see getting a design right the first time as a foreign concept. The trial-and-error design method has been the rule, not the exception, since the advent of transistor-transistor logic (TTL). Chapter 1 looks at rules of thumb, design rules, and the recent movement to get PCB designs right the first time. 

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