"This book covers essential design considerations to ensure PCB manufacturability. These features impact the overall PCB quality, reliability, and cost-effectiveness. Good practical size and tolerance guidelines are also provided for the designer to meet specifications while yielding the lowest cost. I recommend this for new designers, especially before formal training. Additionally, it’s suitable for school students as part of their science curriculum."

"Readers will find this book provides technical insights into the ever-evolving challenges of the assembly and reliability of low-temperature solder alloys. This second volume includes updates on fourth-generation low-temperature solders and a preview of the capabilities of ultra-low temperature (ULT) solders."

"I would recommend that any data-driven engineers focused on taking their manufacturing operations to the next level read this book."

"We live in a harsh world where protection is needed. Ruggedization is one of the fundamental processes that can help. This book provides a great summary of one of these key capabilities."

"At a time when electronics are not just taking small steps but rather large leaps forward, this is an appropriate book for anyone working with PCB design. With countless and ever-changing steps involved in every design, it presents a clear understanding of the process. This book will be the go-to reference for all of our designers at Legrand North America."

"As fabrication and manufacturing technologies advance, it is necessary to evolve our methods to analyze and review designs. This book utilizes data-driven concepts in all aspects of the fabrication and assembly processes to improve design capabilities. "

"This book offers an accurate look at the aspects and challenges the electronics manufacturing industry faces with regards to SMT Inspection and its surrounding technology. In-depth insight on new and exciting true 3D inspection technology is provided, with a look into the future of leveraging big data management and autonomous manufacturing for a smarter factory."

"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification. "

"This book is a terrific resource for both those new to flex design and those more experienced looking to streamline the design to fabrication transition."

"I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening up the hood and giving the reader that knowledge of the PC board fab process."

"This book is a must-read for everybody who wants to improve the overall design-through-manufacturing NPI phase and ultimately do more with less, the Holy Grail of any manufacturer."

"This textbook is a great addition and supplement to the first edition. It delves deeper into the science of insulated metal substrates and their useful, often overlooked, properties for proper thermal management."

"This is an excellent primer on stackup design for people who are doing high-speed PCB design. It connects the dots between signal integrity and manufacturing."

"Michael Gay’s book is a concise and detailed explanation of the critical materials that makes up a PCB. His thorough explanation will help any engineer, designer and fabricator understand the impact of the material selection in a PCB stackup. This book is truly a gift to the electronics industry and I thank him for sharing his knowledge with us."

"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."

"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."

"The Printed Circuit Assembler's Guide to... Smart Data explains the role of data acquisition and analytics in Industry 4.0. This book provides a very good description of the main challenges of collecting and handling smart data and analyzing it in the proper way."

"For those who are, shall we say, 'less technical' than others, it’s refreshing—not to mention face-saving, at times—to be able to understand terms like insulated metal-clad PCBs (IMPCBs), metal-clad PCBs (MCPCBs) and mixed-technology PCBs."

"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification. "

"This book is a must-read for those embarking on their IIoT journey; it provides a very accurate description of preparation requirements and risks to consider and avoid, not just technologically, but also organizationally." "

"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."

"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences. "

"Mark does an outstanding job detailing what needs to be included in the handoff between the board designer and fabricator. Understanding and following his advice will lead to a smooth transition between these two functions. His new book should be required reading for every designer. "

"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."

" A comprehensive tour through the world of thermal management. Required reading for designers and end users wishing to understand the science and practice of using insulated metal substrate materials."

"A very thorough how-to that informs and enhances your project's ROI. Critical for designers new to RF layout or combining multiple impedance environments."

"The Printed Circuit Designer’s Guide to… Power Integrity by Example from Mentor, A Siemens Business, explores the specific problem of via-to-via coupling through a cavity starting from the ground floor."

"I found this to be an excellent tutorial on controlled impedance transmission lines, terminations, crosstalk, differential pair design and PDN noise, and
Mentor’s virtual labs take learning to a whole new level!"

"Martyn Gaudion of Polar has taken the extremely complex topic of signal integrity and provided an easy to understand explanation of this phenomena.  I encourage everyone to download and read this engaging e-book."

"Mr. Fjelstad has dared to think outside the box. The result is a very readable exposition in logic, posing and answering a basic question: Why do interconnect electronics with solder? Socrates would be proud!"

"This book offers the greatest benefit to design and procurement people by helping them understand what can realistically be achieved in the final product."

"This may be the single best source of info about the AS9100 certification. Easy to digest yet full of details, it’s all here: from start to finish..."