X-ray Inspection


Read a Review

More Secrets of High-speed PCBs


Read a Review

DFM Essentials


Read a Review

Low-temperature Soldering, Vol. 2


Read a Review

Factory Analytics


Read a Review

Encapsulating Sustainability for Electronics


Read a Review

Executing Complex PCBs


Read a Review



Bonus: Audio Book

IPC Checklist for Producing Printed Board Assemblies

Manufacturing Driven Design


Read a Review

SMT Inspection: Today, Tomorrow, and Beyond


Read a Review



Bonus: Companion Guide

Process Control


Read a Review

Flex and Rigid-Flex Fundamentals


Read a Review



Bonus: Companion Guide

Designing for Reality


Read a Review



Related Podcast

The Evolving PCB NPI Process


Read a Review

Thermal Management with Insulated Metal Substrates, Volume 2


Read a Review



Bonus: Companion Guide

Stackups: The Design within the Design

Related - High Performance Materials
Read a Review

High Performance Materials

Related - Stackups: The Design within the Design
Read a Review

Solder Defects


Read a Review

24 Essential Skills for Engineers

System Analysis


Read a Review



Bonus: Companion Guide

Smart Data: Using Data to Improve Manufacturing


Read a Review

Thermal Management: A Fabricator's Perspective


Read a Review

Process Validation


Read a Review

Advanced Manufacturing in the Digital Age


Read a Review

Assessing Your PCB Documentation Process


Read a Review

Automation and Advanced Procedures in PCB Fabrication


Read a Review

Producing the Perfect Data Package


Read a Review

Low-Temperature Soldering


Read a Review

Thermal Management with Insulated Metal Substrates


Read a Review

Fundamentals of RF/Microwave PCBs


Read a Review

Power Integrity by Example


Read a Review

Conformal Coatings for Harsh Environments


Read a Review

Signal Integrity by Example


Read a Review

Secrets of High-Speed PCBs, Part 2


Read a Review

Solderless Assembly for Electronics: The SAFE Approach


Read a Review

Secrets of High-Speed PCBs, Part 1


Read a Review

AS9100 Certification


Read a Review

PIHR Technology

Survival Is Not Mandatory

The HDI Handbook

Flexible Circuit Technology, 4th Edition

Review from Phil Zarrow

Phil Zarrow

"Dr. Cardoso has given the industry a concise, comprehensive, and very readable quintessential primer on X-ray and its use in electronics assembly to a grateful industry."

Review from Eric Bogatin

Eric Bogatin

"If you are new to designing circuit boards for 10 Gbps and above systems, or touch any part of the PCB supply chain, get a jump up the learning curve from the experience offered in this book from a respected industry expert."

Review from Kris Moyer, Instructor, IPC

Kris Moyer, Instructor, IPC

"Whether you are new to PCB design or a seasoned designer with years of experience, this DFM book is an excellent resource. It covers many important concepts and informational topics to help ensure you achieve a successful, high-quality, high-yield PCB design the first time and every time."

Review from Kevin Byrd, Principal Engineer, Intel Corporation

Kevin Byrd, Principal Engineer, Intel Corporation

"This book provides an excellent overview of both the history of low-temperature solders as well as the recent progress in this exciting surface mount technology. This information will prove valuable for those actively pursuing low-temperature solder conversion of their manufacturing processes as well as those working to understand the progress and future for the low-temperature solder materials."

Review from Alejandro Carrillo, Founder/General Manager, InterLatin

Alejandro Carrillo, Founder/General Manager, InterLatin

"Factory Analytics is great reading! Data analytics provides evidence of sustained performance and continuous improvement. This book also covers new tools like machine learning and how AI will bring new levels of factory analytics and efficiency."

Review from Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.

Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.

"Readers will learn the advantages and disadvantages of different encapsulation materials and the importance of the application process. In order to find the right balance between benefit and effort, the author suggests using analytical approaches to configure the process and its settings. Additionally, she is always conscious of the need for sustainability when it comes to electronic assemblies."

Review from John R. Watson, Legrand North America

John R. Watson, Legrand North America

"At a time when electronics are not just taking small steps but rather large leaps forward, this is an appropriate book for anyone working with PCB design. With countless and ever-changing steps involved in every design, it presents a clear understanding of the process. This book will be the go-to reference for all of our designers at Legrand North America."

Review from Gus Becerra, Principal Manufacturing Engineer, Marvell

Gus Becerra, Principal Manufacturing Engineer, Marvell

"As fabrication and manufacturing technologies advance, it is necessary to evolve our methods to analyze and review designs. This book utilizes data-driven concepts in all aspects of the fabrication and assembly processes to improve design capabilities. "

Review from Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software

Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software

"This book provides unprecedented visibility of SMT processes, asserting inspection technology as a key active contributor to zero-defect quality initiatives, rather than being limited to simple defect detection."

Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification. "

Review from Dan Beaulieu

Dan Beaulieu

"A "must-have" guidebook for everyone involved in Flex technology."

Review from Bob Tise, R&D Engineer, EMP Shield

Bob Tise, R&D Engineer, EMP Shield

"PCB design is as much art as science. While reading this book will not, itself, make you a professional PCB designer, it will help you make better decisions and trade-offs, saving time and money."

Review from Lambert Schutters, General Manager, ESCATEC Penang

Lambert Schutters, General Manager, 
ESCATEC Penang

"We need the right tools to create the best design for the intended purpose. This book is a great introduction and guide on how to approach the process holistically."

Review from Jan Pedersen, Director of Technology, NCAB Group

Jan Pedersen, Director of Technology, NCAB Group

"The importance of total thermal resistance has been an eye opener for me from being focused on one material’s thermal conductivity to understanding the total thermal behavior of a material stackup."

Review from Michael Ingraham

Michael Ingraham

"Finally, a book on stackup design for designers that focuses on high-speed applications. This is a much-needed resource for the design community, and there is no one better or more qualified to write it than Bill Hargin."

Review from Mark Thompson, Engineering Manager, Out of the Box

Mark Thompson, Engineering Manager, Out of the Box

"I love this book. Particularly the sections on the effects of the glass weave, the history of laminate, and the difference between Dk and Effective Dk. I highly recommend this book for any designer or engineer looking to better understand laminate!"

Review from Joe O'Neil, Principal, OAA Ventures

Joe O'Neil, Principal, OAA Ventures

"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."

Review from Lee Ritchey, Founder and President, Speeding Edge

Lee Ritchey, Founder and President, Speeding Edge

"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."

Review from Happy Holden, Consulting Technical Editor, I-Connect007

Happy Holden, Consulting Technical Editor, I-Connect007

"This book provides good education, with examples and explanations to help the reader understand how the smart factory can improve performance and competitiveness."

Review from Denis Boulanger, Principal Manufacturing Engineer, Raytheon Technologies

Denis Boulanger, Principal Manufacturing Engineer, Raytheon Technologies

"This book provides a comprehensive look at thermal management and PCB design issues from the fabricator’s perspective. I am glad that it exists now that I have 'gone over to the dark side,' where I am a consumer rather than a fabricator and/or material supplier. "

Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH

"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification. "

Review from Farid Anani, VP of Operations, Computrol Inc.

Farid Anani, VP of Operations, Computrol Inc.

"This book is a must-read for those embarking on their IIoT journey; it provides a very accurate description of preparation requirements and risks to consider and avoid, not just technologically, but also organizationally." "

Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison

Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison

"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."

Review from Alex Stepinski, vice president, GreenSource Fabrication

Alex Stepinski, vice president, GreenSource Fabrication

"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences. "

Review from Douglas Brooks, retired engineer, Ph.D.

Douglas Brooks, retired engineer, Ph.D.

"Mark does an outstanding job detailing what needs to be included in the handoff between the board designer and fabricator. Understanding and following his advice will lead to a smooth transition between these two functions. His new book should be required reading for every designer. "

Review from Happy Holden, Consulting Technical Editor, I-Connect007

Happy Holden, Consulting Technical Editor, I-Connect007

"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."

Review from Alun Morgan, Chairman, EIPC

Alun Morgan, Chairman, EIPC

" A comprehensive tour through the world of thermal management. Required reading for designers and end users wishing to understand the science and practice of using insulated metal substrate materials."

Review from Robert Tarzwell, PCB technologist, inventor, and writer

Robert Tarzwell, PCB technologist, inventor, and writer

"A concise ebook written in plain English so anyone can improve their RF and high-frequency printed circuit design. From Dk through edge plating, this book covers all areas of manufacturing an RF PCB, and provides many drawings and charts to clearly show each process."

Review from Gene Garat, President, Moss Bay EDA

Gene Garat, President, Moss Bay EDA

"Engineers new to the field as well as career veterans can all benefit from this quick read, well-illustrated with plenty of examples."

Review from Dr. Helmut Schweigart, Technology Development Head, Zestron Europe.

Dr. Helmut Schweigart, Technology Development Head, Zestron Europe.

"This micro eBook offers a comfortable approach to the selection, implementation, and testing of protective coating processes. It would be especially helpful for starters to use as a checklist for operational implementation."

Review from Eric Bogatin

Eric Bogatin

"If you care about signal integrity, you are sure to pick up a few nuggets of insight from this new eBook."

Review from Andy Kowaleski

Andy Kowaleski

"Martyn's book regarding the 'black art' of signal integrity in printed circuit boards hits the nail right on the head. I found his explanations to be accurate, easy to read and in enough depth to satisfy both beginners and seasoned veterans. All in all, highly recommended. And FREE is a BIG bonus."

Review from Tom Borkes, Founder, The Jefferson Project

Tom Borkes, Founder, The Jefferson Project

"Mr. Fjelstad has dared to think outside the box. The result is a very readable exposition in logic, posing and answering a basic question: Why do interconnect electronics with solder? Socrates would be proud!"

Review from Rick Hartley

Rick Hartley

"This book offers the greatest benefit to design and procurement people by helping them understand what can realistically be achieved in the final product."

Review from Dan Beaulieu

Dan Beaulieu

"This book is long overdue. Finally, a book on AS9100 certification written in clear and concise language.""