-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueOpportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
Manufacturing Know-how
For this issue, we asked our expert contributors to share their thoughts on the absolute “must-know” aspects of fab, assembly and test that all designers should understand. In the end, we’re all in this together.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Enhanced System-level Engineering and Physical Design Efficiency in CR-8000 2020
July 1, 2020 | ZukenEstimated reading time: 1 minute
Zuken announces the CR-8000 2020 release of its advanced 3D multi-board EDA environment. The latest release was developed in close collaboration with Zuken’s global customers in business sectors, including electronics, high tech, automation, automotive, aerospace, and defense. As product complexity increases, these businesses are searching for opportunities to increase design performance and process resilience. Valuable contributions from academic research institutions such as UCLA or Fraunhofer IIS have also been incorporated into the release, particularly in the field of advanced packaging.
Key development themes for CR-8000 2020 were superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.
- Design efficiency benefits from significant enhancements in the areas of schematic design, FPGA optimization, skew group routing and support of back-drilled vias.
- System-level design and verification have been enhanced in the areas of electro-mechanical co-design of flex-rigid PCBs and multi-domain analysis through direct integration of best-in-class solutions from Zuken’s partners, Keysight and ANSYS.
- The latest advancements in packaging technology are supported by new functionality for tile bump and 3D wire design planning.
“Our global development teams in Japan, USA, and Europe have been working very hard to evolve the capabilities of CR-8000, our flagship EDA design tool suite, to stay on top of the exacting requirements of our global blue-chip customer base”, says Kazuhiro Kariya, Managing Director of Zuken Inc., Yokohama. “While our users will benefit from significant efficiency enhancements in the areas of engineering productivity and process resilience, we have also dedicated our attention to enabling a smooth transition for new customers who are locked into of 3rd party design tools that are reaching their limits.”
The CR-8000 platform is built upon the latest software methodologies and utilizes hardware acceleration to provide the needed performance for today’s complex and multi-discipline designs. Many legacy design tools are facing growing limitations, both in terms of system-level design and technology support.
Suggested Items
Absolute EMS Successfully Recertifies ISO 9001:2015 and AS9100 Standards
03/26/2024 | Absolute EMS, Inc.Absolute EMS, Inc., an award-winning EMS provider of turnkey contract manufacturing services, is proud to announce the successful recertification of its ISO 9001:2015 and AS9100 Rev D SAE International Aerospace Standards.
Arlon EMC Receives IPC-4101 QPL Recertification
03/20/2024 | Arlon Electronic MaterialsArlon Electronic Materials has successfully completed an intensive two-day recertification audit by IPC Validation Services that examined Arlon’s manufacturing processes and testing procedures to assure that they are in conformance to the requirements of IPC-4101E-WAM1, the Specification for Base Materials for Rigid and Multilayer Printed Boards.
Northrop Grumman Honors Suppliers for Excellence
03/14/2024 | Northrop GrummanNorthrop Grumman Corporation honored more than 70 suppliers for their outstanding contributions in 2023. In an annual recognition event, the companies included women-, minority- and veteran-owned small businesses as well as those operating in underdeveloped areas.
Cicor Acquires TT Electronics IoT Solutions
03/04/2024 | Cicor Technologies Ltd.The Cicor Group has signed an agreement to acquire TT Electronics IoT Solutions Ltd, with three production sites in the UK and China.
AEM, Texas Aerospace Technologies Bolster Partnership for Latin America
02/26/2024 | AEM Corp.Canadian avionics manufacturer, Anodyne Electronics Manufacturing Corp. (AEM), is pleased to announce a partnership expansion with Texas Aerospace Technologies, a subsidiary of Texas Aerospace Services, to add AEM’s new MTP136D modern panel-mount P25 VHF FM Forest Service radio to its lineup of product offerings for their Latin American customers.