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It was a beautiful Fall Day in the heart of downtown San Francisco, as I headed off to the first official day of SEMICON West 2026 on October 13th. Luckily, the beautiful, sunny and crisp Fall weather would endure throughout the week, just as the state was also seeing unprecedented storm activity, flooding and damaging wave activity on the Southern California coast, that juxtaposition in what had once been the only real tech-forward state in the U.S. not lost on me.

AI is reshaping industries, economies, and daily life at an unprecedented speed. From generative AI and autonomous systems to high-performance computing (HPC) applications in science, defense, and advanced manufacturing, the demand for computational power is accelerating exponentially. But while algorithms capture the spotlight, the true enabler of this transformation lies deeper, in the physical infrastructure that makes AI possible. Performance in the AI era is no longer defined by transistor shrink alone. It is increasingly defined by how efficient systems are integrated, interconnected, cooled, and manufactured at scale.

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