Via Structures: Reflow Process Survivability, Reliability, and Robustness


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Direct Metallization: A Guide to Complex PCB Fabrication


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Design for Test: A Practical Guide to Test and Inspection


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UV Curable Conformal Coatings


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X-ray Inspection


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More Secrets of High-speed PCBs


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DFM Essentials


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Bonus: Companion Guide

Low-temperature Soldering, Vol. 2


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Factory Analytics


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Encapsulating Sustainability for Electronics


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Executing Complex PCBs


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Bonus: Audio Book

IPC Checklist for Printed Board Assemblies

Manufacturing Driven Design


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SMT Inspection: Today, Tomorrow, and Beyond


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Bonus: Companion Guide

Bonus: Companion Guide 2

Process Control


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Flex and Rigid-Flex Fundamentals


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Bonus: Companion Guide

Designing for Reality


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Bonus: Companion Guide

Related Podcast

The Evolving PCB NPI Process


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Thermal Management with Insulated Metal Substrates, Volume 2


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Bonus: Companion Guide

Stackups: The Design within the Design

Related - High Performance Materials
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High Performance Materials

Related - Stackups: The Design within the Design
Read a Review

Solder Defects


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24 Essential Skills for Engineers

System Analysis


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Bonus: Companion Guide

Smart Data: Using Data to Improve Manufacturing


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Thermal Management: A Fabricator's Perspective


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Process Validation


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Advanced Manufacturing in the Digital Age


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Assessing Your PCB Documentation Process


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Automation and Advanced Procedures in PCB Fabrication


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Producing the Perfect Data Package


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Low-Temperature Soldering


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Thermal Management with Insulated Metal Substrates


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Fundamentals of RF/Microwave PCBs


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Power Integrity by Example


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Signal Integrity by Example


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Secrets of High-Speed PCBs, Part 2


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Solderless Assembly for Electronics: The SAFE Approach


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Secrets of High-Speed PCBs, Part 1


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AS9100 Certification


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PIHR Technology

Survival Is Not Mandatory

The HDI Handbook

Flexible Circuit Technology, 4th Edition

Review from Todd MacFadden, Bose

Todd MacFadden, Bose

"With this book, Bob Neves provides an important update to our understanding of via testing by articulating the distinction between their reliability and robustness."

Review from Venkat Raja, President & Founder, Advint, Inc.

Venkat Raja, President & Founder, Advint, Inc.

"Gugliotti provides the critical technical validation required to transition from conventional electroless copper to the proven reliability of direct copper-to-copper bonding."

Review from Tamara Jovanovic, Electronics Engineer, Masimo

Tamara Jovanovic, Electronics Engineer, Masimo

"This book clearly explains why Design for Test is essential to product and business success."

Review from Stanton Rak, PhD, SF Rak Company

Stanton Rak, PhD, SF Rak Company

"This book contributes useful clarity to an area of growing importance in high-reliability electronics manufacturing."

Review from Phil Zarrow

Phil Zarrow

"Dr. Cardoso has given the industry a concise, comprehensive, and very readable quintessential primer on X-ray and its use in electronics assembly to a grateful industry."

Review from Eric Bogatin

Eric Bogatin

"If you are new to designing circuit boards for 10 Gbps and above systems, or touch any part of the PCB supply chain, get a jump up the learning curve from the experience offered in this book from a respected industry expert."

Review from Kris Moyer, Instructor, IPC

Kris Moyer, Instructor, IPC

"Whether you are new to PCB design or a seasoned designer with years of experience, this DFM book is an excellent resource. It covers many important concepts and informational topics to help ensure you achieve a successful, high-quality, high-yield PCB design the first time and every time."

Review from Richard Coyle, Consulting Member of Technical Staff, Nokia Bell Labs

Richard Coyle, Consulting Member of Technical Staff, Nokia Bell Labs

"Readers will find this book provides technical insights into the ever-evolving challenges of the assembly and reliability of low-temperature solder alloys. This second volume includes updates on fourth-generation low-temperature solders and a preview of the capabilities of ultra-low temperature (ULT) solders."

Review from Jason Sciberras, President, Saline Lectronics Division of Emerald Technologies

Jason Sciberras, President, Saline Lectronics Division of Emerald Technologies

"I would recommend that any data-driven engineers focused on taking their manufacturing operations to the next level read this book."

Review from Jason Keeping, Global Process Subject Matter Expert, Celestica

Jason Keeping, Global Process Subject Matter Expert, Celestica

"We live in a harsh world where protection is needed. Ruggedization is one of the fundamental processes that can help. This book provides a great summary of one of these key capabilities."

Review from Stephen V. Chavez, IPC Designers Council

Stephen V. Chavez, IPC Designers Council

"This is a great resource for those who wish to gain a better understanding of all that it takes to design a complex PCB/CCA in today’s ever-evolving industry. For a designer, challenges always include layout solvability, electrical integrity, and manufacturability. The goal is making revision one work. I refer to this as ‘The Designer’s Triangle’."

Review from Gus Becerra, Principal Manufacturing Engineer, Marvell

Gus Becerra, Principal Manufacturing Engineer, Marvell

"As fabrication and manufacturing technologies advance, it is necessary to evolve our methods to analyze and review designs. This book utilizes data-driven concepts in all aspects of the fabrication and assembly processes to improve design capabilities. "

Review from Christopher St. Mars, Process Engineer, Intervala

Christopher St. Mars, Process Engineer, Intervala

"This book offers an accurate look at the aspects and challenges the electronics manufacturing industry faces with regards to SMT Inspection and its surrounding technology. In-depth insight on new and exciting true 3D inspection technology is provided, with a look into the future of leveraging big data management and autonomous manufacturing for a smarter factory."

Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification. "

Review from Steve Williams

Steve Williams

"There is something here for everyone. I highly recommend downloading this book right away!"

Review from Duane Benson, Director of Marketing, Screaming Circuits

Duane Benson, Director of Marketing, Screaming Circuits

"I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening up the hood and giving the reader that knowledge of the PC board fab process."

Review from Lambert Schutters, General Manager, ESCATEC Penang

Lambert Schutters, General Manager, 
ESCATEC Penang

"We need the right tools to create the best design for the intended purpose. This book is a great introduction and guide on how to approach the process holistically."

Review from Jan Pedersen, Director of Technology, NCAB Group

Jan Pedersen, Director of Technology, NCAB Group

"The importance of total thermal resistance has been an eye opener for me from being focused on one material’s thermal conductivity to understanding the total thermal behavior of a material stackup."

Review from Michael Ingraham

Michael Ingraham

"Finally, a book on stackup design for designers that focuses on high-speed applications. This is a much-needed resource for the design community, and there is no one better or more qualified to write it than Bill Hargin."

Review from Gerry Partida, VP of Technology, Summit Interconnect

Gerry Partida, VP of Technology, Summit Interconnect

"Michael Gay’s book is a concise and detailed explanation of the critical materials that makes up a PCB. His thorough explanation will help any engineer, designer and fabricator understand the impact of the material selection in a PCB stackup. This book is truly a gift to the electronics industry and I thank him for sharing his knowledge with us."

Review from Joe O'Neil, Principal, OAA Ventures

Joe O'Neil, Principal, OAA Ventures

"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."

Review from Lee Ritchey, Founder and President, Speeding Edge

Lee Ritchey, Founder and President, Speeding Edge

"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."

Review from Happy Holden, Consulting Technical Editor, I-Connect007

Happy Holden, Consulting Technical Editor, I-Connect007

"This book provides good education, with examples and explanations to help the reader understand how the smart factory can improve performance and competitiveness."

Review from Denis Boulanger, Principal Manufacturing Engineer, Raytheon Technologies

Denis Boulanger, Principal Manufacturing Engineer, Raytheon Technologies

"This book provides a comprehensive look at thermal management and PCB design issues from the fabricator’s perspective. I am glad that it exists now that I have 'gone over to the dark side,' where I am a consumer rather than a fabricator and/or material supplier. "

Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification. "

Review from Farid Anani, VP of Operations, Computrol Inc.

Farid Anani, VP of Operations, Computrol Inc.

"This book is a must-read for those embarking on their IIoT journey; it provides a very accurate description of preparation requirements and risks to consider and avoid, not just technologically, but also organizationally." "

Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison

Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison

"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."

Review from Alex Stepinski, vice president, GreenSource Fabrication

Alex Stepinski, vice president, GreenSource Fabrication

"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences. "

Review from Dan Beaulieu, president, D.B. Management

Dan Beaulieu, president, D.B. Management

"If you are serious about creating the best, most perfect data packages available today, do yourself a favor. Download and read this book. It’s simple—the better the package, the better the board. "

Review from Happy Holden, Consulting Technical Editor, I-Connect007

Happy Holden, Consulting Technical Editor, I-Connect007

"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."

Review from Alun Morgan, Chairman, EIPC

Alun Morgan, Chairman, EIPC

" A comprehensive tour through the world of thermal management. Required reading for designers and end users wishing to understand the science and practice of using insulated metal substrate materials."

Review from Judy Warner, director of community engagement at Altium

Judy Warner, director of community engagement at Altium

"This concise, yet very thorough eBook is destined to become every RF and microwave engineer's PCB fabrication bible. ASC shares every key aspect to successfully fabricate these incredibly challenging boards."

Review from Andy Shaughnessy

Andy Shaughnessy

"This micro eBook should be required reading for every PCB designer or design engineer, whether novice or veteran. This book makes a great follow-up to Mentor’s previous eBook, The Printed Circuit Designer’s Guide to…Signal Integrity."

Review from Eric Bogatin

Eric Bogatin

"If you care about signal integrity, you are sure to pick up a few nuggets of insight from this new eBook."

Review from Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.

Bert Simonovich, Consultant & Founder, LAMSIM Enterprises Inc.

"I wish I had these books when I was starting out in my career."

Review from Tom Borkes, Founder, The Jefferson Project

Tom Borkes, Founder, The Jefferson Project

"Mr. Fjelstad has dared to think outside the box. The result is a very readable exposition in logic, posing and answering a basic question: Why do interconnect electronics with solder? Socrates would be proud!"

Review from Eric Bogatin

Eric Bogatin

"The Printed Circuit Designer's Guide to... Secrets of High-Speed PCBs, Part 1 pulls back the covers to illustrate the practical principles behind many of the confusing topics that arise in the overlap between manufacturing, materials, and signal integrity performance."

Review from Dan Beaulieu

Dan Beaulieu

"This book is long overdue. Finally, a book on AS9100 certification written in clear and concise language.""