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Finite element analysis is only as accurate as the material properties behind it. Kenji Koike discusses research showing that digital image correlation produces more precise stress-strain curves and Young's modulus measurements for rolled copper foils, giving engineers greater confidence when designing flexible printed circuits and advanced packaging for demanding applications.

For more than a half-century, Moore's Law has been the defining principle of semiconductor innovation. By continually shrinking transistor dimensions, the semiconductor industry delivered exponential improvements in computing performance, energy efficiency, and integration density. Each new technology node enabled more transistors to be placed on a single die, reducing the cost per transistor and making electronic systems smaller, faster, and more capable. Though this scaling continues to advance, it is no longer the sole driver of system-level innovation, which now increasingly comes from a combination of scaling and advanced packaging.

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