Podcasts



The Companion Guide to... PCB Thermal Management

This guide offers a detailed overview of thermal management in printed circuit boards (PCBs). It starts by identifying key sources of heat, which include active components, high-power currents, high-frequency signals, and environmental factors, emphasizing the importance of effective thermal management to prevent component failures. Readers will learn about various heat dissipation solutions such as optimized layout design, thermal simulations, careful material selection, adjustments to copper thickness, the use of thermal vias, insulated metal substrates (IMS), and advanced copper coin technology. By considering thermal factors early in the PCB design process, you can achieve high-quality, reliable boards.

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EP 2:

Ryan Miller takes Nolan Johnson through strategies for managing heat that can be applied during the design planning and specification phases. Prevention means there is less to mitigate.



EP 1:

In this kickoff episode, Ryan Miller makes the case for why thermal management needs to be on the minds of the designers. But what are the main causes of excess heat in our designs today? Join us as we start by defining the problems, then turn to the array of solutions.