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PADS Paper, Part 4: QFN Components
June 3, 2015 | Mentor GraphicsEstimated reading time: Less than a minute
This paper, the fourth and final in a series downloaded by thousands of PCB designers, is dedicated to CAD library quality. It describes every aspect you need to consider when creating quad flat no-lead (QFN) component library parts.
It also describes the impact each feature has in the PCB process. To read this paper, click here.
Suggested Items
Insulectro’s Technology Village to Feature 35 Powerchats at IPC APEX EXPO
03/25/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, will present its popular and successful 13.5-minute PowerChats™ during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
Standards Development Propels the Industry Forward
03/20/2024 | Teresa Rowe, IPC Senior Director, Assembly and Standards TechnologyStandards development task groups will meet face-to-face at IPC APEX EXPO, April 6–11. The technical discussions provide an opportunity to share knowledge, learn from other subject matter experts, and network with others who have similar technical interests. You may remember the urgent need for coffee and the possibility of snagging a cookie or a granola bar to maintain the necessary energy level for these marathon sessions.
Intel, Biden Admin Announce up to $8.5 Billion in Direct Funding Under the CHIPS Act
03/20/2024 | IntelThe Biden-Harris Administration announced today that Intel and the U.S. Department of Commerce have signed a non-binding preliminary memorandum of terms (PMT) for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act.
Koh Young America Appoints Heriberto Cuevas as Sales Team Leader for Mexico and South America
03/19/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, proudly announces the appointment of Heriberto Cuevas as the Sales Team Leader for its Mexico and South America operations.
Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC
03/18/2024 | IPCDevan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry.