Zulki Khan

Zulki's PCB Nuggets

Zulki’s PCB Nuggets: Smart Pills & Cameras—The Next Frontier for PCB Microelectronics

Dan Beaulieu

It's Only Common Sense

It’s Only Common Sense: It’s All About Content

George Milad

The Plating Forum

The Plating Forum: Update on IPC-4552 ENIG Specification Revisions

Barry Olney

Beyond Design

Beyond Design: My 100th Column

Michael Ford

Smart Factory Insights

Smart Factory Insights: Trends and Opportunities at SMTAI 2019

Tom Kastner

Punching Out!

Punching Out! SMTAI 2019



Imran Valiani

Time to Market

Time to Market: The Importance of Timely NPI

Tim Haag

Tim's Takeaways

Tim's Takeaways: Realizing a Higher Standard for PCB Design

Bob Wettermann

Knocking Down the Bone Pile

Knocking Down the Bone Pile: Process Methods for Reworking High Lead Count SMT Parts

Bill Cardoso

X-Rayted Files

X-Rayted Files: The Risk of Installing Counterfeit Parts

Dominique Numakura

EPTE Newsletter

EPTE Newsletter: PCB Market Trends in Taiwan

Duane Benson

Powerful Prototypes

Powerful Prototypes: Never Assume—A DFM Story



Dennis Fritz

Defense Speak Interpreted

Defense Speak Interpreted: Other Transaction Authority

Steve Williams

The Right Approach

The Right Approach: A Conversation With Prototron’s Van Chiem

Alfred Macha

Operational Excellence

Operational Excellence: Transform Your Operations With Nadcap

Chris Mitchell

The Government Circuit

The Government Circuit: Recession Fears, Trade Wars: What Can We Do?

Team Elmatica

The PCB Norsemen

The PCB Norsemen: Avoid Failures in PCB Production With Compliance Control

Team Altus Group

Altus' Axis

Altus' Axis: Is Your Soldering System Smart Enough for the Future?



Marc Ladle

Ladle on Manufacturing

Ladle on Manufacturing: Sunday Afternoon in Dongguan

Ray Prasad

SMT Solver

SMT Solver: Would You Prefer Shorts or Opens in Your Products?

Martyn Gaudion

The Pulse

The Pulse: Modelled, Measured, Mindful—Closing the SI Loop

Dr. Jennie Hwang

SMT Perspectives and Prospects

Learn From the Wise

John Coonrod

Lightning Speed Laminates

Lightning Speed Laminates: Practical Evaluations of Glass Weave Effect

Richard Heimsch

More Than Just Dry Air

Controlling Oxidation and Intermetallics in Moisture-sensitive Devices



John Vaughan

Mil/Aero Markets

The Fourth Pillar of Defense Acquisition: Cybersecurity

Istvan Novak

Quiet Power

Quiet Power: Uncompensated DC Drop in Power Distribution Networks

Douglas Brooks, PhD.

Brooks' Bits

Brooks' Bits: Internal Trace Temperatures—More Complicated Than You Think

Dave Becker

All About Flex

All About Flex: Terms and Conditions

Tom Borkes

Jumping Off the Bandwagon

The Proper Position to Take on Voids in Solder Joints

Bert Simonovich

Bert's Practical Design Notes

Practical Modeling of High-Speed Backplane Channels



Barry Lee Cohen

Launch Letters

Launch Letters: Myths about Millennials—Workplace Safety Matters

Keith Sellers

Let's Talk Testing

Let’s Talk Testing: Professor Plum in the Library with the Candlestick…Right?

Pete Starkey

The European Angle

CircuitData: A New Open Standard for PCB Fab Data Exchange

Abby Monaco

Software Bytes

Software Bytes: The Hiring Game

Davina McDonnell

Millennials in Manufacturing

Millennials in Manufacturing: Hiring, Training and Retaining Millennials

Michael Ford

The Essential Pioneer's Survival Guide

If It's My Data, I Can Do What I Want, Right?



Bruce Johnston

Getting Connected with Social Media

Getting Connected with Social Media: Can You 'Game' the LinkedIn Publishing Algorithm?

Karl Dietz

Karl's Tech Talk

Karl's Tech Talk: Digital Imaging Update

Rachel Miller-Short

The Short Scoop

Adapting Stencils to Manufacturing Challenges in 2015

Dan Beaulieu and Bob Tarzwell

Bob and Me

Controlled Impedance: A Real-World Look at the PCB Side

Dan Smith

The Town Crier

True MCAD-ECAD Architecture: A Common-Sense Approach

Indium Bloggers

From One Engineer to Another

Indium and Gallium: Playing Important Roles in LED Lighting and the 2014 Nobel Prize in Physics



Gray McQuarrie

Solving DAM Problems

Solving a True DAM Problem

Various Authors

Various Archived Columns

Conversations with...Integrated Micro-Electronics Inc.

Sjef van Gastel

SMT Trends & Technologies

LED the Sunshine In

Eric Klaver

SMT Trends & Technologies

What is Your Real Output?

Barry Matties

The Sales Cycle

The Sales Cycle: Social Media - It's Nothing New...or Is It?

Anaya Vardya

Standard of Excellence

Standard of Excellence: We’re Working Together—and It Shows



Bob Burns

Flex Time

Flex Time: Alternative Constructions in Rigid-flex Designs

Luca Gautero

Additive Reality

Additive Reality: Drop It, and Enjoy the Greenback

Todd Kolmodin

Testing Todd

Testing Todd: Breaking the Void

Mike Buetow

The Digital Layout

The Digital Layout: Grounded! What The Electronics Industry Can Learn from Airlines

Dana Korf

Dana on Data

Dana on Data: Time for a Data Format Revolution

Kim O'Neil

Circuit Chronicles

Circuit Chronicles: It’s All About the Team



Michael Carano

Trouble in Your Tank

Trouble in Your Tank: Electrodeposition of Copper, Part 2

Greg Smith

SMT Stencils 101

SMT Stencils 101: Root-cause Stencil Design, Part 3—Tearing Down Bridges

John Watson

Elementary, Mr. Watson

Elementary, Mr. Watson: Anatomy of Your Component—Footprint, Part 2

Team Siemens

Digital Transformation

Digital Transformation: Supply Chain Resilience, Part Two—The Solution

Eran Navick

Global Technology

Global Technology: The Importance of Fine Lines

Kelly Dack

Target Condition

Target Condition: Practical Packaging Density in PCB Design



John Mitchell

One World, One Industry

One World, One Industry: Is the U.S. Government Ready to Meet the Test of Technological Leadership?

Matt Stevenson

Connect the Dots

Connect the Dots: Examining the Benefits of Laser Direct Imaging

IPC Education Foundation

Foundations of the Future

Foundations of the Future: Making Connections in Milwaukee

Travis Kelly

American Made Advocacy

American Made Advocacy: DoD Unarmed Without the PCB

Dan Feinberg

Fein-Lines

Fein-Lines: Live in Person—PCEA/Orange County Meets Up Again

Yair Alcobi

Language of Electronics

Language of Electronics: Key Considerations for Your Next Direct Imaging System



Christopher Bonsell

The Chemical Connection

The Chemical Connection: The Etch Factor

Marc Carter

Better to Light a Candle

Better to Light a Candle: Chapter 12—Light at the End of the COVID Tunnel

Patrick Crawford

Design Circuit

Design Circuit: Green Ambition for the Electronics Manufacturing Industry

Hannah Nelson & Paige Fiet

The New Chapter

The New Chapter: With a Little Help From My (IPCEF) Friends

Zac Elliott

Lean Digital Thread

Lean Digital Thread: The Manufacturing Metaverse Revisited

Nolan Johnson

Nolan's Notes

Nolan’s Notes: New Era Manufacturing



Doug Sober

Mr. Laminate Tells All

Mr. Laminate Tells All: Is Your Laminate and Prepreg Supplier Cheating? Only One Way to Find Out

Chris Ellis

The Mannifest

The Mannifest:Tips for Today's SMT Challenges

Dugan Karnazes

Figure It Out

Figure It Out: Closing the Gap Between College and Industry with PCEA

Andy Shaughnessy

The Shaughnessy Report

The Shaughnessy Report: Working Through the Design Pain

Team Electrolube

Sensible Design

Sensible Design: Comparing Traditional and Bio-based Resins

Christine Davis

Her Voice

Her Voice: The Intractable Ceiling



Tara Dunn

PCB Talk

PCB Talk: Is DWM Just Another Buzzword?

Cooler Cao

Global Connections

Global Connections: Why We Need Wire

Mark Thompson

The Bare (Board) Truth

The Bare (Board) Truth: My Top Six Design Challenges

Todd Kramer

Kramer on Counterfeits

A Summary of Counterfeit Avoidance: Development & Impact

Patrick Riechel

Laser Pointers

Laser Pointers: Stepping Up to Laser Processing for Flex, Part 6 — Proper Care and Feeding of Your Equipment

Clive "Max" Maxfield

Maxed Out

Maxed Out: Component Search Engine is a Total Game Changer



Jason Marsh

Putting It All Together

The Economics of Reducing Cycle Time in PCB Fabrication

Eric Camden

Quest for Reliability

Quest for Reliability: Here We Go (Virtual) Again

Chris Young

Adventures in Engineering

Adventures in Engineering: A Penny Primer on PCB Design Fundamentals

Happy Holden

Happy’s Tech Talk

Happy's Tech Talk #11: An Update on Inkjet Technologies

Mehul Davé

The Big Picture

The Big Picture: The Virtual Via Drum

Team NCAB

Fresh PCB Concepts

Fresh PCB Concepts: Part 5—How to Handle Possible Moisture During Shipping, Handling, and Storage



Team Cadence

All Systems Go

All Systems Go: Time Traveling to 2030 for ML-Augmented PCB Design

Joe Fjelstad

Flexible Thinking

Flexible Thinking: The Rapidly Expanding Realm of Stretchable Circuits

Vern Solberg

Designers Notebook

Designers Notebook: Design for Test, Part 3

Mike Hill

From the Hill

From The Hill: Pillars of Mil-Aero Technology and Revenue

Ronald C. Lasky

Maggie Benson's Journey

Maggie Benson's Journey: Teaching About Solder Paste

John Talbot

Consider This

Consider This: Designing Via-in-Pad for Higher Density Flexible Circuits



Dan Beaulieu

Dan's Biz Bookshelf

Dan's Biz Bookshelf: Broken to Better—13 Ways Not to Fail at Life and Leadership

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