EIPC Presents Technical Snapshot Webinars

EIPC | 10-13-2020

During the Autumn of this year, EIPC will be organising three webinars which will be of particular interest to those involved with automotive, telecom and high-speed technology. We will have three well-known PCB industry speakers, each of whom has their own view on the technology challenges facing this industry.

This first session will focus on automotive technology and some of the key factors driving the global Automotive Printed Circuit Board industry. They will look at how the whole supply chain of PCB manufacturing can be ready for that change which will need input on materials, processes, measurement systems, reliability, and environmental impact and are there some new technologies for PCB manufacturing which will support these new demands.

The webinar on 14th of October will start at 15.00 hrs CEST.

The presenters this day will be:

Lenora Clark from ESI Automotive

Her presentation topic: An exploration of advanced semiconductor packaging’s effect on automotive electronic hardware design and assembly

Alun Morgan from Ventec

His presentation topic: "Reliability needs to be designed-in from the lowest level"

Paul Waldner from Multiline

His presentation topic: "Multilayer Printed Circuit Requirements for the Automobile Industry in the Age of High Speed”

Registeration is free of charge to EIPC Members. The Non Member fee is € 50.- Visit eipc.org.