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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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Podcast Episode 2—AI Is Changing the Rules: Are Your PCB Materials Ready?
March 10, 2026 | I-Connect007Estimated reading time: 1 minute
I-Connect007, the leading media source for the electronics manufacturing industry, today announced the release of the second episode in its new six-part podcast series, PCB Materials: The Backbone and Future of Electronics.
In “5G, AI & Beyond—Designing for High-Speed Performance,” we explore how artificial intelligence is reshaping the rules of electronics design, demanding unprecedented speed, power, and high-frequency performance that push beyond the limits of traditional materials. As AI applications scale rapidly, are yesterday’s materials becoming obsolete?
Subject matter expert Drew Delaney provides a firsthand look at the advanced materials science powering everything from hyperscale AI data centers to 5G antennas and rugged edge devices. From ultra-low-loss laminates measured in thousandths of a decimal point to PCBs engineered to withstand liquid cooling, desert heat, and years of maintenance-free operation, Delaney explains the material properties required to thrive in an era racing toward performance beyond 400G.
Marcy LaRont of I-Connect007 hosts the series, offering listeners a practical, engineering-focused perspective on why laminate selection remains one of the most consequential early decisions in any PCB build—often determining success or failure long before fabrication begins.
“Material selection isn’t just a specification exercise—it’s a strategic design decision,” said Marcy LaRont, host of the series. “As AI, 5G, and high-speed applications continue to push performance boundaries, engineers must think beyond traditional materials and consider long-term reliability, thermal demands, and, of course, signal integrity. This series helps demystify those choices and highlights why they matter more than ever.”
The six-part series will continue with episodes addressing other critical topics shaping today’s PCB fabrication and manufacturing landscape.
Listeners can access the episode on I-Connect007’s podcast platform, as well as on Spotify and Apple Podcasts.
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