For more than five decades, semiconductor progress was driven primarily by transistor scaling. Moore's Law provided a predictable path for increasing transistor density, while process technology advancements consistently improved performance, power efficiency, and manufacturing cost. During this period, package development evolved alongside silicon, supporting higher pin counts, faster interfaces, and improved thermal performance, but it rarely dictated overall system capability.

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AI begins with advanced chips, but delivering AI at scale depends on an ecosystem of technologies that extends far beyond the semiconductor. In this interview, Andrew Bradner, senior vice president of Schneider Electric's cooling business, explains how AI is transforming data center design, why liquid cooling has become essential, and what these shifts mean for advanced packaging, power delivery, thermal management, and the broader electronics supply chain supporting next-generation AI infrastructure.

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Let’s start with the question engineers are increasingly asking themselves: “When should I use ceramic instead of FR-4?” It’s a fair question. FR-4 has been the backbone of electronics for decades. It’s affordable, widely available, and for many applications, it works just fine. Until it doesn’t.

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AEPC is the electronics industry’s premier technical conference for component-to-system-level integration, advanced PCB and assembly manufacturing, and next-generation electronics technologies. The Global Electronics Association invites engineers, researchers, manufacturers, and technology leaders from around the world to submit technical presentation abstracts for this distinguished event.

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