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Nano Dimension, HENSOLDT AG Announce: Expanding Investment in their Joint Venture – J.A.M.E.S

09/20/2024 | Nano Dimension
Nano Dimension Ltd., a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, along with HENSOLDT AG, announced their respective leadership teams have agreed to continue the joint venture Jetted Additively Manufactured Electronics Sources GmbH (“J.A.M.E.S”).

Quiet Power: An Evolution in PCB Design Costs

09/04/2024 | Istvan Novak -- Column: Quiet Power
In this column, I want to cover my experiences, particularly where costs are concerned, with printed circuit boards from the 1960s to the present day. I grew up in an apartment building in downtown Budapest, where I began doing hobby projects building circuits from our kitchen table. Now, I’m lecturing about the most recent advances in signal integrity at Oxford University. We’ve come a long way. Over the decades, new technologies allowed users to have more layers, lower-loss dielectrics, fine-pitch surface connections, blind and buried vias, and HDI and HDI+ board constructions that allow us to design higher-performing systems. I expect this trend to continue.

PCB East 2025 Conference Task Group Named

08/28/2024 | PCEA
The Printed Circuit Engineering Association (PCEA) has announced the PCB East 2025 Conference Task Group members. Troy Hopkins, senior hardware design engineer at Connect Tech Inc., will be leading the group as the chairman alongside nine other printed circuit industry veterans. 

nano3Dprint Unveils Cutting-Edge Conductive Silver Ink Products in Collaboration with Creative Materials

08/27/2024 | PRWEB
nano3Dprint, a leading additive manufacturing and printed electronics solutions provider, is thrilled to announce the launch of its groundbreaking Conductive Silver Ink Products for use in nano3Dprint's A2200, B3300 and MatDep Pro 3D printers.

Smartkem to Present at The International Conference on Flexible and Printed Electronics (ICFPE) 2024

08/21/2024 | BUSINESS WIRE
The presentation, given by Smartkem Head of Technology Transfer, Steven Tsai, will take place during a session titled "Flexible and Printed Electronics: New Technologies and Applications", moderated by Dr. Klaus Hecker, Managing Director at OE-A. Smartkem representatives will be in attendance throughout the conference, from Tuesday, August 28 to Friday, August 30, and will be available for 1-on-1 meetings.
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