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August 23, 2026 
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A Better Way to Characterize Copper Foils for Flexible Printed Circuits, Advanced Packaging

Nolan Johnson, I-Connect007

Finite element analysis is only as accurate as the material properties behind it. Kenji Koike discusses research showing that digital image correlation produces more precise stress-strain curves and Young's modulus measurements for rolled copper foils, giving engineers greater confidence when designing flexible printed circuits and advanced packaging for demanding applications.


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More Than Moore Enabled by Advanced Packaging and Heterogeneous Integration

Chetan Arvind Patil, Marvell Technology

For more than a half-century, Moore's Law has been the defining principle of semiconductor innovation. By continually shrinking transistor dimensions, the semiconductor industry delivered exponential improvements in computing performance, energy efficiency, and integration density. Each new technology node enabled more transistors to be placed on a single die, reducing the cost per transistor and making electronic systems smaller, faster, and more capable. Though this scaling continues to advance, it is no longer the sole driver of system-level innovation, which now increasingly comes from a combination of scaling and advanced packaging.


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Advanced Electronic Packaging: The Industry's New Innovation Engine

Marcy LaRont, I-Connect007

Over the past several years, advanced packaging has moved from the back end of semiconductor manufacturing to becoming one of the electronics industry's most strategic technologies in the ecosystem. At many IEEE conferences, discussions that once centered almost exclusively on transistor scaling now devote equal attention to chiplets, heterogeneous integration, co-design, advanced substrates, thermal management, and system-level packaging.


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Below the Surface: Why Thermal Failure Is Still the No. 1 Killer in Power Electronics

Chandra Gupta

Why do power electronics fail? There’s a range of answers, from overvoltage and mechanical stress to poor assembly and environmental exposure. If you ask your favorite AI search engine for an answer, you’ll get a pretty simple response: excessive temperature leads to component degradation, material breakdown, and eventual failure. In a sense, that’s true, but it’s oversimplified and incomplete. The real issue is thermal management failure at the system level. Heat is still the number one killer, and most of the time, you don’t even realize it’s there.


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Events

Dates Event Name Location
Sept 2-4, 2026 SEMICON Taiwan 2026 Taipei, Taiwan
Sept 9-11, 2026 IEEE ESTC 2026 Helsinki, Finland
Sept 15 - 17, 2026 MEMS & Sensors Technical Congress (SEMI) USA
Sept 17-18, 2026 IPC CEMAC 2026 Shanghai, China
Sept 22-23, 2026 SEMI U – Advanced Packaging Including Heterogeneous Integration & Chiplets (training) Virtual
Sept 28 - Oct 1, 2026 IMAPS International Symposium Boston, MA, USA
Sept 28, 2026 IMAPS Symposium Professional Development Courses - Adv. packaging, hybrid bonding, chiplets, substrates, reliablity, 3D integration Boston, MA, USA
Sept 29 - 30, 2026 Global Electronics Association – Polymers in Advanced Packaging (training) Online
Sept 30 - Oct 1, 2026 First by FMD - microelectronic trends, roadmaps and strategic alignment Berlin, Germany
Oct 6-8, 2026 ASME InterPACK 2026 TBD
Oct 13-15, 2026 SEMICON Europa Munich, Germany
Oct - Nov 2026 Global Electronics Association Advanced Packaging Webinars – Packaging standards, reliability, manufacturing, interconnect technologies Online
 
 
 
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