Design for Test: A Practical Guide to Test and Inspection


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UV Curable Conformal Coatings


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X-ray Inspection


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More Secrets of High-speed PCBs


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DFM Essentials


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Bonus: Companion Guide

Low-temperature Soldering, Vol. 2


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Factory Analytics


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Encapsulating Sustainability for Electronics


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Executing Complex PCBs


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Bonus: Audio Book

IPC Checklist for Printed Board Assemblies

Manufacturing Driven Design


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SMT Inspection: Today, Tomorrow, and Beyond


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Bonus: Companion Guide

Bonus: Companion Guide 2

Process Control


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Flex and Rigid-Flex Fundamentals


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Bonus: Companion Guide

Designing for Reality


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Related Podcast

The Evolving PCB NPI Process


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Thermal Management with Insulated Metal Substrates, Volume 2


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Bonus: Companion Guide

Stackups: The Design within the Design

Related - High Performance Materials
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High Performance Materials

Related - Stackups: The Design within the Design
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Solder Defects


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24 Essential Skills for Engineers

System Analysis


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Bonus: Companion Guide

Smart Data: Using Data to Improve Manufacturing


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Thermal Management: A Fabricator's Perspective


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Process Validation


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Advanced Manufacturing in the Digital Age


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Assessing Your PCB Documentation Process


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Automation and Advanced Procedures in PCB Fabrication


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Producing the Perfect Data Package


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Low-Temperature Soldering


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Thermal Management with Insulated Metal Substrates


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Fundamentals of RF/Microwave PCBs


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Power Integrity by Example


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Signal Integrity by Example


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Secrets of High-Speed PCBs, Part 2


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Solderless Assembly for Electronics: The SAFE Approach


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Secrets of High-Speed PCBs, Part 1


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AS9100 Certification


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PIHR Technology

Survival Is Not Mandatory

The HDI Handbook

Flexible Circuit Technology, 4th Edition

Review from William E. Webb, Technical Director, Aster Technologies

William E. Webb, Technical Director, Aster Technologies

"Even experienced test professionals will gain valuable insights and fresh perspectives from his expertise.."

Review from Jason Keeping, Celestica

Jason Keeping, Celestica

"A great read on materials and processes that help electronics succeed in harsher conditions."

Review from Gary Korkala

Gary Korkala

"The Printed Circuit Assembler's Guide to... X-ray Inspection is a must read for those engaged in the radiographic inspection of electronic components. It provides a clear, concise description of the X-ray process and includes a comprehensive number of comparative images."

Review from Eric Bogatin

Eric Bogatin

"If you are new to designing circuit boards for 10 Gbps and above systems, or touch any part of the PCB supply chain, get a jump up the learning curve from the experience offered in this book from a respected industry expert."

Review from Dana Korf, Principal Consultant, Korf Consultancy LLC

Dana Korf, Principal Consultant, Korf Consultancy LLC

"This book covers essential design considerations to ensure PCB manufacturability. These features impact the overall PCB quality, reliability, and cost-effectiveness. Good practical size and tolerance guidelines are also provided for the designer to meet specifications while yielding the lowest cost. I recommend this for new designers, especially before formal training. Additionally, it’s suitable for school students as part of their science curriculum."

Review from Kevin Byrd, Principal Engineer, Intel Corporation

Kevin Byrd, Principal Engineer, Intel Corporation

"This book provides an excellent overview of both the history of low-temperature solders as well as the recent progress in this exciting surface mount technology. This information will prove valuable for those actively pursuing low-temperature solder conversion of their manufacturing processes as well as those working to understand the progress and future for the low-temperature solder materials."

Review from Alejandro Carrillo, Founder/General Manager, InterLatin

Alejandro Carrillo, Founder/General Manager, InterLatin

"Factory Analytics is great reading! Data analytics provides evidence of sustained performance and continuous improvement. This book also covers new tools like machine learning and how AI will bring new levels of factory analytics and efficiency."

Review from Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.

Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.

"Readers will learn the advantages and disadvantages of different encapsulation materials and the importance of the application process. In order to find the right balance between benefit and effort, the author suggests using analytical approaches to configure the process and its settings. Additionally, she is always conscious of the need for sustainability when it comes to electronic assemblies."

Review from Stephen V. Chavez, IPC Designers Council

Stephen V. Chavez, IPC Designers Council

"The author shows great insight into the many details and collaboration required for creating complex PCBs as well as the most important aspect of a successful design team, in my opinion—communication."

Review from Ammar Abusham, DFM Integration Engineer (AR EE Team), Meta Reality Labs

Ammar Abusham, DFM Integration Engineer (AR EE Team), Meta Reality Labs

"This book effectively addresses the need for early integration of manufacturing elements into the design process. In an industry racing against time, MDD is the key to staying ahead. "

Review from Christopher St. Mars, Process Engineer, Intervala

Christopher St. Mars, Process Engineer, Intervala

"This book offers an accurate look at the aspects and challenges the electronics manufacturing industry faces with regards to SMT Inspection and its surrounding technology. In-depth insight on new and exciting true 3D inspection technology is provided, with a look into the future of leveraging big data management and autonomous manufacturing for a smarter factory."

Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification. "

Review from Tara Dunn

Tara Dunn

"This book is a terrific resource for both those new to flex design and those more experienced looking to streamline the design to fabrication transition."

Review from Bob Tise, R&D Engineer, EMP Shield

Bob Tise, R&D Engineer, EMP Shield

"PCB design is as much art as science. While reading this book will not, itself, make you a professional PCB designer, it will help you make better decisions and trade-offs, saving time and money."

Review from Lambert Schutters, General Manager, ESCATEC Penang

Lambert Schutters, General Manager, 
ESCATEC Penang

"We need the right tools to create the best design for the intended purpose. This book is a great introduction and guide on how to approach the process holistically."

Review from Jan Pedersen, Director of Technology, NCAB Group

Jan Pedersen, Director of Technology, NCAB Group

"The importance of total thermal resistance has been an eye opener for me from being focused on one material’s thermal conductivity to understanding the total thermal behavior of a material stackup."

Review from Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.

Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.

"From novice board designers to experienced signal integrity engineers, this book has something for everyone involved with PCB stackups. A must-read for anyone having to work with PCB fab shops"

Review from Gerry Partida, VP of Technology, Summit Interconnect

Gerry Partida, VP of Technology, Summit Interconnect

"Michael Gay’s book is a concise and detailed explanation of the critical materials that makes up a PCB. His thorough explanation will help any engineer, designer and fabricator understand the impact of the material selection in a PCB stackup. This book is truly a gift to the electronics industry and I thank him for sharing his knowledge with us."

Review from Joe O'Neil, Principal, OAA Ventures

Joe O'Neil, Principal, OAA Ventures

"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."

Review from Lee Ritchey, Founder and President, Speeding Edge

Lee Ritchey, Founder and President, Speeding Edge

"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."

Review from Marius Stepanescu, Technical Director, ICCO EMT

Marius Stepanescu, Technical Director, ICCO EMT

"The Printed Circuit Assembler's Guide to... Smart Data explains the role of data acquisition and analytics in Industry 4.0. This book provides a very good description of the main challenges of collecting and handling smart data and analyzing it in the proper way."

Review from Denis Boulanger, Principal Manufacturing Engineer, Raytheon Technologies

Denis Boulanger, Principal Manufacturing Engineer, Raytheon Technologies

"This book provides a comprehensive look at thermal management and PCB design issues from the fabricator’s perspective. I am glad that it exists now that I have 'gone over to the dark side,' where I am a consumer rather than a fabricator and/or material supplier. "

Review from Mike Cummings, Technical Director, TSI

Mike Cummings, Technical Director, TSI

"Well-written and easy to follow, this dedicated book focuses on the importance of cleaning and decontamination of electronic circuits before application. This topic is timely and important, considering the increasing importance of high-reliability electronics, security, and safety in an increasingly connected world. "

Review from Farid Anani, VP of Operations, Computrol Inc.

Farid Anani, VP of Operations, Computrol Inc.

"This book is a must-read for those embarking on their IIoT journey; it provides a very accurate description of preparation requirements and risks to consider and avoid, not just technologically, but also organizationally." "

Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison

Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison

"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."

Review from Alex Stepinski, vice president, GreenSource Fabrication

Alex Stepinski, vice president, GreenSource Fabrication

"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences. "

Review from Dan Beaulieu, president, D.B. Management

Dan Beaulieu, president, D.B. Management

"If you are serious about creating the best, most perfect data packages available today, do yourself a favor. Download and read this book. It’s simple—the better the package, the better the board. "

Review from Happy Holden, Consulting Technical Editor, I-Connect007

Happy Holden, Consulting Technical Editor, I-Connect007

"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."

Review from Alun Morgan, Chairman, EIPC

Alun Morgan, Chairman, EIPC

" A comprehensive tour through the world of thermal management. Required reading for designers and end users wishing to understand the science and practice of using insulated metal substrate materials."

Review from Mike Carano, VP of technology and business development at RBP Chemical Technology

Mike Carano, VP of technology and business development at RBP Chemical Technology

"The definitive guide to navigating the unique challenges one faces when fabricating RF printed circuit boards."

Review from Gene Garat, President, Moss Bay EDA

Gene Garat, President, Moss Bay EDA

"Engineers new to the field as well as career veterans can all benefit from this quick read, well-illustrated with plenty of examples."

Review from Terry Fox

Terry Fox

"I found this to be an excellent tutorial on controlled impedance transmission lines, terminations, crosstalk, differential pair design and PDN noise, and
Mentor’s virtual labs take learning to a whole new level!"

Review from Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.

Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.

"I wish I had these books when I was starting out in my career."

Review from Andy Shaughnessy

Andy Shaughnessy

"This book has everything you need to know about solderless assembly process, which could be the most innovative—and disruptive—technological development in our industry’s history."

Review from Alex Ippich

Alex Ippich

"A nice summary of many of the issues that engineers have to work through, without overly complicated formulas and details."

Review from Andy Shaughnessy

Andy Shaughnessy

"This may be the single best source of info about the AS9100 certification. Easy to digest yet full of details, it’s all here: from start to finish..."