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August 12, 2026 
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Power and Thermal Constraints in AI Accelerator Packages

Chetan Arvind Patil, Marvell Technology

For more than five decades, semiconductor progress was driven primarily by transistor scaling. Moore's Law provided a predictable path for increasing transistor density, while process technology advancements consistently improved performance, power efficiency, and manufacturing cost. During this period, package development evolved alongside silicon, supporting higher pin counts, faster interfaces, and improved thermal performance, but it rarely dictated overall system capability.


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The AI Data Center Boom: Technology, Capacity, and Society

Marcy LaRont, I-Connect007

AI begins with advanced chips, but delivering AI at scale depends on an ecosystem of technologies that extends far beyond the semiconductor. In this interview, Andrew Bradner, senior vice president of Schneider Electric's cooling business, explains how AI is transforming data center design, why liquid cooling has become essential, and what these shifts mean for advanced packaging, power delivery, thermal management, and the broader electronics supply chain supporting next-generation AI infrastructure.


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Below the Surface: Ceramic vs. PCB—When ‘Good Enough’ Becomes System Failure

Chandra Gupta

Let’s start with the question engineers are increasingly asking themselves: “When should I use ceramic instead of FR-4?” It’s a fair question. FR-4 has been the backbone of electronics for decades. It’s affordable, widely available, and for many applications, it works just fine. Until it doesn’t.


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Call for Participation Now Open for the Global Electronics Association’s Advanced Electronic Packaging Conference at APEX EXPO 2027

Global Electronics Association

AEPC is the electronics industry’s premier technical conference for component-to-system-level integration, advanced PCB and assembly manufacturing, and next-generation electronics technologies. The Global Electronics Association invites engineers, researchers, manufacturers, and technology leaders from around the world to submit technical presentation abstracts for this distinguished event.


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Events

Dates Event Name Location
Sept 2-4, 2026 SEMICON Taiwan 2026 Taipei, Taiwan
Sept 9-11, 2026 IEEE ESTC 2026 Helsinki, Finland
Sept 15 - 17, 2026 MEMS & Sensors Technical Congress (SEMI) USA
Sept 17-18, 2026 IPC CEMAC 2026 Shanghai, China
Sept 22-23, 2026 SEMI U – Advanced Packaging Including Heterogeneous Integration & Chiplets (training) Virtual
Sept 28 - Oct 1, 2026 IMAPS International Symposium Boston, MA, USA
Sept 28, 2026 IMAPS Symposium Professional Development Courses - Adv. packaging, hybrid bonding, chiplets, substrates, reliablity, 3D integration Boston, MA, USA
Sept 29 - 30, 2026 Global Electronics Association – Polymers in Advanced Packaging (training) Online
Sept 30 - Oct 1, 2026 First by FMD - microelectronic trends, roadmaps and strategic alignment Berlin, Germany
Oct 6-8, 2026 ASME InterPACK 2026 TBD
Oct 13-15, 2026 SEMICON Europa Munich, Germany
Oct - Nov 2026 Global Electronics Association Advanced Packaging Webinars – Packaging standards, reliability, manufacturing, interconnect technologies Online
 
 
 
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