Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

IMAPS & IPC to Host Onshoring Workshop

04/16/2024 | IPC
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.

Teledyne FLIR Defense Awarded $249M IDIQ Contract for U.S. Marine Corps Organic Precision Fires-Light Program

04/15/2024 | BUSINESS WIRE
Teledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced that it has been awarded an Indefinite Delivery/Indefinite Quantity (IDIQ) contract worth up to $249 million by the U.S. Marine Corps Systems Command for its Organic Precision Fires-Light (OPF-L) program. The initial delivery order is valued at $12 million.

TSMC Arizona, U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding

04/09/2024 | TSMC
TSMC announced that the U.S. Department of Commerce and TSMC Arizona have signed a non-binding preliminary memorandum of terms (PMT) for up to US$6.6 billion in direct funding under the CHIPS and Science Act.

U.S. Updates Advanced Semiconductor Ban, Actual Impact on the Industry Will Be Insignificant

04/09/2024 | TrendForce
On March 29th, the United States announced another round of updates to its export controls, targeting advanced computing, supercomputers, semiconductor end-uses, and semiconductor manufacturing products.

SCHMID Group Presents Breakthrough Solutions for Substrate Production at ISES USA

04/09/2024 | SCHMID Group
The SCHMID Group, a global leader in providing solutions to the high-tech electronics, photovoltaics, glass, and energy systems industries participated in the International Semiconductor Executive Summit (ISES) USA this week.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in