This document delves into via protection strategies in PCB production and recommends IPC-4761 Types V, VI, and VII to ensure long-term reliability. It provides advice against outdated tenting and plugging techniques, which can lead to issues like corrosion and via blow-out. Included are practical design recommendations, optimal hole size guidelines, and a clear emphasis on fully filled vias to enhance performance and durability.

This document provides guidelines for designing copper coins in PCBs, highlighting their exceptional thermal conductivity and cost-effectiveness. It includes mechanical advice, design recommendations, details on various coin types, and technical specifications for dimensions, tolerances, and attachment methods. Additionally, it addresses factory limitations and suggests consulting NCAB before initiating the design process.

These comprehensive guidelines for multilayer PCB outline both cost-effective and high-quality production. Key topics include design strategies, material specs, optimal layer counts, drilling tolerances, solder mask considerations, via hole plugging, and surface finish options. It also stresses the value of symmetrical stackups, balanced copper distribution, and early consultation with NCAB to fully leverage advanced manufacturing capabilities.

This white paper explores the key cost drivers in PCB manufacturing, breaking them down into hard costs, such as board size, layer count, and material selection, and soft costs, like specifications, lead times, and communication efficiency. It also highlights the critical role of sustainability, streamlined designs, reduced complexity, smarter material utilization, and proactive collaboration. These strategies not only help control costs and reduce waste but also support environmental responsibility—without compromising performance or reliability.