Review from Richard Coyle, Consulting Member of Technical Staff, Nokia Bell Labs
"Readers will find this book provides technical insights into the ever-evolving challenges of the assembly and reliability of low-temperature solder alloys. This second volume includes updates on fourth-generation low-temperature solders and a preview of the capabilities of ultra-low temperature (ULT) solders."
Review from Alejandro Carrillo, Founder/General Manager, InterLatin
"Factory Analytics is great reading! Data analytics provides evidence of sustained performance and continuous improvement. This book also covers new tools like machine learning and how AI will bring new levels of factory analytics and efficiency."
Review from Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.
"Readers will learn the advantages and disadvantages of different encapsulation materials and the importance of the application process. In order to find the right balance between benefit and effort, the author suggests using analytical approaches to configure the process and its settings. Additionally, she is always conscious of the need for sustainability when it comes to electronic assemblies."
Review from Gus Becerra, Principal Manufacturing Engineer, Marvell
"As fabrication and manufacturing technologies advance, it is necessary to evolve our methods to analyze and review designs. This book utilizes data-driven concepts in all aspects of the fabrication and assembly processes to improve design capabilities.
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Review from Christopher St. Mars, Process Engineer, Intervala
"This book offers an accurate look at the aspects and challenges the electronics manufacturing industry faces with regards to SMT Inspection and its surrounding technology. In-depth insight on new and exciting true 3D inspection technology is provided, with a look into the future of leveraging big data management and autonomous manufacturing for a smarter factory."
Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH
"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification.
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Review from Robert Tarzwell
"This is a very good book which covers all the fundamentals on flex and rigid-flex circuits. It is clear and concise giving the reader and especially a new person to this business an excellent overview of this difficult technology."
Review from Duane Benson, Director of Marketing, Screaming Circuits
"I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening up the hood and giving the reader that knowledge of the PC board fab process."
Review from Nick Niculita, Engineering Manager, SRXGlobal
"This book is a must-read for everybody who wants to improve the overall design-through-manufacturing NPI phase and ultimately do more with less, the Holy Grail of any manufacturer."
Review from Jan Pedersen, Director of Technology, NCAB Group
"The importance of total thermal resistance has been an eye opener for me from being focused on one material’s thermal conductivity to understanding the total thermal behavior of a material stackup."
Review from Michael Ingraham
"Finally, a book on stackup design for designers that focuses on high-speed applications. This is a much-needed resource for the design community, and there is no one better or more qualified to write it than Bill Hargin."
Review from Gerry Partida, VP of Technology, Summit Interconnect
"Michael Gay’s book is a concise and detailed explanation of the critical materials that makes up a PCB. His thorough explanation will help any engineer, designer and fabricator understand the impact of the material selection in a PCB stackup. This book is truly a gift to the electronics industry and I thank him for sharing his knowledge with us."
Review from Joe O'Neil, Principal, OAA Ventures
"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."
Review from Lee Ritchey, Founder and President, Speeding Edge
"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."
Review from Marius Stepanescu, Technical Director, ICCO EMT
"The Printed Circuit Assembler's Guide to... Smart Data explains the role of data acquisition and analytics in Industry 4.0. This book provides a very good description of the main challenges of collecting and handling smart data and analyzing it in the proper way."
Review from Dan Beaulieu, President, DB Management Group
"For those who are, shall we say, 'less technical' than others, it’s refreshing—not to mention face-saving, at times—to be able to understand terms like insulated metal-clad PCBs (IMPCBs), metal-clad PCBs (MCPCBs) and mixed-technology PCBs."
Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH
"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification.
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Review from Happy Holden, Consulting Technical Editor, I-Connect007
"This is essential reading for those who are wondering, "What can smart factories do for me?" The Mentor/Siemens description of how Industry 4.0 can benefit an electronics manufacturer, and how to go about using such a concept, is both detailed and easy to understand. It is one of the best books on the subject!"
Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison
"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."
Review from Stephen V. Chavez, IPC Designers Council
"This is a great resource for those who wish to gain a better understanding of all that it takes to design a complex PCB/CCA in today’s ever-evolving industry. For a designer, challenges always include layout solvability, electrical integrity, and manufacturability. The goal is making revision one work. I refer to this as ‘The Designer’s Triangle’."
Review from Alex Stepinski, vice president, GreenSource Fabrication
"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences.
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Review from Kelly Dack, CID+, CIT, EPTAC Corporation
"Mark Thompson is not afraid to ask for what he needs from a customer to start a job with the end in sight. In fact, he does the industry one better in this book by telling you what a PCB fabricator needs to get the complex job done right. Much appreciated!
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Review from Happy Holden, Consulting Technical Editor, I-Connect007
"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."
Review from Alun Morgan, Chairman, EIPC
" A comprehensive tour through the world of thermal management. Required reading for designers and end users wishing to understand the science and practice of using insulated metal substrate materials."
Review from Robert Tarzwell, PCB technologist, inventor, and writer
"A concise ebook written in plain English so anyone can improve their
RF and high-frequency printed circuit design. From Dk through edge
plating, this book covers all areas of manufacturing an RF PCB, and
provides many drawings and charts to clearly show each process."
Review from Gene Garat, President, Moss Bay EDA
"Engineers new to the field as well as career veterans can all benefit from this quick read, well-illustrated with plenty of examples."
Review from Stephen Las Marias, Managing Editor, SMT Magazine
"To those looking to know more about conformal coatings—from fundamentals and testing, to industry standards and best practices—this micro eBook is the best starting point. Not only does this eBook provide the most important bits of information, but it also presents case studies to help you create successful conformal coating strategies for your applications."
Review from Eric Bogatin
"If you care about signal integrity, you are sure to pick up a few nuggets of insight from this new eBook."
Review from Happy Holden
"Martyn Gaudion of Polar has taken the extremely complex topic of signal integrity and provided an easy to understand explanation of this phenomena. I encourage everyone to download and read this engaging e-book."
Review from Andy Shaughnessy
"This book has everything you need to know about solderless assembly process, which could be the most innovative—and disruptive—technological development in our industry’s history."
Review from Rick Hartley
"This book offers the greatest benefit to design and procurement people by helping them understand what can realistically be achieved in the final product."
Review from Andy Shaughnessy
"There are plenty of PCB books available now, but not many focus on DFM. Altium’s new e-book, The Printed Circuit Designer's Guide to...Design for Manufacturing (DFM), has everything you need to know to get your board ‘right the first time."
Review from Dan Beaulieu
"This book is long overdue. Finally, a book on AS9100 certification written in clear and concise language.""