Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for PCB, semiconductor advanced packaging, and dual-damascene applications, will participate in this year’s IEEE 70th Electronic Components and Technology Conference (ECTC). The virtual conference will be held from June 3 through 30, 2020.
Atotech will give two technical paper presentations, both of which will be available for viewing during the time the conference is open:
• Dr. Britta Schafsteller, Atotech expert in Final Finishing, will talk about “Autocatalytic tin – how to overcome process limitations to introduce a new solution for thick tin plating."
• Dr. Tobias Bernhard, Atotech expert in Plating Through Hole, will share his insights on “Nickel dependence of hydrogen co-deposition and nanoporosity for electroless deposited Cu-films."
For more information about Atotech or its product offering, please visit www.atotech.com or contact us at: email@example.com.
Atotech is a global leader in surface-finishing solutions. Through a comprehensive systems-and-solutions approach, the company delivers chemistry, equipment, and service to support diverse industries such as consumer electronics, especially mobile devices and computing; global automotive; communication infrastructure; and many other industrial end-markets. Atotech’s relentless R&D efforts and global TechCenter presence allows it to deliver pioneering and sustainable products combined with unparalleled on-site customer support – making Atotech a critical partner to over 8,000 customers worldwide.
Atotech, headquartered in Berlin, Germany, is a team of 4,000 experts in over 40 countries generating annual revenues of $1.2 billion (2019). Atotech has manufacturing operations across Europe, the Americas, and Asia.