Industry Resource Center
Welcome to I-007e, the industry’s educational resource center. Below, you’ll find our comprehensive library of technical white papers written by subject matter experts on various topics that impact companies in the circuit board electronics manufacturing supply chain. These resources are free to download.
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This document delves into via protection strategies in PCB production and recommends IPC-4761 Types V, VI, and VII to ensure long-term reliability. It provides advice against outdated tenting and plugging techniques, which can lead to issues like corrosion and via blow-out. Included are practical design recommendations, optimal hole size guidelines, and a clear emphasis on fully filled vias to enhance performance and durability.
This document provides guidelines for designing copper coins in PCBs, highlighting their exceptional thermal conductivity and cost-effectiveness. It includes mechanical advice, design recommendations, details on various coin types, and technical specifications for dimensions, tolerances, and attachment methods. Additionally, it addresses factory limitations and suggests consulting NCAB before initiating the design process.
These comprehensive guidelines for multilayer PCB outline both cost-effective and high-quality production. Key topics include design strategies, material specs, optimal layer counts, drilling tolerances, solder mask considerations, via hole plugging, and surface finish options. It also stresses the value of symmetrical stackups, balanced copper distribution, and early consultation with NCAB to fully leverage advanced manufacturing capabilities.
This white paper explores the key cost drivers in PCB manufacturing, breaking them down into hard costs, such as board size, layer count, and material selection, and soft costs, like specifications, lead times, and communication efficiency. It also highlights the critical role of sustainability, streamlined designs, reduced complexity, smarter material utilization, and proactive collaboration. These strategies not only help control costs and reduce waste but also support environmental responsibility—without compromising performance or reliability.
This comprehensive PCB Design Checklist ensures design accuracy and manufacturability prior to production. It covers 12 key areas: component packaging, placement, mechanical checks, technical checks, constraint rules, routing, timing design, power design, DRC checks, test pins, silkscreen, and Gerber review. Each section includes detailed sub-checks, such as verifying solder mask dimensions, component spacing, signal routing, impedance control, safety clearances, and test point alignment. Emphasis is placed on utilizing 3D models, panelizing small boards, and performing design rule checks (DRC) to catch errors. This checklist ensures a thorough review, minimizing design flaws and optimizing both functionality and production readiness.
This comprehensive guide to is aimed at avoiding 13 common PCB design mistakes, such as issues with annular rings, improper spacing between plated/non-plated holes and copper, trace width mismatches, stubs, slivers, copper-to-edge clearance, and solder mask/legend print problems. Each mistake is detailed with its associated risks alongside solutions and references IPC standards and best practices. Key recommendations include adhering to proper tolerances, maintaining correct clearances, using accurate CAD settings, and collaborating with PCB suppliers. The aim is to ensure high-reliability PCBs by addressing design flaws early, minimizing production challenges, and enhancing overall manufacturing yield and quality.
These design guidelines for flex and rigid-flex PCBs outline build capabilities, material selections, dimensional limits, and practical design tips. They strongly emphasize reliability, flexibility, and compliance with IPC standards. Key features include overlay overlap, bend area design, hole staggering, and adhesive system considerations—all aimed at achieving optimal performance in both dynamic and static applications.
These HDI PCB design guidelines focus on construction types, material specs, and smart layout strategies for microvias, skip vias, and fine-pitch BGAs. The content dives into key cost drivers and advanced design tips, balancing performance with cost-effectiveness. There is an emphasis on reliability, with best practices highlighted throughout alongside a strong recommendation to consult technical experts for tighter tolerances or high-demand applications.
