Podcasts
Podcasts
Continuing our discussion with ASC's John Johnson, we explore the pluses and minuses of copper plating microvias from the perspective of the fabricator and the designer.
Nolan Johnson and ASC's John Johnson explore the implications of UHDI on via from a designer's perspective. The metallurgy, chemistry, mechanics, and stackup reduction mean that designers have fewer constraints with UHDI.
John Johnson continues this series, outlining UHDI's contributions to reduced SWaP—size, weight and power—considerations.
American Standard Circuits' John Johnson details how the new capabilities in UHDI can fundamentally change what it means to design for manufacturability.
John Johnson leads the way straight into UHDI's benefits to RF style design.
To launch this series, ASC's Director of Quality John Johnson introduces us to ultra-high-density interconnect. Johnson sets the agenda for further discussion by sharing practical reasons why UHDI could be key to your next design challenge, and why both designers and the manufacturing chain are excited by UHDI's potential.