Welcome to I-007eBooks. Below you’ll find our comprehensive library of books written by industry experts on a variety of important topics. Peer-reviewed by topic specialists, I-007eBooks are the gold standard for technical education in the circuit board industry. Download your favorite title(s) free!
"With this book, Bob Neves provides an important update to our understanding of via testing by articulating the distinction between their reliability and robustness."
Review from Jerry Magera, Sr. Principal Engineer, RTX
"Carmichael Gugliotti’s book offers a clear and practical perspective on direct metallization for today’s innovators working to advance PCB technology."
Review from William E. Webb, Technical Director, Aster Technologies
"Even experienced test professionals will gain valuable insights and fresh perspectives from his expertise.."
Review from Jason Keeping, Celestica
"A great read on materials and processes that help electronics succeed in harsher conditions."
Review from Gary Korkala
"The Printed Circuit Assembler's Guide to... X-ray Inspection is a must read for those engaged in the radiographic inspection of electronic components. It provides a clear, concise description of the X-ray process and includes a comprehensive number of comparative images."
Review from Eric Bogatin
"If you are new to designing circuit boards for 10 Gbps and above systems, or touch any part of the PCB supply chain, get a jump up the learning curve from the experience offered in this book from a respected industry expert."
Review from Kris Moyer, Instructor, IPC
"Whether you are new to PCB design or a seasoned designer with years of experience, this DFM book is an excellent resource. It covers many important concepts and informational topics to help ensure you achieve a successful, high-quality, high-yield PCB design the first time and every time."
Review from Kevin Byrd, Principal Engineer, Intel Corporation
"This book provides an excellent overview of both the history of low-temperature solders as well as the recent progress in this exciting surface mount technology. This information will prove valuable for those actively pursuing low-temperature solder conversion of their manufacturing processes as well as those working to understand the progress and future for the low-temperature solder materials."
Review from Jason Sciberras, President, Saline Lectronics Division of Emerald Technologies
"I would recommend that any data-driven engineers focused on taking their manufacturing operations to the next level read this book."
Review from Jason Keeping, Global Process Subject Matter Expert, Celestica
"We live in a harsh world where protection is needed. Ruggedization is one of the fundamental processes that can help. This book provides a great summary of one of these key capabilities."
Review from John R. Watson, Legrand North America
"At a time when electronics are not just taking small steps but rather large leaps forward, this is an appropriate book for anyone working with PCB design. With countless and ever-changing steps involved in every design, it presents a clear understanding of the process. This book will be the go-to reference for all of our designers at Legrand North America."
Review from Gus Becerra, Principal Manufacturing Engineer, Marvell
"As fabrication and manufacturing technologies advance, it is necessary to evolve our methods to analyze and review designs. This book utilizes data-driven concepts in all aspects of the fabrication and assembly processes to improve design capabilities.
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Review from Christopher St. Mars, Process Engineer, Intervala
"This book offers an accurate look at the aspects and challenges the electronics manufacturing industry faces with regards to SMT Inspection and its surrounding technology. In-depth insight on new and exciting true 3D inspection technology is provided, with a look into the future of leveraging big data management and autonomous manufacturing for a smarter factory."
Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH
"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification.
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Review from Steve Williams
"There is something here for everyone. I highly recommend downloading this book right away!"
Review from Bob Tise, R&D Engineer, EMP Shield
"PCB design is as much art as science. While reading this book will not, itself, make you a professional PCB designer, it will help you make better decisions and trade-offs, saving time and money."
Review from Lambert Schutters, General Manager,
ESCATEC Penang
"We need the right tools to create the best design for the intended purpose. This book is a great introduction and guide on how to approach the process holistically."
Review from Jan Pedersen, Director of Technology, NCAB Group
"The importance of total thermal resistance has been an eye opener for me from being focused on one material’s thermal conductivity to understanding the total thermal behavior of a material stackup."
Review from Skyler Sopp, SI/PI Engineer, Mercury Systems
"Regardless of where you are in your stackup knowledge, I recommend downloading the book and reading it! It will be well worth your time and may just save you future headaches."
Review from Mark Thompson, Engineering Manager, Out of the Box
"I love this book. Particularly the sections on the effects of the glass weave, the history of laminate, and the difference between Dk and Effective Dk. I highly recommend this book for any designer or engineer looking to better understand laminate!"
Review from Joe O'Neil, Principal, OAA Ventures
"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."
Review from Lee Ritchey, Founder and President, Speeding Edge
"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."
Review from Marius Stepanescu, Technical Director, ICCO EMT
"The Printed Circuit Assembler's Guide to... Smart Data explains the role of data acquisition and analytics in Industry 4.0. This book provides a very good description of the main challenges of collecting and handling smart data and analyzing it in the proper way."
Review from Dan Beaulieu, President, DB Management Group
"For those who are, shall we say, 'less technical' than others, it’s refreshing—not to mention face-saving, at times—to be able to understand terms like insulated metal-clad PCBs (IMPCBs), metal-clad PCBs (MCPCBs) and mixed-technology PCBs."
Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH
"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification.
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Review from Farid Anani, VP of Operations, Computrol Inc.
"This book is a must-read for those embarking on their IIoT journey; it provides a very accurate description of preparation requirements and risks to consider and avoid, not just technologically, but also organizationally."
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Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison
"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."
Review from Alex Stepinski, vice president, GreenSource Fabrication
"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences.
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Review from Douglas Brooks, retired engineer, Ph.D.
"Mark does an outstanding job detailing what needs to be included in the handoff between the board designer and fabricator. Understanding and following his advice will lead to a smooth transition between these two functions. His new book should be required reading for every designer.
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Review from Happy Holden, Consulting Technical Editor, I-Connect007
"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."
Review from Alun Morgan, Chairman, EIPC
" A comprehensive tour through the world of thermal management. Required reading for designers and end users wishing to understand the science and practice of using insulated metal substrate materials."
Review from Mark Thompson, customer technical liaison at Prototron Circuits
"From someone who has been on the board fabrication side for over 30 years attempting to explain all these things to customers, I can say this book is a 'must-have' for anyone who wants to make sure they get their product to perform the way they want it to."
Review from Gene Garat, President, Moss Bay EDA
"Engineers new to the field as well as career veterans can all benefit from this quick read, well-illustrated with plenty of examples."
Review from Eric Bogatin
"If you care about signal integrity, you are sure to pick up a few nuggets of insight from this new eBook."
Review from Andy Kowaleski
"Martyn's book regarding the 'black art' of signal integrity in printed circuit boards hits the nail right on the head. I found his explanations to be accurate, easy to read and in enough depth to satisfy both beginners and seasoned veterans. All in all, highly recommended. And FREE is a BIG bonus."
Review from Tom Borkes, Founder, The Jefferson Project
"Mr. Fjelstad has dared to think outside the box. The result is a very readable exposition in logic, posing and answering a basic question: Why do interconnect electronics with solder? Socrates would be proud!"
Review from Eric Bogatin
"The Printed Circuit Designer's Guide to... Secrets of High-Speed PCBs, Part 1 pulls back the covers to illustrate the practical principles behind many of the confusing topics that arise in the overlap between manufacturing, materials, and signal integrity performance."
Review from Andy Shaughnessy
"This may be the single best source of info about the AS9100 certification. Easy to digest yet full of details, it’s all here: from start to finish..."