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SEMI Reports 2025 Annual Worldwide Silicon Wafer Shipments and Revenue Results
February 11, 2026 | PRNewswireEstimated reading time: 1 minute
Worldwide silicon wafer shipments in 2025 increased 5.8% to 12,973 million square inches (MSI) while wafer revenue slipped 1.2% to $11.4 billion over the same period, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry.
2025 marks an inflection year for wafer shipments, with silicon MSI resuming growth supported by strong demand for advanced epitaxial wafers in logic and polished wafers for high-bandwidth memory (HBM), driven by AI applications. Softness in wafer revenue is mostly attributed to the slow momentum in traditional semiconductor applications where the demand and pricing environment are yet to improve.
"The 2025–2026 wafer market is shaped by diverging trends across technology nodes," said Ginji Yada, Chairman of SEMI SMG and Executive Office Deputy General Manager, Sales and Marketing Division at SUMCO Corporation. "Demand for 300mm wafers remains strong in advanced applications, particularly in AI-driven logic and high-bandwidth memory (HBM), supported by the ongoing adoption of sub-3nm processes. These technology transitions are driving increased requirements for wafer quality and consistency, reinforcing the need for advanced material solutions. Investments in data centers and generative AI continue to underpin demand in leading-edge segments, where performance and reliability are critical.
"In contrast, the legacy semiconductor segment shows gradual signs of stabilization. Wafer and chip inventory levels in mature-node applications—such as automotive, industrial, and consumer electronics—have begun to normalize after extended inventory adjustments. While supply-demand conditions are improving sequentially, the pace of recovery remains moderate, with demand recovery still sensitive to macroeconomic factors and end-market dynamics. As a result, the overall market outlook reflects a two-track trajectory: sustained demand and technical advancement in advanced nodes, alongside a cautious and incremental rebound for demand in mature technology segments."
Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronic devices. The highly engineered thin disks are produced in diameters of up to 300 mm and serve as the substrate material on which most semiconductors are fabricated.
The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epitaxial). The SMG facilitates collective efforts on issues related to the silicon industry, including the development of statistics about the silicon industry.
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Baya Systems and Aion Silicon Partner to Accelerate Next-Generation SoC and Chiplet Designs
02/24/2026 | BUSINESS WIREBaya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP for scalable AI, high-performance computing (HPC), and automotive applications, announced a partnership with Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture and design services company.
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design
02/18/2026 | BUSINESS WIREChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million.
UHDI Fundamentals—Foundations and Drivers of the PCB Flex: Advanced Packaging Nexus, Part 1
03/02/2026 | Anaya Vardya, American Standard CircuitsThe electronics industry is undergoing a fundamental transformation driven by demands for smaller form factors, higher performance, and greater functional integration. Two technologies sit at the center of this transformation: flexible PCBs and advanced semiconductor packaging. In this article, I’ll explore the technical foundations and key forces driving this convergence. Flexible PCBs are electrical interconnects fabricated on bendable substrates such as polyimide or polyester. Unlike rigid PCBs, flex circuits can conform to three-dimensional shapes, enabling designers to route signals through space rather than across flat planes.
Designers Notebook: Heterogeneous Interposer Design Challenge, Part 2
02/16/2026 | Vern Solberg -- Column: Designer's NotebookAs the need grows for higher processing speed and the expanded functionality required for newer generations of central processing units (CPUs), the necessity for higher-density interconnect solutions is paramount. The current trend toward furnishing a single, monolithic system-level semiconductor package has become a serious yield issue in fabrication. For example, with all of the peripheral supporting functions on a single die platform, wafer fabrication yields are often below target and, although the CPU portion of a monolithic semiconductor may be perfect, if one or more of the supporting functions on the same die fails, the entire processor unit must be discarded.
Texas Instruments to Acquire Silicon Labs
02/04/2026 | PRNewswireTexas Instruments and Silicon Labs announced they have signed a definitive agreement under which Texas Instruments will acquire Silicon Labs for $231.00 per share in an all-cash transaction, representing a total enterprise value of approximately $7.5 billion.