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Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
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Latest SMT007 Magazine Previews APEX EXPO 2026: Bigger and Better Than Ever
February 4, 2026 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
APEX EXPO 2026 is coming soon, and it is bigger and better than ever. This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year. Consider this your passport to where the electronics manufacturing industry is headed in 2026.
What’s inside this issue?
Meet the Standards Team at the Global Electronics Association. They break down the whats, whys, and how-tos of today’s standards development processes. You’ll come away feeling more confident about how you can fit into this entirely volunteers process.
Changes are afoot in the Technical Conference, but never fear, all your favorite topics will still be represented. Co-chairs Stan Rak and Udo Welzel, along with Matt Kelly and Devan Iyer, are adding an advanced packaging component this year, and even if you don’t see how this touches your business, after the conference, you’ll be pleasantly surprised.
We also break down what’s new at APEX EXPO this year, including a Technology Pavilion, Design Village, Learning Lounge, expanded days and times in the Technology Conference, and all the keynote speakers during the week.
It’s time for the industry to shine, so jump in and find out what the industry’s talking about.
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Rachael Temple - AlltematedSuggested Items
Best Technical Paper Awards Showcased at APEX EXPO 2026
03/02/2026 | Global Electronics AssociationThe Global Electronics Association today announced the recipients of the Best Technical Paper Awards from the Advanced Electronic Packaging Conference at APEX EXPO 2026.
Marcy’s Musings: Looking Forward—APEX EXPO 2026 (and AI Design Tools Too)
02/18/2026 | Marcy LaRont -- Column: Marcy's MusingsThis month, I-Connect007 Magazine previews APEX EXPO 2026, from exhibitors and special events on the show floor to new insights from the technical conference, details on keynotes, and advancements in critical industry standards. The show also has an international flavor, so we’ve included links to articles from Mexico, East Asia, and India. For PCB designers, we focused on AI in design tools, which turns out to be much more than the dreaded auto-router. We've got articles from Zuken, Siemens, and AllSpice.io.
Changing the Electronics Systems Conversation
02/16/2026 | Nolan Johnson, SMT007 MagazineRebranding as the Global Electronics Association is not the only major change happening at APEX EXPO this year. There’s also a shift in the scope of the technical program as heterogenous integration and other advanced packaging methodologies come into the mainstream at both the component and system levels. We spoke with Matt Kelly, CTO and conference general chair, Devan Iyer, chief strategist for advanced electronic packaging, and Stan Rak and Udo Welzel, now in their fourth year as chairs of the Technical Program Committee, about what distinguishes the conference this year.
February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging
02/11/2026 | I-Connect007 Editorial TeamI-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.
PEDC: Built for the Design Community by the Design Community
02/05/2026 | Peter Tranitz, Global Electronics AssociationThe Pan-European Electronics Design Conference (PEDC) was developed to provide Europe’s electronics design community with a non-commercial, Pan-European, technologically advanced forum. PEDC 2026 delivered exactly that. This second edition of the conference brought together 130 participants from 23 countries across Europe and beyond for two days of technical exchange, discussion, and connection. Hosted by the Global Electronics Association and Fachverband Elektroniksdesign und-fertigung e.V. (F.E.D)., and supported by Altium, Siemens, and Zuken, the event featured three technical tracks, 36 presentations, three keynotes, and a group of exhibitors.